ManufacturerSeriesPart StatusProcessTypeFlux TypeCompositionWire GaugeDiameterCore SizeFormMelting PointShelf Life
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Series
Part Status
Process
Type
Flux Type
Composition
Wire Gauge
Diameter
Core Size
Form
Melting Point
Shelf Life
IEP-HX5-CH
IEP-HX5-CH
1+28.4902
5+27.9059
10+25.5804
25+20.9294
50+19.7667
Increments of 1
Leadtime
2-3 weeks
MG ChemicalsSOLDER RA 63 37 .062 1 2 LBS4880ActiveLeadedWire SolderRosin Activated RA Sn63Pb37 63 37 14 AWG, 16 SWG0.062 1.57mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
I6QK-YOUR-FF
I6QK-YOUR-FF
1+28.4902
5+27.9059
10+25.5804
25+20.9294
50+19.7667
Increments of 1
Leadtime
2-3 weeks
MG ChemicalsSOLDER NO-CLEAN 60 40 1 2 LB4870ActiveLeadedWire SolderNo-CleanSn60Pb40 60 40 20 AWG, 21 SWG0.032 0.81mm 0.022Spool, 227g 1 2 lb 361 ~ 374°F 183 ~ 190°C No Shelf Life
OAK-VN6J-9XT
OAK-VN6J-9XT
1+38.1863
Increments of 1
Leadtime
2-3 weeks
Chip Quik Inc.SLD PASTE LF WATER SOL T5 10CC-ActiveLead FreeSolder PasteWater SolubleSn96.5Ag3.0Cu0.5 96.5 3 0.5 ---Syringe, 10cc, 35g 1.2 oz 423 ~ 428°F 217 ~ 220°C 6 Months Date of Manufacture Refrigerated
114Z-58-YB
114Z-58-YB
Leadtime
2-3 weeks
Chip Quik Inc.SOLDER SPHERES SAC305 .024 DIAM*Active000000000-
HE6Q-2R-CX
HE6Q-2R-CX
Leadtime
2-3 weeks
MG ChemicalsSOLDER 63 37 NOCLEAN .04DIA .5LB4860ObsoleteLeadedWire SolderNo-CleanSn63Pb37 63 37 18 AWG, 19 SWG0.04 1.02mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
I5-12-UY1
I5-12-UY1
1+107.137
5+95.7353
10+77.5
25+72.9412
50+68.3824
Increments of 1
Leadtime
2 3 weeks
MG ChemicalsSOLDER LF SAC305 RA FLUX*Active
G3-EU-S1
G3-EU-S1
1+6.37255
Increments of 1
Leadtime
2-3 weeks
Aven ToolsSOLDER 1MM 100G-ActiveLeadedWire SolderRosin Activated RA Sn60Pb40 60 40 18 AWG, 19 SWG0.039 0.99mm -Spool, 100g 3.5 oz 360°F 180°C 5 Years Date of Manufacture
7D-QQ8S-FD
7D-QQ8S-FD
1+49
5+46.9569
10+38.7902
25+34.7071
50+32.6657
Increments of 1
Leadtime
2-3 weeks
Kester SolderSOLDER WATER SOL 23AWG 63 37 1LB331ActiveLeadedWire SolderWater SolubleSn63Pb37 63 37 22 AWG, 23 SWG0.025 0.64mm 0.033Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
E0V-DB4-UM0
E0V-DB4-UM0
20+95.0588
Increments of 20
Leadtime
2 3 weeks
Multicore60 40C511 3C 1.63MM AF 2.5KG AM*Active
NT6-YG-301
NT6-YG-301
1+43.6569
5+41.8392
10+34.5627
25+30.9243
50+29.1053
Increments of 1
Leadtime
2-3 weeks
Kester SolderSOLDER RA FLUX 16AWG 60 40 1LB44ActiveLeadedWire SolderRosin Activated RA Sn60Pb40 60 40 16 AWG, 18 SWG0.05 1.27mm 0.033Spool, 454g 1 lb 361 ~ 374°F 183 ~ 190°C 36 Months Date of Manufacture
RIB-D4-UNI
RIB-D4-UNI
1+77.402
Increments of 1
Leadtime
2-3 weeks
Chip Quik Inc.SOLDER SPHERES 63 37 .030 DIAMSMD2ActiveLeadedSolder Sphere-Sn63Pb37 63 37 ------
C8LIP-3S-VPD
C8LIP-3S-VPD
10+38.6775
Increments of 10
Leadtime
2-3 weeks
MulticoreMP218 RWFMP218ActiveLeadedSolder PasteNo-Clean------6 Months Date of Manufacture Refrigerated
C1IP-MNKZ-GRC
C1IP-MNKZ-GRC
25+55.0431
Increments of 25
Leadtime
2-3 weeks
Kester SolderSOLDER 66 .020 24AWG 1LB275ActiveLead FreeWire SolderNo-CleanSn99.3Cu0.7 99.3 0.724 AWG, 25 SWG0.02 0.51mm0.033Spool, 454g 1 lb440°F 227°C36 Months Date of Manufacture
Q5VA-K0X-O3N
Q5VA-K0X-O3N
1+108.392
Increments of 1
Leadtime
2-3 weeks
LOCTITELOCTITE GC 10 SAC305T3 885 53ULOCTITE® GC 10ActiveLead FreeSolder PasteNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 ---Cartridge, 600g 21 oz 423 ~ 428°F 217 ~ 220°C 12 Months Date of Manufacture
BG-4RH-KV4
BG-4RH-KV4
Leadtime
2-3 weeks
MG ChemicalsSOLDER 63 37 NOCLEAN .05DIA .5LB4860ObsoleteLeadedWire SolderNo-CleanSn63Pb37 63 37 18 AWG, 19 SWG0.05 1.27mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
TJ-FXX-KX
TJ-FXX-KX
Leadtime
2 3 weeks
Kester SolderSOLDER 500G JAR,SN96.5 AG3.0 ObsoleteLead FreeSolder Paste Sn96.5Ag3.0Cu0.5 96.5 3 0.5 Jar, 500g 17 oz
38P3-F5-WBZ
38P3-F5-WBZ
Leadtime
2-3 weeks
MG ChemicalsSOLDER 63 37 NOCLEAN .04DIA .5LB4860ObsoleteLeadedWire SolderNo-CleanSn63Pb37 63 37 18 AWG, 19 SWG0.04 1.02mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
39E-306F-T0
39E-306F-T0
10+149.608
Increments of 10
Leadtime
2-3 weeks
Kester SolderSOLDERPAST NO CLEAN 63 37 1000GMEasy Profile®ActiveLeadedSolder PasteNo-CleanSn63Pb37 63 37 ---Cartridge, 1000g 35 oz 361°F 183°C 6 Months Date of Manufacture Refrigerated
HT-HNK1-XV
HT-HNK1-XV
1+37.3725
5+35.8196
10+29.5902
25+26.4757
50+24.9182
Increments of 1
Leadtime
2-3 weeks
Kester SolderSOLDER RA 60 40 14AWG 1LB44ActiveLeadedWire SolderRosin Activated RA Sn60Pb40 60 40 14 AWG, 16 SWG0.062 1.57mm 0.033Spool, 454g 1 lb 361 ~ 374°F 183 ~ 190°C 36 Months Date of Manufacture
TSP1A-A6C-T3
TSP1A-A6C-T3
25+30.4667
Increments of 25
Leadtime
2 3 weeks
Kester SolderSOLDER 63 37 11AWG 1LBSolid Core WireActiveLeadedWire Solder Sn63Pb37 63 37 0.125 3.18mm Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
G2R-LW-BP
G2R-LW-BP
1+43.402
5+41.5961
10+34.3627
25+30.7455
50+28.9369
Increments of 1
Leadtime
2-3 weeks
Kester SolderSOLDER RA 60 40 19AWG 1LB44ActiveLeadedWire SolderRosin Activated RA Sn60Pb40 60 40 18 AWG, 19 SWG0.04 1.02mm 0.033Spool, 454g 1 lb 361 ~ 374°F 183 ~ 190°C 36 Months Date of Manufacture
KTT-SMVF-3GN
KTT-SMVF-3GN
20+55.0956
Increments of 20
Leadtime
2 3 weeks
Multicore96SC C511 3C 1.02MM 0.5KG .040 C511™Active No Shelf Life
ZL0XC-JG-99B
ZL0XC-JG-99B
1+49.951
Increments of 1
Leadtime
2 3 weeks
Chip Quik Inc.SLDR PST NO CLEAN 63 37 T4 250G ActiveLeadedSolder PasteNo CleanSn63Pb37 63 37 Jar, 250g 9 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
1GA-4EW-UT
1GA-4EW-UT
1+41.1275
Increments of 1
Leadtime
2 3 weeks
Chip Quik Inc.SOLDER PASTE SN63 PB37 250G ActiveLeadedSolder PasteNo CleanSn63Pb37 63 37 Jar, 250g 9 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
0D-8A4-SSL
0D-8A4-SSL
1+33.5294
5+32.8471
10+30.1098
25+24.6353
50+23.2667
Increments of 1
Leadtime
2-3 weeks
MG ChemicalsSOLDER LF SAC305 NO CLEAN*Active----------