Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IZZV-MD2Z-K3I![]() | IZZV-MD2Z-K3I |
| Leadtime 2-3 weeks | Multicore | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
HAV-6P-TA9![]() | HAV-6P-TA9 |
| Leadtime 2-3 weeks | MG Chemicals | LEADED NO CLEAN SOLDER PASTE | 4860 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 35g 1.18 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
2A-0KC5-G2M![]() | 2A-0KC5-G2M | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
83-C4V-C2![]() | 83-C4V-C2 |
| Leadtime 2 3 weeks | Multicore | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
X4C9I-B0-75B![]() | X4C9I-B0-75B |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
LR21S-1CO-7J![]() | LR21S-1CO-7J |
| Leadtime 2-3 weeks | Kester Solder | SOLDER NO-CLEAN 25AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
6FPAS-D6Y-63![]() | 6FPAS-D6Y-63 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LOW TEMP 5CC W TIP | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Syringe, 15g 0.5 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
PSZ-2W-NCH | PSZ-2W-NCH |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
8AVH-YFA-MNL![]() | 8AVH-YFA-MNL |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .050 18AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
NE3R-CO5-CT![]() | NE3R-CO5-CT |
| Leadtime 2-3 weeks | MG Chemicals | LEADED NO CLEAN SOLDER PASTE | 4860 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 35g 1.18 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
G0-FKY4-9HE![]() | G0-FKY4-9HE |
| Leadtime 2 3 weeks | Multicore | 96SC C502 5C 0.38MM 0.25KG.015 | C502 | Active | Wire Solder | No Clean | No Shelf Life | |||||||||||||||||||||
0E7W6-USB-HC![]() | 0E7W6-USB-HC |
| Leadtime 2-3 weeks | Multicore | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
HJ-J6-U0 | HJ-J6-U0 |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
TV-DXQ-TM![]() | TV-DXQ-TM |
| Leadtime 2 3 weeks | Kester Solder | SOLDER RA 21AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
AN-OROW-O1![]() | AN-OROW-O1 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 60 40 .062 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
FZGUL-YU-1V5![]() | FZGUL-YU-1V5 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .032 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
356UX-QIE-YY3![]() | 356UX-QIE-YY3 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLD PASTE LF WATER SOL T5 10CC | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
3ZIQ-DZ7X-10S![]() | 3ZIQ-DZ7X-10S |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN96 21GAUGE 0.6OZ | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Tube, 18g 0.6 oz | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
AMLW-ZADH-E0![]() | AMLW-ZADH-E0 | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
1QE-5FR-0FB![]() | 1QE-5FR-0FB |
| Leadtime 2-3 weeks | Multicore | 97SC C511 2% .022DIA 23AWG 24SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
L6-FB-UBZ![]() | L6-FB-UBZ |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN96 21GAUGE 0.6OZ | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Tube, 18g 0.6 oz | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
YRYRG-B25-4E4 | YRYRG-B25-4E4 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOL .062 16AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
RS-RLCN-H8![]() | RS-RLCN-H8 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
ICJ5-NFG-A2![]() | ICJ5-NFG-A2 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
SC-K59-J3D | SC-K59-J3D |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated |