Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NBBV-RU6X-VU![]() | NBBV-RU6X-VU |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
GB-H3B-1LK | GB-H3B-1LK |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
LG-W22S-Z5![]() | LG-W22S-Z5 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 63 37 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
65FO7-54-NIR![]() | 65FO7-54-NIR | Leadtime 2 3 weeks | MG Chemicals | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
EOXQW-4FAH-IW![]() | EOXQW-4FAH-IW | Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 21AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
NUM-9HC4-XE | NUM-9HC4-XE |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
8F4-JPK-8S![]() | 8F4-JPK-8S | Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 .020 DIAM | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
87-EB-L2![]() | 87-EB-L2 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
VMZ-KQ36-NYH![]() | VMZ-KQ36-NYH |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN96 21GAUGE 0.6OZ | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Tube, 18g 0.6 oz | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
EC-OVUX-K8![]() | EC-OVUX-K8 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO CLEAN T5 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
T8-7K-7WZ![]() | T8-7K-7WZ |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
OJ-46-Z2 | OJ-46-Z2 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
KR6-STE-6VI | KR6-STE-6VI |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOL .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
JK-T7-RMK![]() | JK-T7-RMK | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
I0-O5X-E6D![]() | I0-O5X-E6D |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 60 40 .032 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
YEBP-OWN-L5![]() | YEBP-OWN-L5 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 10CC SYR | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
Y3ENS-AU-SEX![]() | Y3ENS-AU-SEX |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 60 40 .040 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
NRAYD-MH97-70Z![]() | NRAYD-MH97-70Z |
| Leadtime 2-3 weeks | Multicore | 97SC HYDROX3C 0.81MM 0.5KG.032 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
XQ-Z7C-G9![]() | XQ-Z7C-G9 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
7V5LX-HC-BEE![]() | 7V5LX-HC-BEE |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 63 37 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
IF-LY8Z-BJ![]() | IF-LY8Z-BJ | Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 DIAMETER 2 | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
XY-W5C-CJ![]() | XY-W5C-CJ |
| Leadtime 2-3 weeks | Multicore | 96S C400 5C 0.56MM 0.5KG AM | C400 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
56-NUW-PP![]() | 56-NUW-PP |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
YY0-E1C7-I1D![]() | YY0-E1C7-I1D |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 250G T5 | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
TQP-Y4-MJ![]() | TQP-Y4-MJ |
| Leadtime 2-3 weeks | Multicore | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life |