Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
71 24OC ZDB![]() | 71 24OC ZDB |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
GT 361M KL![]() | GT 361M KL |
| Leadtime 2 3 weeks | Multicore | 60 40 C511 5C 1.22MM 0.5KG.048 | * | Active | ||||||||||||||||||||||||
JY CHR SHC![]() | JY CHR SHC |
| Leadtime 2 3 weeks | Chemtronics | POCKET SOLDER LEAD FREE SAC 305 | SMD2 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
FK T5FD RV![]() | FK T5FD RV |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE WATER SOL T5 10CC | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
C6TP8-3AL-SJ![]() | C6TP8-3AL-SJ |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO CLEAN T5 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
K9 HY 5P1![]() | K9 HY 5P1 |
| Leadtime 2 3 weeks | Multicore | HMP 366 3% .050DIA. 18SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
22GLZ-YLMI-A0X![]() | 22GLZ-YLMI-A0X |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
QGL-LZ-63![]() | QGL-LZ-63 |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 10 SAC305T3 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Cartridge, 600g 21 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
KNX-Y4-1IF | KNX-Y4-1IF |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
1638D HRC Y3A![]() | 1638D HRC Y3A |
| Leadtime 2 3 weeks | Chip Quik Inc. | SLD WIRE NO CLEAN 96.5 3 .5 1OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 28g 1 oz | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
2K0ZB QX5 GTX![]() | 2K0ZB QX5 GTX | Leadtime 2 3 weeks | Kester Solder | SOLDER RA FLUX 23AWG 60 40 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
19 8EY 85![]() | 19 8EY 85 |
| Leadtime 2 3 weeks | Multicore | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
GI JW U5![]() | GI JW U5 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER RA 21AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
O46 R326 37M![]() | O46 R326 37M | Leadtime 2 3 weeks | Kester Solder | SOLDER SOLID WIRE 25AWG 60 40 | Obsolete | Leaded | Wire Solder | Sn60Pb40 60 40 | 24 AWG, 25 SWG | 0.02 0.51mm | Spool, 454g 1 lb | ||||||||||||||||||||
NHD-QX1X-7N![]() | NHD-QX1X-7N |
| Leadtime 2-3 weeks | Multicore | 63 37 CRYSL 502 2% .022DIA 24SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
XD0L H49 3WM![]() | XD0L H49 3WM |
| Leadtime 2 3 weeks | Multicore | 97SC 400 2% .064DIA 16SWG | C400 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
QU-RG-D6![]() | QU-RG-D6 |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 10 SAC305T4 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
QXD 66 5K7![]() | QXD 66 5K7 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .015 28AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
UZ63-6SZY-466![]() | UZ63-6SZY-466 |
| Leadtime 2-3 weeks | Chemtronics | POCKET SOLDER LEAD-FREE SAC 305 | SMD2 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
TMA-8VC-EG | TMA-8VC-EG |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOL .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
1T OJP7 T0![]() | 1T OJP7 T0 |
| Leadtime 2 3 weeks | Micro Measurements Division of Vishay Precision Group | 450 20R SOLDER TIN ANTIMONY, 1 P | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn95Sb5 95 5 | 24 AWG, 25 SWG | 0.02 0.51mm | Spool, 454g 1 lb | 450 ~ 460°F 232 ~ 238°C | |||||||||||||||||
6ZQJT ZM7Q X8E![]() | 6ZQJT ZM7Q X8E | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN ANTISTAT .020 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
D9-OWN-58H![]() | D9-OWN-58H |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN99 21GAUGE 1LBS | 4901 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 454g 1 lb | 440°F 227°C | No Shelf Life | ||||||||||||||
PEW8T 30NY A8![]() | PEW8T 30NY A8 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN .020 25AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
V3BE3-5V-OS![]() | V3BE3-5V-OS |
| Leadtime 2-3 weeks | Multicore | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life |