ManufacturerSeriesPart StatusProcessTypeFlux TypeCompositionWire GaugeDiameterCore SizeFormMelting PointShelf Life
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Series
Part Status
Process
Type
Flux Type
Composition
Wire Gauge
Diameter
Core Size
Form
Melting Point
Shelf Life
7HK-G34-TB
7HK-G34-TB
25+42.2902
Increments of 25
Leadtime
2 3 weeks		Kester SolderSOLDER 66 .050 18AWG 1LB275ActiveLead FreeWire SolderNo CleanSn99.3Cu0.7 99.3 0.7 16 AWG, 18 SWG0.05 1.27mm 0.033Spool, 454g 1 lb 440°F 227°C 36 Months Date of Manufacture
PG-K61B-PPP
PG-K61B-PPP
1+41.902
5+40.1608
10+33.1755
25+29.6835
50+27.9373
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER WATER SOL 16AWG 63 37 1LB331ActiveLeadedWire SolderWater SolubleSn63Pb37 63 37 14 AWG, 16 SWG0.062 1.57mm 0.033Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
ZVS5W-9Q6D-GE
ZVS5W-9Q6D-GE
1+178.5
Increments of 1
Leadtime
2-3 weeks		Micro-Measurements Division of Vishay Precision Group 1240-FPA SILVER SOLDER PASTE ---ActiveLead FreeSolder Paste-Ag40Cu30Zn28Ni2 40 30 28 2 ---Jar, 28g 1 oz 1220 ~ 1435°F 660 ~ 780°C 9 Months Date of Manufacture
WR-QPAO-CS
WR-QPAO-CS
1+21.5392
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SLD WIRE NO-CLEAN 96.5 3 .5 4OZ.-ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 24 AWG, 25 SWG0.02 0.51mm 0.022Spool, 113g 1 4 lb 423 ~ 428°F 217 ~ 220°C -
BCMP-4O-1U0
BCMP-4O-1U0
Leadtime
2-3 weeks		MulticoreSN62 370 3% .032DIA. 21SWG370ObsoleteLeadedWire SolderRosin Activated RA Sn62Pb38 62 38 20 AWG, 21 SWG0.032 0.81mm 0.033Spool, 454g 1 lb 350°F 177°C No Shelf Life
SY-AP-FM
SY-AP-FM
1+28.4902
5+27.9059
10+25.5804
25+20.9294
50+19.7667
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER RA 63 37 .032 1 2 LBS4880ActiveLeadedWire SolderRosin Activated RA Sn63Pb37 63 37 20 AWG, 21 SWG0.032 0.81mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
1V-KXT-TSG
1V-KXT-TSG
1+83.0392
5+74.2059
10+60.0716
25+56.5384
50+53.0045
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER BAR 1.66LB SN96.5AG3CU0.5ULTRAPURE®ActiveLead FreeBar Solder-Sn96.5Ag3.0Cu0.5 96.5 3 0.5 ---Bar, 750g 1 2 3 lbs 423 ~ 428°F 217 ~ 220°C No Shelf Life
FL2ON-HWF3-7SO
FL2ON-HWF3-7SO
2+28.8725
Increments of 2
Leadtime
2-3 weeks		MG ChemicalsLEADED NO CLEAN SOLDER PASTE4860ActiveLeadedSolder PasteNo-CleanSn63Pb37 63 37 ---Syringe, 35g 1.18 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
6O-IRPP-9OQ
6O-IRPP-9OQ
Leadtime
2 3 weeks		Easy Braid Co.SOLDER NO CLEAN ANTISTAT .031 ObsoleteLeadedWire SolderNo CleanSn63Pb37 63 37 20 AWG, 21 SWG0.031 0.79mm 0.022 361°F 183°C No Shelf Life
Y5YX-D0-7C9
Y5YX-D0-7C9
1+18.6176
5+18.2431
10+17.499
25+14.8925
50+13.4033
Increments of 1
Leadtime
2-3 weeks		Multicore63 37 400 2% .015DIA 28SWGC400ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 26 AWG, 27 SWG0.015 0.39mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
BAO3I-0LS-NDX
BAO3I-0LS-NDX
25+55.0431
Increments of 25
Leadtime
2-3 weeks		Kester SolderSOLDER 66 .020 24AWG 1LB275ActiveLead FreeWire SolderNo-CleanSn99.3Cu0.7 99.3 0.724 AWG, 25 SWG0.02 0.51mm0.033Spool, 454g 1 lb440°F 227°C36 Months Date of Manufacture
1E-KNJ-Y9
1E-KNJ-Y9
1+77.402
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER SPHERES 63 37 .030 DIAMSMD2ActiveLeadedSolder Sphere Sn63Pb37 63 37
E7X-BIHW-M6
E7X-BIHW-M6
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER SPHERES SAC305 .024 DIAM*Active000000000-
5WPT-TT-GN
5WPT-TT-GN
50+45.5441
Increments of 50
Leadtime
2-3 weeks		Kester SolderSOLDERPASTE NO CLEAN 63 37 100GMR276ActiveLeadedSolder PasteNo-CleanSn63Pb37 63 37 ---Syringe, 100g 3.5 oz 361°F 183°C 6 Months Date of Manufacture Refrigerated
PAD1G-ET7-N3D
PAD1G-ET7-N3D
1+35.1275
5+34.4118
10+31.5441
25+25.8086
50+24.3747
Increments of 1
Leadtime
2 3 weeks		Multicore63 37 CRYSL 502 3% .032DIA 21SWGC502ActiveLeadedWire SolderNo CleanSn63Pb37 63 37 20 AWG, 21 SWG0.032 0.81mm 0.033Spool, 454g 1 lb 361°F 183°C No Shelf Life
JKVJR-D6VA-608
JKVJR-D6VA-608
25+71.1373
Increments of 25
Leadtime
2-3 weeks		Kester SolderOR-421 FLUX-CORED WIRESN99.3CU.7OR421ActiveLead FreeWire SolderWater SolubleSn99.3Cu0.7 99.3 0.7 14 AWG, 16 SWG0.062 1.57mm 0.022Spool, 454g 1 lb 440°F 227°C 36 Months Date of Manufacture
72PA-DHK-52
72PA-DHK-52
1+107.137
5+95.7353
10+77.5
25+72.9412
50+68.3824
Increments of 1
Leadtime
2 3 weeks		MG ChemicalsSOLDER LF SAC305 RA FLUX*Active
A7VCY-L6-IG3
A7VCY-L6-IG3
40+14.0806
Increments of 40
Leadtime
2 3 weeks		Multicore63 37 381 5C 0.56MM 0.25KG AM*Active
S3RGD-FK5-O75
S3RGD-FK5-O75
20+41.2397
Increments of 20
Leadtime
2 3 weeks		Multicore96SC C502 5C 0.38MM 0.25KG.015 C502Active Wire SolderNo Clean No Shelf Life
0JHW-FTCM-8OW
0JHW-FTCM-8OW
Leadtime
2-3 weeks		Kester SolderSOLDER NO-CLEAN 25AWG 63 37 .5LB245ObsoleteLeadedWire SolderNo-CleanSn63Pb37 63 37 24 AWG, 25 SWG0.02 0.51mm 0.011Spool, 227g 1 2 lb 361°F 183°C 36 Months Date of Manufacture
XPR-BK-0FF
XPR-BK-0FF
1+28.4902
5+27.9059
10+25.5804
25+20.9294
50+19.7667
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER RA 63 37 .062 1 2 LBS4880ActiveLeadedWire SolderRosin Activated RA Sn63Pb37 63 37 14 AWG, 16 SWG0.062 1.57mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
X4X6-3T-79
X4X6-3T-79
Leadtime
2-3 weeks		Kester SolderSOLDER 500G JAR,SN96.5 AG3.0-ObsoleteLead FreeSolder Paste-Sn96.5Ag3.0Cu0.5 96.5 3 0.5 ---Jar, 500g 17 oz --
VPN7C-IV71-6R
VPN7C-IV71-6R
10+38.6775
Increments of 10
Leadtime
2-3 weeks		MulticoreMP218 RWFMP218ActiveLeadedSolder PasteNo-Clean------6 Months Date of Manufacture Refrigerated
V8-9IUE-J1
V8-9IUE-J1
1+68.4608
5+61.1804
10+49.5265
25+46.6133
50+43.7002
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER NO-CLEAN 19AWG 63 37 1LB245ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 18 AWG, 19 SWG0.04 1.02mm 0.011Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
P8V-S7-LZ
P8V-S7-LZ
Leadtime
2 3 weeks		Kester SolderSOLDER RA FLUX 23AWG 60 40 .5LB44ObsoleteLeadedWire SolderRosin Activated RA Sn60Pb40 60 40 22 AWG, 23 SWG0.025 0.64mm 0.033Spool, 227g 1 2 lb 212°F 100°C 36 Months Date of Manufacture