ManufacturerSeriesPart StatusProcessTypeFlux TypeCompositionWire GaugeDiameterCore SizeFormMelting PointShelf Life
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Series
Part Status
Process
Type
Flux Type
Composition
Wire Gauge
Diameter
Core Size
Form
Melting Point
Shelf Life
3U48-SU-V7
3U48-SU-V7
1+4.93137
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER WIRE NO-CLEAN 63 37 1OZ.-ActiveLeadedWire SolderNo-Clean, Water SolubleSn63Pb37 63 37 24 AWG, 25 SWG0.02 0.51mm 0.022Spool, 28g 1 oz 361°F 183°C -
FI1UC-KO-M9
FI1UC-KO-M9
Leadtime
2-3 weeks		MG ChemicalsSOLDER 63 37 NOCLEAN .04DIA .5LB4860ObsoleteLeadedWire SolderNo-CleanSn63Pb37 63 37 18 AWG, 19 SWG0.04 1.02mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
QC-ZJ-L3
QC-ZJ-L3
1+10.402
Increments of 1
Leadtime
2 3 weeks		Master Appliance CoSOLDER, COIL, LEAD FREE 6 PACK ActiveLead FreeSolder Coil
3HS-GOV-YHB
3HS-GOV-YHB
25+43.5137
Increments of 25
Leadtime
2 3 weeks		Kester SolderSOLDER 66 .031 22AWG 1LB275ActiveLead FreeWire SolderNo CleanSn99.3Cu0.7 99.3 0.7 20 AWG, 21 SWG0.031 0.79mm 0.033Spool, 454g 1 lb 440°F 227°C 36 Months Date of Manufacture
ZFG G1BC P6
ZFG G1BC P6
1+103.559
5+92.5431
10+74.9157
25+70.5094
50+66.1024
Increments of 1
Leadtime
2 3 weeks		Kester SolderSOLDER NO CLEAN .062 16AWG 1LB275ActiveLead FreeWire SolderNo CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 14 AWG, 16 SWG0.062 1.57mm 0.022Spool, 454g 1 lb 423 ~ 428°F 217 ~ 220°C 36 Months Date of Manufacture
PP3VP EUJS MF
PP3VP EUJS MF
1+49.951
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SLDR PST NO CLEAN 63 37 T4 250G ActiveLeadedSolder PasteNo CleanSn63Pb37 63 37 Jar, 250g 9 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
85 TRGK 86
85 TRGK 86
25+30.1333
Increments of 25
Leadtime
2 3 weeks		Kester SolderSOLDER SOLID WIRE 16AWG 60 40 ActiveLeadedWire Solder Sn60Pb40 60 40 14 AWG, 16 SWG0.062 1.57mm Spool, 454g 1 lb
BXK-PR-7RR
BXK-PR-7RR
Leadtime
2-3 weeks		MG ChemicalsSOLDER 63 37 NOCLEAN .04DIA .5LB4860ObsoleteLeadedWire SolderNo-CleanSn63Pb37 63 37 18 AWG, 19 SWG0.04 1.02mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
UYQM-MFZ-X3L
UYQM-MFZ-X3L
25+46.4784
Increments of 25
Leadtime
2 3 weeks		Kester SolderSOLDER 66 .025 23AWG 1LB275ActiveLead FreeWire SolderNo CleanSn99.3Cu0.7 99.3 0.7 22 AWG, 23 SWG0.025 0.64mm 0.033Spool, 454g 1 lb 440°F 227°C 36 Months Date of Manufacture
NJ QV 1S0
NJ QV 1S0
1+29.3627
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER PASTE WATER SOL T5 10CC ActiveLeadedSolder PasteWater SolubleSn63Pb37 63 37 Syringe, 10cc, 35g 1.2 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
6Z0-CA-AG8
6Z0-CA-AG8
1+41.1275
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER PASTE SN63 PB37 250G ActiveLeadedSolder PasteNo CleanSn63Pb37 63 37 Jar, 250g 9 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
T5N WOS2 6I
T5N WOS2 6I
1+27.9216
5+27.3529
10+25.0735
25+20.5149
50+19.3751
Increments of 1
Leadtime
2 3 weeks		MulticoreHMP 366 3% .050DIA. 18SWG366ActiveLeadedWire SolderRosin Activated RA Pb93.5Sn5Ag1.5 93.5 5 1.5 16 AWG, 18 SWG0.05 1.27mm 0.033Spool, 454g 1 lb 565 ~ 574°F 296 ~ 301°C No Shelf Life
WVJ 8SZ BZ
WVJ 8SZ BZ
20+50.0118
Increments of 20
Leadtime
2 3 weeks		Multicore97SC C502 3C 0.81MM 0.5KG AMC502Active Wire SolderNo Clean 361°F 183°C No Shelf Life
QM-3K-XZV
QM-3K-XZV
1+77.402
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER SPHERES 63 37 .030 DIAMSMD2ActiveLeadedSolder Sphere-Sn63Pb37 63 37 ------
RB-JR87-2DU
RB-JR87-2DU
50+45.5441
Increments of 50
Leadtime
2-3 weeks		Kester SolderSOLDERPASTE NO CLEAN 63 37 100GMR276ActiveLeadedSolder PasteNo-CleanSn63Pb37 63 37 ---Syringe, 100g 3.5 oz 361°F 183°C 6 Months Date of Manufacture Refrigerated
RWPZ QEP 7K
RWPZ QEP 7K
1+11.3235
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SLD WIRE NO CLEAN 96.5 3 .5 2OZ. ActiveLead FreeWire SolderNo CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 20 AWG, 21 SWG0.031 0.79mm 0.022Spool, 57g 2 oz 423 ~ 428°F 217 ~ 220°C
QSD-HUR-6EP
QSD-HUR-6EP
40+31.2426
Increments of 40
Leadtime
2-3 weeks		Multicore96SC C400 3C 0.56MM 0.25KG.022 *Active----------
RE H7YJ 7MF
RE H7YJ 7MF
25+42.2902
Increments of 25
Leadtime
2 3 weeks		Kester SolderSOLDER 66 .050 18AWG 1LB275ActiveLead FreeWire SolderNo CleanSn99.3Cu0.7 99.3 0.7 16 AWG, 18 SWG0.05 1.27mm 0.033Spool, 454g 1 lb 440°F 227°C 36 Months Date of Manufacture
FQEP EBS FO7
FQEP EBS FO7
1+29.3627
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER PASTE WATER SOL T5 10CC ActiveLeadedSolder PasteWater SolubleSn63Pb37 63 37 Syringe, 10cc, 35g 1.2 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
OLO-A8-PT
OLO-A8-PT
1+7.55882
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SLD WIRE NO-CLEAN 96.5 3 .5 1OZ.-ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 24 AWG, 25 SWG0.02 0.51mm 0.022Spool, 28g 1 oz 423 ~ 428°F 217 ~ 220°C -
VYG1X-ZF-YJH
VYG1X-ZF-YJH
20+28.0583
Increments of 20
Leadtime
2-3 weeks		Multicore60 40 370 5C 1.22MM 0.5KG AM*Active----------
9N8-RC-U0
9N8-RC-U0
1+40.2059
5+38.5353
10+31.8324
25+28.482
50+26.8067
Increments of 1
Leadtime
2-3 weeks		Multicore97SC C511 2% .022DIA 23AWG 24SWGC511™ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 23 AWG, 24 SWG0.022 0.56mm 0.022Spool, 227g 1 2 lb 423 ~ 428°F 217 ~ 220°C No Shelf Life
F1R TOU 514
F1R TOU 514
1+77.402
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER SPHERES 63 37 .030 DIAMSMD2ActiveLeadedSolder Sphere Sn63Pb37 63 37
XZ-K8-6W7
XZ-K8-6W7
Leadtime
2-3 weeks		MG ChemicalsSOLDER 63 37 NOCLEAN .04DIA .5LB4860ObsoleteLeadedWire SolderNo-CleanSn63Pb37 63 37 18 AWG, 19 SWG0.04 1.02mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
3LY2R EN 98
3LY2R EN 98
Leadtime
2 3 weeks		Easy Braid Co.SOLDER NO CLEAN ANTISTAT .031 ObsoleteLeadedWire SolderNo CleanSn63Pb37 63 37 20 AWG, 21 SWG0.031 0.79mm 0.022 361°F 183°C No Shelf Life