Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
B8Z2-ET-RS![]() | B8Z2-ET-RS |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST NO-CLEAN SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
9O9K-49H1-24T![]() | 9O9K-49H1-24T |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
FA-WA65-5E5![]() | FA-WA65-5E5 |
| Leadtime 2 3 weeks | Multicore | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
857Z-P1X-L7![]() | 857Z-P1X-L7 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER SOLID WIRE 16AWG 63 37 | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | - | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
S0T1C-UW-9G | S0T1C-UW-9G |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN 18AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
F26-1ZG-6C8![]() | F26-1ZG-6C8 |
| Leadtime 2-3 weeks | Multicore | 63 37 370 3% .032DIA 21SWG | 370 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
322VR-1HQ-O47 | 322VR-1HQ-O47 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER NO-CLEAN .025 23AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
FS-QO-0Y![]() | FS-QO-0Y |
| Leadtime 2 3 weeks | Multicore | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
E7-UZ-YDF![]() | E7-UZ-YDF | Leadtime 2-3 weeks | MG Chemicals | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
II-AC3-WV![]() | II-AC3-WV |
| Leadtime 2 3 weeks | Kester Solder | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
UIH-6RLN-GK![]() | UIH-6RLN-GK |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 63 37 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
Z3-D77T-LI | Z3-D77T-LI |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
TX952-FP-M9![]() | TX952-FP-M9 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 63 37 25AWG 1LB | 285 | Active | Leaded | Wire Solder | Rosin Mildly Activated RMA | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
4GQB-XUL-UQ![]() | 4GQB-XUL-UQ |
| Leadtime 2-3 weeks | Kester Solder | SOLDER BAR 60 40 1.66LB | E-Bar | Active | Leaded | Bar Solder | - | Sn60Pb40 60 40 | - | - | - | Bar, 750g 1 2 3 lbs | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
NQ-V7-RNI | NQ-V7-RNI |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
DAJSK-FX8-JF0![]() | DAJSK-FX8-JF0 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 10CC SYR | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
2T-C85Y-JSK![]() | 2T-C85Y-JSK |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
5GUU-F4X-P7![]() | 5GUU-F4X-P7 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE TWO PART MIX | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 15g 0.5 oz | 423 ~ 428°F 217 ~ 220°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
EQDW-HC1L-MG1![]() | EQDW-HC1L-MG1 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLD WIRE NO-CLEAN 96.5 3 .5 2OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
RJK-8YG-1RQ![]() | RJK-8YG-1RQ |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
ZRKT2-TG-RS![]() | ZRKT2-TG-RS |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
Z2-DCD1-25![]() | Z2-DCD1-25 | Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 DIAMETER 2 | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
H8-B5KW-WM | H8-B5KW-WM |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
D0MA-58TS-2VL![]() | D0MA-58TS-2VL |
| Leadtime 2 3 weeks | Multicore | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
0H5-GE-H0![]() | 0H5-GE-H0 |
| Leadtime 2-3 weeks | Multicore | SN62 C502 5C 1.02MM 0.5KG .040 | C502 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life |