Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BD3Q-07-AR![]() | BD3Q-07-AR |
| Leadtime 2 3 weeks | Multicore | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
44SW9-63-UK![]() | 44SW9-63-UK |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 28AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
M3GVT-S1-PXO![]() | M3GVT-S1-PXO |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .020 24AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
BB-AA88-UH![]() | BB-AA88-UH | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
WCHX3-5SQ-63M![]() | WCHX3-5SQ-63M |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
55I6Y-CQ3R-AP![]() | 55I6Y-CQ3R-AP |
| Leadtime 2-3 weeks | Multicore | 96SC C400 3C 0.56MM 0.25KG.022 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
F0CDT-65-12![]() | F0CDT-65-12 |
| Leadtime 2-3 weeks | Multicore | SOLDER PASTE HF 212 - 600GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
UI8I-5GZT-955![]() | UI8I-5GZT-955 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE 63 37 T4 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
Q5NXA-BWHB-UR![]() | Q5NXA-BWHB-UR |
| Leadtime 2-3 weeks | Multicore | 60 40 370 3% .064DIA. 16SWG | 370 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
MIM-1IV-XH![]() | MIM-1IV-XH |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 23AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
11I-IHZ-UW![]() | 11I-IHZ-UW |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .062 1 2 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
D5P-KHR-AV![]() | D5P-KHR-AV | Leadtime 2-3 weeks | Easy Braid Co. | SOLDER NO-CLEAN ANTISTAT .031 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
BYAOY-J0S3-Z6![]() | BYAOY-J0S3-Z6 |
| Leadtime 2 3 weeks | Multicore | 97SC 400 2% .064DIA 16SWG | C400 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
IV-KF-UWQ | IV-KF-UWQ |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
UAT-3Y2Y-4S7![]() | UAT-3Y2Y-4S7 |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 10 SAC305T4 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
FOW-NUU1-QJ![]() | FOW-NUU1-QJ |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER 60 40 NOCLEAN .04DIA .5LB | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
CF-MZK-2S![]() | CF-MZK-2S |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
OPW-0SCF-9SS![]() | OPW-0SCF-9SS |
| Leadtime 2-3 weeks | Multicore | 63 37 400 2% .024DIA 23SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.024 0.61mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
L54-3HYW-HXD![]() | L54-3HYW-HXD |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
STW-FVF-JVQ![]() | STW-FVF-JVQ |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
TT0Q-HM-Y6![]() | TT0Q-HM-Y6 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 63 37 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
ILB5-QIIV-XD9![]() | ILB5-QIIV-XD9 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .062 16AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
A58-EAP-TI![]() | A58-EAP-TI | Leadtime 2-3 weeks | MG Chemicals | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
680-LPJ-9G![]() | 680-LPJ-9G |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 T4 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
SL7ES-FBO2-7TI![]() | SL7ES-FBO2-7TI |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .015 28AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture |