Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IEP-HX5-CH![]() | IEP-HX5-CH |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 .062 1 2 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
I6QK-YOUR-FF![]() | I6QK-YOUR-FF |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER NO-CLEAN 60 40 1 2 LB | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
OAK-VN6J-9XT![]() | OAK-VN6J-9XT |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLD PASTE LF WATER SOL T5 10CC | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
114Z-58-YB![]() | 114Z-58-YB | Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 .024 DIAM | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
HE6Q-2R-CX![]() | HE6Q-2R-CX | Leadtime 2-3 weeks | MG Chemicals | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
I5-12-UY1 | I5-12-UY1 |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
G3-EU-S1![]() | G3-EU-S1 |
| Leadtime 2-3 weeks | Aven Tools | SOLDER 1MM 100G | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Spool, 100g 3.5 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
7D-QQ8S-FD![]() | 7D-QQ8S-FD |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOL 23AWG 63 37 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
E0V-DB4-UM0![]() | E0V-DB4-UM0 |
| Leadtime 2 3 weeks | Multicore | 60 40C511 3C 1.63MM AF 2.5KG AM | * | Active | ||||||||||||||||||||||||
NT6-YG-301![]() | NT6-YG-301 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 16AWG 60 40 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
RIB-D4-UNI![]() | RIB-D4-UNI |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
C8LIP-3S-VPD![]() | C8LIP-3S-VPD |
| Leadtime 2-3 weeks | Multicore | MP218 RWF | MP218 | Active | Leaded | Solder Paste | No-Clean | - | - | - | - | - | - | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
C1IP-MNKZ-GRC![]() | C1IP-MNKZ-GRC |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .020 24AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
Q5VA-K0X-O3N![]() | Q5VA-K0X-O3N |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 10 SAC305T3 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Cartridge, 600g 21 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
BG-4RH-KV4![]() | BG-4RH-KV4 | Leadtime 2-3 weeks | MG Chemicals | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
TJ-FXX-KX![]() | TJ-FXX-KX | Leadtime 2 3 weeks | Kester Solder | SOLDER 500G JAR,SN96.5 AG3.0 | Obsolete | Lead Free | Solder Paste | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 500g 17 oz | ||||||||||||||||||||||
38P3-F5-WBZ![]() | 38P3-F5-WBZ | Leadtime 2-3 weeks | MG Chemicals | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
39E-306F-T0![]() | 39E-306F-T0 |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPAST NO CLEAN 63 37 1000GM | Easy Profile® | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Cartridge, 1000g 35 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
HT-HNK1-XV![]() | HT-HNK1-XV |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA 60 40 14AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
TSP1A-A6C-T3![]() | TSP1A-A6C-T3 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||||
G2R-LW-BP![]() | G2R-LW-BP |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA 60 40 19AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
KTT-SMVF-3GN![]() | KTT-SMVF-3GN |
| Leadtime 2 3 weeks | Multicore | 96SC C511 3C 1.02MM 0.5KG .040 | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
ZL0XC-JG-99B![]() | ZL0XC-JG-99B |
| Leadtime 2 3 weeks | Chip Quik Inc. | SLDR PST NO CLEAN 63 37 T4 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
1GA-4EW-UT![]() | 1GA-4EW-UT |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
0D-8A4-SSL | 0D-8A4-SSL |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - |