Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ZHEQ 6F 8MC![]() | ZHEQ 6F 8MC |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN 21AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
N5R F1 QZ3![]() | N5R F1 QZ3 |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 60 40 .025 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
UW8C-C1-21U![]() | UW8C-C1-21U |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER WIRE NO-CLEAN 63/37 4OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | 0.031" (0.79mm) | 0.022 | Spool, 113g (1/4 lb) | 361°F (183°C) | - | ||||||||||||||
KKZJ NA0Z BP![]() | KKZJ NA0Z BP |
| Leadtime 2 3 weeks | Master Appliance Co | SOLDER, COIL, LEAD FREE 6 PACK | Active | Lead Free | Solder Coil | |||||||||||||||||||||||
NP0Q G9LH IU![]() | NP0Q G9LH IU |
| Leadtime 2 3 weeks | Multicore | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
HZXXU OC4D BB![]() | HZXXU OC4D BB | Leadtime 2 3 weeks | MG Chemicals | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
6H56 JBR ZN![]() | 6H56 JBR ZN |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 | |||||||||||||||||||||
8C2 DHQ EX![]() | 8C2 DHQ EX | Leadtime 2 3 weeks | Kester Solder | SOLDER 500G JAR,SN96.5 AG3.0 | Obsolete | Lead Free | Solder Paste | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 500g 17 oz | ||||||||||||||||||||||
HC 87C I4![]() | HC 87C I4 |
| Leadtime 2 3 weeks | Kester Solder | OR 421 FLUX CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
3TN 2L0 WQO![]() | 3TN 2L0 WQO |
| Leadtime 2 3 weeks | Multicore | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
8P1N EXD 1R![]() | 8P1N EXD 1R |
| Leadtime 2 3 weeks | Kester Solder | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||
7M6I 8LHZ 14W![]() | 7M6I 8LHZ 14W |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER LF SN99 21GAUGE .25LBS | 4901 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.032 0.81mm | Spool, 113g 1 4 lb | 440°F 227°C | No Shelf Life | |||||||||||||||
RL-9X-OO | RL-9X-OO | Leadtime 2-3 weeks | Kester Solder | SOLDER SOLID WIRE 21AWG 60/40 | - | Obsolete | Leaded | Wire Solder | - | Sn60Pb40 (60/40) | 20 AWG, 21 SWG | 0.031" (0.79mm) | - | Spool, 454g (1 lb) | - | - | |||||||||||||||
BH-02MW-B9P![]() | BH-02MW-B9P |
| Leadtime 2-3 weeks | Multicore | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
A8S0 S4I K6![]() | A8S0 S4I K6 |
| Leadtime 2 3 weeks | Multicore | 97CU3 ARAX 4C 3.25MM 10KG AM | * | Active | ||||||||||||||||||||||||
F4U Q02 54![]() | F4U Q02 54 |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
LZ 4R 73M![]() | LZ 4R 73M | Leadtime 2 3 weeks | Kester Solder | SOLDER RA FLUX 21AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
2VPMY SR PCO![]() | 2VPMY SR PCO |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE WATER SOL 10CC | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
RP-XMW-GA![]() | RP-XMW-GA |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE NO CLEAN 63/37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Syringe, 100g (3.5 oz) | 361°F (183°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
3KD-0K7-KA8 | 3KD-0K7-KA8 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
8260U-22-W20![]() | 8260U-22-W20 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 250g (9 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
JWE-ZE-D1![]() | JWE-ZE-D1 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .020 24AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3/0.7 | 24 AWG, 25 SWG | 0.02" 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
44D-MA-IN![]() | 44D-MA-IN |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE NO CLEAN 63/37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Syringe, 100g (3.5 oz) | 361°F (183°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||||||||||
ZON-86-SGU![]() | ZON-86-SGU |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER WIRE NO-CLEAN 63/37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | 0.031" (0.79mm) | 0.022 | Spool, 28g (1 oz) | 361°F (183°C) | - | ||||||||||||||
38Q-EK-68F![]() | 38Q-EK-68F | Leadtime 2-3 weeks | Easy Braid Co. | SOLDER NO-CLEAN ANTISTAT .020"" | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | 0.02" (0.51mm) | 0.022 | - | 361°F (183°C) | No Shelf Life |