ManufacturerSeriesPart StatusProcessTypeFlux TypeCompositionWire GaugeDiameterCore SizeFormMelting PointShelf Life
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Series
Part Status
Process
Type
Flux Type
Composition
Wire Gauge
Diameter
Core Size
Form
Melting Point
Shelf Life
RUA13 N0E VS
RUA13 N0E VS
1+29.3627
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER PASTE WATER SOL T5 10CC ActiveLeadedSolder PasteWater SolubleSn63Pb37 63 37 Syringe, 10cc, 35g 1.2 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
H6NTP-OVM-GBW
H6NTP-OVM-GBW
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER SPHERES SAC305 .020 DIAM*Active000000000-
KRG 2393 VK
KRG 2393 VK
25+30.4667
Increments of 25
Leadtime
2 3 weeks		Kester SolderSOLDER 63 37 11AWG 1LBSolid Core WireActiveLeadedWire Solder Sn63Pb37 63 37 0.125 3.18mm Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
G7-MSP-J3
G7-MSP-J3
1+38.1863
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SLD PASTE LF WATER SOL T5 10CC ActiveLead FreeSolder PasteWater SolubleSn96.5Ag3.0Cu0.5 96.5 3 0.5 Syringe, 10cc, 35g 1.2 oz 423 ~ 428°F 217 ~ 220°C 6 Months Date of Manufacture Refrigerated
OI RUJ V4
OI RUJ V4
Leadtime
2 3 weeks		Easy Braid Co.SOLDER NO CLEAN .031 X 20 ObsoleteLeadedWire SolderNo CleanSn63Pb37 63 37 20 AWG, 21 SWG0.031 0.79mm 0.022 361°F 183°C No Shelf Life
WRM W509 03T
WRM W509 03T
150+33.9265
Increments of 150
Leadtime
2 3 weeks		Kester SolderSOLDER BAR 60 40 1.66LBE BarActiveLeadedBar Solder Sn60Pb40 60 40 Bar, 750g 1 2 3 lbs 361 ~ 374°F 183 ~ 190°C No Shelf Life
Q4AA OG RW
Q4AA OG RW
1+90.098
Increments of 1
Leadtime
2 3 weeks		LOCTITELOCTITE GC 10 SAC305T3 885 52ULOCTITE® GC 10ActiveLead FreeSolder PasteNo CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 Jar, 500g 17 oz 423 ~ 428°F 217 ~ 220°C 12 Months Date of Manufacture
Z20 UC BTW
Z20 UC BTW
1+35.1275
5+34.4118
10+31.5441
25+25.8086
50+24.3747
Increments of 1
Leadtime
2 3 weeks		Multicore63 37 CRYSL 502 3% .032DIA 21SWGC502ActiveLeadedWire SolderNo CleanSn63Pb37 63 37 20 AWG, 21 SWG0.032 0.81mm 0.033Spool, 454g 1 lb 361°F 183°C No Shelf Life
5J7X4-JZ4-0YD
5J7X4-JZ4-0YD
1+82.3039
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE LOW TEMP T4 250G-ActiveLead FreeSolder PasteNo-CleanSn42Bi57.6Ag0.4 42 57.6 0.4 ---Jar, 250g 9 oz 281°F 138°C 6 Months Date of Manufacture Refrigerated
9I6-09O-VA
9I6-09O-VA
1+11.3235
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SLD WIRE NO-CLEAN 96.5 3 .5 2OZ.-ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 20 AWG, 21 SWG0.031 0.79mm 0.022Spool, 57g 2 oz 423 ~ 428°F 217 ~ 220°C -
RW-1PZ-4N2
RW-1PZ-4N2
1+77.402
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER SPHERES 63 37 .030 DIAMSMD2ActiveLeadedSolder Sphere Sn63Pb37 63 37
L9-SSJ-IW6
L9-SSJ-IW6
1+109.196
5+96.198
10+83.1971
25+77.9977
50+72.7978
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER WATER SOL .020 25AWG 1LB331ActiveLead FreeWire SolderWater SolubleSn96.5Ag3.0Cu0.5 96.5 3 0.5 24 AWG, 25 SWG0.02 0.51mm 0.033Spool, 454g 1 lb 423 ~ 428°F 217 ~ 220°C 36 Months Date of Manufacture
R9FMI A70F RE
R9FMI A70F RE
1+177.059
5+155.98
10+134.902
25+126.471
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER PASTE SN42 BI57.6 AG0.4 L ActiveLead FreeSolder PasteNo CleanSn42Bi57.6Ag0.4 42 57.6 0.4 Jar, 250g 9 oz 281°F 138°C 6 Months Date of Manufacture Refrigerated
43IG-0NL-9XC
43IG-0NL-9XC
100+50.0029
Increments of 100
Leadtime
2-3 weeks		Multicore96S ARAX 4C 1.6MM 0.5KG AM*Active----------
2U6 PH EHA
2U6 PH EHA
1+106.618
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER PASTE NO CLEAN SAC305 T3 ActiveLead FreeSolder PasteNo CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 423 ~ 428°F 217 ~ 220°C 6 Months Date of Manufacture Refrigerated
01SF9 HT GV
01SF9 HT GV
1+116.833
Increments of 1
Leadtime
2 3 weeks		LOCTITELOCTITE GC 10 SAC305T4 885 53ULOCTITE® GC 10ActiveLead FreeSolder PasteNo CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 Cartridge, 600g 21 oz 423 ~ 428°F 217 ~ 220°C 12 Months Date of Manufacture
BTJ3H-6M-TJY
BTJ3H-6M-TJY
25+71.1373
Increments of 25
Leadtime
2-3 weeks		Kester SolderOR-421 FLUX-CORED WIRESN99.3CU.7OR421ActiveLead FreeWire SolderWater SolubleSn99.3Cu0.7 99.3 0.7 14 AWG, 16 SWG0.062 1.57mm 0.022Spool, 454g 1 lb 440°F 227°C 36 Months Date of Manufacture
FN KDY HE
FN KDY HE
1+109.549
5+97.898
10+79.25
25+74.5882
50+69.9265
Increments of 1
Leadtime
2 3 weeks		Kester SolderSOLDER RA .025 23AWG 1LB48ActiveLead FreeWire SolderRosin Activated RA Sn96.5Ag3.0Cu0.5 96.5 3 0.5 23 AWG, 24 SWG0.025 0.64mm 0.033Spool, 454g 1 lb 423 ~ 428°F 217 ~ 220°C 36 Months Date of Manufacture
O1S9-TOI-G1
O1S9-TOI-G1
2+44.3774
Increments of 2
Leadtime
2 3 weeks		MG ChemicalsSOLDER WIRE4880ActiveLeadedWire SolderWater SolubleSn63Pb37 63 37 22 AWG, 23 SWG0.032 0.81mm 0.033Spool, 454g 1 lb 361°F 183°C No Shelf Life
Z3M VR 35U
Z3M VR 35U
1+28.4902
5+27.9059
10+25.5804
25+20.9294
50+19.7667
Increments of 1
Leadtime
2 3 weeks		MG ChemicalsSOLDER RA 63 37 .032 1 2 LBS4880ActiveLeadedWire SolderRosin Activated RA Sn63Pb37 63 37 20 AWG, 21 SWG0.032 0.81mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
7J-TY-4FB
7J-TY-4FB
1+58.7059
5+56.2608
10+46.4755
25+41.5835
50+39.1373
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER LF SAC305 NO CLEAN*Active----------
MOJ9 3X TCR
MOJ9 3X TCR
1+38.1863
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SLD PASTE LF WATER SOL T5 10CC ActiveLead FreeSolder PasteWater SolubleSn96.5Ag3.0Cu0.5 96.5 3 0.5 Syringe, 10cc, 35g 1.2 oz 423 ~ 428°F 217 ~ 220°C 6 Months Date of Manufacture Refrigerated
NIF VVD SR7
NIF VVD SR7
1+107.137
5+95.7353
10+77.5
25+72.9412
50+68.3824
Increments of 1
Leadtime
2 3 weeks		MG ChemicalsSOLDER LF SAC305 NO CLEAN*Active
4ME-Q93-ALQ
4ME-Q93-ALQ
1+42.9902
5+41.202
10+34.0363
25+30.4533
50+28.662
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER NO-CLEAN 18AWG 63 37 1LB245ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 16 AWG, 18 SWG0.05 1.27mm 0.011Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
5VC2A NZ5 Y9
5VC2A NZ5 Y9
40+14.0806
Increments of 40
Leadtime
2 3 weeks		Multicore63 37 381 5C 0.56MM 0.25KG AM*Active