Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
KZB5-I3Z-RK![]() | KZB5-I3Z-RK | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
HQG-1T4-58![]() | HQG-1T4-58 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 63 37 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
DT7-SUA-JK![]() | DT7-SUA-JK |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER NO-CLEAN 63 37 POCKET PK | 4860 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Tube, 18g 0.6 oz | 361°F 183°C | No Shelf Life | ||||||||||||||
XUYS-YW-0V![]() | XUYS-YW-0V |
| Leadtime 2 3 weeks | Multicore | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
4T1EP-F6A-NK![]() | 4T1EP-F6A-NK |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST NO-CLEAN 63 37 T4 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
OWN4-8S-JL![]() | OWN4-8S-JL |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 58 .015 28AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
6G9DR-BM-31A![]() | 6G9DR-BM-31A |
| Leadtime 2-3 weeks | Multicore | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
LJ10-DBF-SW![]() | LJ10-DBF-SW |
| Leadtime 2-3 weeks | Multicore | 63 37 400 1% .032DIA 21SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
PP4-V70-6JB![]() | PP4-V70-6JB |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .032 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
UW7-DE9Z-U7![]() | UW7-DE9Z-U7 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST NO-CLEAN SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
M42W-GYQA-UZU | M42W-GYQA-UZU |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLD WIRE NO-CLEAN 96.5 3 .5 4OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
TTK-PVYA-G5S![]() | TTK-PVYA-G5S |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LOW TEMP T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Syringe, 15g 0.5 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
5ME-SY-VLG | 5ME-SY-VLG |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
F1X-RGFK-KH1![]() | F1X-RGFK-KH1 | Leadtime 2-3 weeks | Kester Solder | SOLDER SOLID WIRE 25AWG 60 40 | - | Obsolete | Leaded | Wire Solder | - | Sn60Pb40 60 40 | 24 AWG, 25 SWG | 0.02 0.51mm | - | Spool, 454g 1 lb | - | - | |||||||||||||||
YK0ND-CLT4-WSL![]() | YK0ND-CLT4-WSL |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
B6-8P-JKV![]() | B6-8P-JKV |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA 60 40 25AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
BVD-734S-GU![]() | BVD-734S-GU |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
BI4W-8B-OZ![]() | BI4W-8B-OZ |
| Leadtime 2-3 weeks | Multicore | 99C C511 3C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
X3EL-TGPL-S5![]() | X3EL-TGPL-S5 |
| Leadtime 2-3 weeks | Multicore | 97SC C502 3C 0.56MM 0.25KG AM | C502 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | 361°F 183°C | No Shelf Life | ||||||||||||||
38UDI-M3-AC![]() | 38UDI-M3-AC | Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 21AWG 60 40 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
T3-EJZ-PS![]() | T3-EJZ-PS |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 63 37 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
EE-JCU-HFH![]() | EE-JCU-HFH |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
F7TM-FDK-Y3A![]() | F7TM-FDK-Y3A |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN .062 16AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
2V-E7VG-MY![]() | 2V-E7VG-MY |
| Leadtime 2-3 weeks | Multicore | 99C C511 3C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
QB1O-DRX4-KY![]() | QB1O-DRX4-KY |
| Leadtime 2-3 weeks | Multicore | 97SC C511 2% .022DIA 23AWG 24SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life |