Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
8CG-TWQ-IO![]() | 8CG-TWQ-IO |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA .050 18AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
CN1I-N4I-D5D![]() | CN1I-N4I-D5D |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
A93A-73EG-AA![]() | A93A-73EG-AA | Leadtime 2-3 weeks | Multicore | 63 37 WS200 SOLDER PASTE 75GM | WS200™ | Obsolete | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Syringe, 75g 2.6 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||
W305-RUOG-4JR![]() | W305-RUOG-4JR |
| Leadtime 2 3 weeks | Micro Measurements Division of Vishay Precision Group | 1240 FPA SILVER SOLDER PASTE | Active | Lead Free | Solder Paste | Ag40Cu30Zn28Ni2 40 30 28 2 | Jar, 28g 1 oz | 1220 ~ 1435°F 660 ~ 780°C | 9 Months Date of Manufacture | |||||||||||||||||||
42-3F-OF0![]() | 42-3F-OF0 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
GZNG-O0WW-QA![]() | GZNG-O0WW-QA |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLD WIRE NO-CLEAN 96.5 3 .5 2OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
1QEF5-JE1K-HZ![]() | 1QEF5-JE1K-HZ |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
WL-XL1-UL![]() | WL-XL1-UL |
| Leadtime 2-3 weeks | Kester Solder | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
OHVZX-52NE-98R![]() | OHVZX-52NE-98R |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
8H4-6HJ-KRO![]() | 8H4-6HJ-KRO |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 60 40 .032 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
RC-UANS-VXY![]() | RC-UANS-VXY |
| Leadtime 2-3 weeks | Multicore | 63 37 CRYSL 502 2% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
ZRORF-KXT-5P | ZRORF-KXT-5P |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN 18AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
HZ-D8BR-6UM![]() | HZ-D8BR-6UM |
| Leadtime 2-3 weeks | Multicore | 63 37 400 1% .064DIA 16SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
MWJ-I9H-XV | MWJ-I9H-XV |
| Leadtime 2-3 weeks | Chip Quik Inc. | SN42 BI57.6 AG0.4 2-PART MIX 60G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | - | 281°F 138°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
CCDYK-FUY-XYF![]() | CCDYK-FUY-XYF |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST WATR SOL SAC305 T4 250G | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
J30-EN6L-XC | J30-EN6L-XC |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOL .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
W3P-24-CF![]() | W3P-24-CF |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
2CZMT-9AAK-9MC![]() | 2CZMT-9AAK-9MC |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .032 PKT PACK | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Tube, 18g 0.6 oz | 361°F 183°C | No Shelf Life | ||||||||||||||
ERB1C-H3L-4H![]() | ERB1C-H3L-4H |
| Leadtime 2 3 weeks | Multicore | 63 37 370 5C 0.38MM 0.25KG.015 | * | Active | ||||||||||||||||||||||||
CE-PE-M06![]() | CE-PE-M06 | Leadtime 2-3 weeks | Kester Solder | SOLDER 500G JAR,SN96.5 AG3.0 | - | Obsolete | Lead Free | Solder Paste | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | - | - | |||||||||||||||
FV-TGB-2Q![]() | FV-TGB-2Q |
| Leadtime 2 3 weeks | Kester Solder | SOLDER SOLID WIRE 16AWG 60 40 | Active | Leaded | Wire Solder | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | Spool, 454g 1 lb | |||||||||||||||||||
K4Q-MUTS-XWA![]() | K4Q-MUTS-XWA |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
I6Z2-RAG-J05![]() | I6Z2-RAG-J05 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN96 21GAUGE .5LBS | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
SK-3F54-R33![]() | SK-3F54-R33 |
| Leadtime 2-3 weeks | Multicore | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
9ZE-J9Z-5Z![]() | 9ZE-J9Z-5Z |
| Leadtime 2-3 weeks | Multicore | 63 37 381 5C 0.81MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - |