Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
8DRO-3A-ZP0![]() | 8DRO-3A-ZP0 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .015 28AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
92LOY-BY-NVW | 92LOY-BY-NVW |
| Leadtime 2-3 weeks | Multicore | 97SC HYDRO-X 2% .064DIA 16SWG | Hydro-X | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
9LON QP 26 | 9LON QP 26 |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
T2E-YZQ0-WS7 | T2E-YZQ0-WS7 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SN42 BI57.6 AG0.4 2-PART MIX 60G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | - | 281°F 138°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
UROC1 77C BG![]() | UROC1 77C BG | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
C8J0 893E YBZ![]() | C8J0 893E YBZ |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .020 24AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
3DR17 SP2N QQ![]() | 3DR17 SP2N QQ |
| Leadtime 2 3 weeks | Multicore | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
LZFI S7 TC![]() | LZFI S7 TC |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER LF SN96 21GAUGE .5LBS | 4900 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
B4H-J91H-SJ![]() | B4H-J91H-SJ |
| Leadtime 2-3 weeks | Aven Tools | SOLDER 1MM 100G | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Spool, 100g 3.5 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
WKM4D-64-7VH![]() | WKM4D-64-7VH |
| Leadtime 2-3 weeks | Multicore | MP218 RWF | MP218 | Active | Leaded | Solder Paste | No-Clean | - | - | - | - | - | - | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
YJ23 ZJI C51![]() | YJ23 ZJI C51 |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 250G T5 | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
3H7-0R-F1M![]() | 3H7-0R-F1M |
| Leadtime 2-3 weeks | Kester Solder | SOLDER NO-CLEAN 21AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
DQ YYX W0W![]() | DQ YYX W0W | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
LR 2B 7G![]() | LR 2B 7G |
| Leadtime 2 3 weeks | Multicore | HMP 366 3% .050DIA. 18SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
H5P-HC-42![]() | H5P-HC-42 |
| Leadtime 2-3 weeks | Multicore | 63 37 400 2% .024DIA 23SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.024 0.61mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
GP FS XG![]() | GP FS XG |
| Leadtime 2 3 weeks | Kester Solder | SOLDER RA FLUX 16AWG 60 40 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
NOZAF-FHJZ-1HZ![]() | NOZAF-FHJZ-1HZ |
| Leadtime 2-3 weeks | Kester Solder | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
927E XQ4 7Y | 927E XQ4 7Y |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
BJ-8H-N4![]() | BJ-8H-N4 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 63 37 21AWG 1LB | 275 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
8E7EL-AQ3-RIA![]() | 8E7EL-AQ3-RIA |
| Leadtime 2 3 weeks | Multicore | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
DTQ0Z E9XE 5W6 | DTQ0Z E9XE 5W6 |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
NK-WMKT-2P![]() | NK-WMKT-2P |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLD WIRE NO-CLEAN 96.5 3 .5 1OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
SDCN AH TGZ![]() | SDCN AH TGZ | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN ANTISTAT .020 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
48E-CNNF-JU1![]() | 48E-CNNF-JU1 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
UR-FTEH-6XO![]() | UR-FTEH-6XO | Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 21AWG 60 40 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture |