Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
54-J58C-K1J![]() | 54-J58C-K1J |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN96 21GAUGE 1LB | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
BWSDM-KBW-R0![]() | BWSDM-KBW-R0 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA 60 40 25AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
2J-NN1-LV![]() | 2J-NN1-LV | Leadtime 2-3 weeks | Easy Braid Co. | SOLDER NO-CLEAN ANTISTAT .020 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
3WO4B-6T-RA![]() | 3WO4B-6T-RA |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||||
26I 8F A1T![]() | 26I 8F A1T |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||||
UZ 5R7D M1![]() | UZ 5R7D M1 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .050 18AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
FEF0N-UQ-UUP | FEF0N-UQ-UUP |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
FO-069S-9K![]() | FO-069S-9K |
| Leadtime 2 3 weeks | Kester Solder | SOLDER SOLID WIRE 16AWG 60 40 | Active | Leaded | Wire Solder | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | Spool, 454g 1 lb | |||||||||||||||||||
6M XB 3L![]() | 6M XB 3L |
| Leadtime 2 3 weeks | MG Chemicals | LEAD FREE NO CLEAN SOLDER PASTE | 4900 | Active | Lead Free | Solder Paste | No Clean | Sn96.3Ag3.0Cu0.7 96.3 3 0.7 | Syringe, 25g 0.9 oz | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||||
ESJ4-BL2-8R | ESJ4-BL2-8R |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
Y8 AF EGG![]() | Y8 AF EGG |
| Leadtime 2 3 weeks | Multicore | 60 40 370 5C 1.22MM 0.5KG AM | * | Active | ||||||||||||||||||||||||
PUFQ JC W6![]() | PUFQ JC W6 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
9Z-68-K4![]() | 9Z-68-K4 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER RA FLUX 16AWG 60 40 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
37 E04U G4O![]() | 37 E04U G4O |
| Leadtime 2 3 weeks | Multicore | 96SC C511 3C 1.02MM 0.5KG .040 | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
ICL8-B5U-EFG![]() | ICL8-B5U-EFG |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 23AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
1TE MU ZFH | 1TE MU ZFH |
| Leadtime 2 3 weeks | Kester Solder | SOLDER RA 19AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
12A-IJLZ-AEI | 12A-IJLZ-AEI |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
0P7SW RJED XJG![]() | 0P7SW RJED XJG |
| Leadtime 2 3 weeks | Multicore | 96SC C502 5C 0.38MM 0.25KG.015 | C502 | Active | Wire Solder | No Clean | No Shelf Life | |||||||||||||||||||||
KXYG9 AJ W9K![]() | KXYG9 AJ W9K |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
S4TD1-H8N5-CN![]() | S4TD1-H8N5-CN |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 63 37 21AWG 1LB | 275 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
JMX-EK42-QY![]() | JMX-EK42-QY |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LOW TEMP 5CC W TIP | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Syringe, 15g 0.5 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
DC57-W3LL-P9![]() | DC57-W3LL-P9 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER RA FLUX 23AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
XMCJE-HD-PJ | XMCJE-HD-PJ |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
8M YKYG IM![]() | 8M YKYG IM |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 T5 500G | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
820X Q8 Q1![]() | 820X Q8 Q1 |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE NO CLEAN 10CC SYR | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated |