ManufacturerSeriesPart StatusProcessTypeFlux TypeCompositionWire GaugeDiameterCore SizeFormMelting PointShelf Life
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Series
Part Status
Process
Type
Flux Type
Composition
Wire Gauge
Diameter
Core Size
Form
Melting Point
Shelf Life
B81-K7-3P
B81-K7-3P
1+30.9118
5+30.2765
10+27.7529
25+22.7071
50+21.4457
Increments of 1
Leadtime
2-3 weeks		Multicore63 37 400 3% .032DIA 21SWGC400ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 20 AWG, 21 SWG0.032 0.81mm 0.033Spool, 454g 1 lb 361°F 183°C No Shelf Life
45-SC4M-SS
45-SC4M-SS
1+4.55882
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER WIRE NO CLEAN 63 37 1OZ. ActiveLeadedWire SolderNo Clean, Water SolubleSn63Pb37 63 37 20 AWG, 21 SWG0.031 0.79mm 0.022Spool, 28g 1 oz 361°F 183°C
WRM-2W9-CL
WRM-2W9-CL
1+26.4216
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE LOW TEMP T4 10CC-ActiveLead FreeSolder PasteNo-CleanSn42Bi57.6Ag0.4 42 57.6 0.4 ---Syringe, 15g 0.5 oz 281°F 138°C 6 Months Date of Manufacture Refrigerated
LQ-23M-PUE
LQ-23M-PUE
1+106.618
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE NO-CLEAN SAC305 T3-ActiveLead FreeSolder PasteNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 ----423 ~ 428°F 217 ~ 220°C 6 Months Date of Manufacture Refrigerated
KR-A8-A0Z
KR-A8-A0Z
1+20.5392
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE TWO PART MIX-ActiveLead FreeSolder PasteNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 ---Jar, 15g 0.5 oz 423 ~ 428°F 217 ~ 220°C 24 Months Date of Manufacture Unmixed
GJOM2-ZO4-Q6
GJOM2-ZO4-Q6
25+29.8333
Increments of 25
Leadtime
2-3 weeks		Kester SolderSOLDER 63 37 11AWG 5LBSolid Core WireActiveLeadedWire Solder-Sn63Pb37 63 37 -0.125 3.18mm --361°F 183°C 36 Months Date of Manufacture
K1-Z5U-SWG
K1-Z5U-SWG
1+64.4216
5+57.5647
10+46.6
25+43.8588
50+41.1176
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER LF SN99 21GAUGE 1LBS4901ActiveLead FreeWire SolderNo-CleanSn99.3Cu0.7 99.3 0.7 20 AWG, 21 SWG0.032 0.81mm -Spool, 454g 1 lb 440°F 227°C No Shelf Life
M3WE-XZP-EB
M3WE-XZP-EB
40+15.0113
Increments of 40
Leadtime
2 3 weeks		Multicore63 37 370 5C 0.38MM 0.25KG.015 *Active
317RZ-NUI5-WNK
317RZ-NUI5-WNK
1+4.55882
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER WIRE NO CLEAN 63 37 1OZ. ActiveLeadedWire SolderNo Clean, Water SolubleSn63Pb37 63 37 20 AWG, 21 SWG0.031 0.79mm 0.022Spool, 28g 1 oz 361°F 183°C
HUXJ-40-SH1
HUXJ-40-SH1
1+4.93137
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER WIRE NO-CLEAN 63 37 1OZ.-ActiveLeadedWire SolderNo-Clean, Water SolubleSn63Pb37 63 37 24 AWG, 25 SWG0.02 0.51mm 0.022Spool, 28g 1 oz 361°F 183°C -
0VX8-S9M2-60
0VX8-S9M2-60
1+28.4902
5+27.9059
10+25.5804
25+20.9294
50+19.7667
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER RA 63 37 .062 1 2 LBS4880ActiveLeadedWire SolderRosin Activated RA Sn63Pb37 63 37 14 AWG, 16 SWG0.062 1.57mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
UP0W-TI7-EQI
UP0W-TI7-EQI
1+40.2353
5+38.5569
10+31.852
25+28.4988
50+26.8224
Increments of 1
Leadtime
2-3 weeks		Multicore97SC 400 2% .022DIA 24SWGC400ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 23 AWG, 24 SWG0.022 0.56mm 0.022Spool, 227g 1 2 lb 423 ~ 428°F 217 ~ 220°C No Shelf Life
853Q-Q8-XPP
853Q-Q8-XPP
20+28.0583
Increments of 20
Leadtime
2-3 weeks		Multicore60 40 370 5C 1.22MM 0.5KG AM*Active----------
P6-3C-FU
P6-3C-FU
20+55.0956
Increments of 20
Leadtime
2-3 weeks		Multicore96SC C511 3C 1.02MM 0.5KG .040 C511™Active---------No Shelf Life
RL7-SV9-MDU
RL7-SV9-MDU
1+21.3529
5+20.9216
10+20.0676
25+17.0784
50+15.3706
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER LF SN100E RA FLUX*Active----------
TQD-5P9-2SW
TQD-5P9-2SW
1+81.6176
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE NO-CLEAN 63 37 T3 5-ActiveLeadedSolder PasteNo-CleanSn63Pb37 63 37 ----361°F 183°C 12 Months Date of Manufacture Refrigerated
IP-40W3-O6R
IP-40W3-O6R
10+108.161
Increments of 10
Leadtime
2 3 weeks		MulticoreSOLDER PASTE HF 212 600GRAM JAHF212Active No Shelf Life
8I-HF-TMJ
8I-HF-TMJ
1+21.5392
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SLD WIRE NO-CLEAN 96.5 3 .5 4OZ.-ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 24 AWG, 25 SWG0.02 0.51mm 0.022Spool, 113g 1 4 lb 423 ~ 428°F 217 ~ 220°C -
FXHO4-WTF-UUJ
FXHO4-WTF-UUJ
1+45.0882
5+43.2137
10+35.698
25+31.9404
50+30.0618
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER NO-CLEAN 21AWG 63 37 1LB245ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 20 AWG, 21 SWG0.031 0.79mm 0.022Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
QP-EII-6M1
QP-EII-6M1
25+81.9267
Increments of 25
Leadtime
2-3 weeks		Kester SolderSOLDER 58 .015 28AWG 1LB275ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 28 AWG, 30 SWG0.015 0.39mm 0.022Spool, 454g 1 lb 423 ~ 428°F 217 ~ 220°C 36 Months Date of Manufacture
T9N-LUSS-VN1
T9N-LUSS-VN1
1+27.9216
5+27.3529
10+25.0735
25+20.5149
50+19.3751
Increments of 1
Leadtime
2-3 weeks		MulticoreHMP 366 3% .050DIA. 18SWG366ActiveLeadedWire SolderRosin Activated RA Pb93.5Sn5Ag1.5 93.5 5 1.5 16 AWG, 18 SWG0.05 1.27mm 0.033Spool, 454g 1 lb 565 ~ 574°F 296 ~ 301°C No Shelf Life
ZHE-W6Z2-CO
ZHE-W6Z2-CO
1+44.3725
5+42.5275
10+35.1314
25+31.4333
50+29.5843
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER RA 63 37 .025 1 LBS4880ActiveLeadedWire SolderRosin Activated RA Sn63Pb37 63 37 22 AWG, 23 SWG0.025 0.64mm 0.022Spool, 454g 1 lb 361°F 183°C No Shelf Life
4E4V-P6-IR
4E4V-P6-IR
1+28.4902
5+27.9059
10+25.5804
25+20.9294
50+19.7667
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER RA 60 40 .062 1 2 LB4890ActiveLeadedWire SolderRosin Activated RA Sn60Pb40 60 40 14 AWG, 16 SWG0.062 1.57mm 0.022Spool, 227g 1 2 lb 361 ~ 374°F 183 ~ 190°C No Shelf Life
7OORF-WH8S-3S
7OORF-WH8S-3S
1+35.1275
5+34.4118
10+31.5441
25+25.8086
50+24.3747
Increments of 1
Leadtime
2 3 weeks		Multicore63 37 CRYSL 502 3% .032DIA 21SWGC502ActiveLeadedWire SolderNo CleanSn63Pb37 63 37 20 AWG, 21 SWG0.032 0.81mm 0.033Spool, 454g 1 lb 361°F 183°C No Shelf Life
FM4Z-SA-JD
FM4Z-SA-JD
1+178.5
Increments of 1
Leadtime
2 3 weeks		Micro Measurements Division of Vishay Precision Group 1240 FPA SILVER SOLDER PASTE ActiveLead FreeSolder Paste Ag40Cu30Zn28Ni2 40 30 28 2 Jar, 28g 1 oz 1220 ~ 1435°F 660 ~ 780°C 9 Months Date of Manufacture