ManufacturerSeriesPart StatusProcessTypeFlux TypeCompositionWire GaugeDiameterCore SizeFormMelting PointShelf Life
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Series
Part Status
Process
Type
Flux Type
Composition
Wire Gauge
Diameter
Core Size
Form
Melting Point
Shelf Life
XG-Z8M-RO
XG-Z8M-RO
Leadtime
2 3 weeks		Kester SolderSOLDER 500G JAR,SN96.5 AG3.0 ObsoleteLead FreeSolder Paste Sn96.5Ag3.0Cu0.5 96.5 3 0.5 Jar, 500g 17 oz
UN-XCJQ-P0I
UN-XCJQ-P0I
20+27.2956
Increments of 20
Leadtime
2-3 weeks		Multicore63 37 381 5C 0.81MM 0.5KG AM*Active----------
I4N-EV0N-WIV
I4N-EV0N-WIV
1+35.1275
5+34.4118
10+31.5441
25+25.8086
50+24.3747
Increments of 1
Leadtime
2 3 weeks		Multicore63 37 CRYSL 502 3% .032DIA 21SWGC502ActiveLeadedWire SolderNo CleanSn63Pb37 63 37 20 AWG, 21 SWG0.032 0.81mm 0.033Spool, 454g 1 lb 361°F 183°C No Shelf Life
YAKK-9Y-8BS
YAKK-9Y-8BS
1+28.4902
5+27.9059
10+25.5804
25+20.9294
50+19.7667
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER NO-CLEAN 63 37 1 2 LB4860ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 20 AWG, 21 SWG0.032 0.81mm 0.022Spool, 227g 1 2 lb 361°F 183°C No Shelf Life
3C-L6L-ZD
3C-L6L-ZD
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER SPHERES SAC305 .024 DIAM*Active000000000-
8BNTC-M4-X5M
8BNTC-M4-X5M
1+107.137
5+95.7353
10+77.5
25+72.9412
50+68.3824
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER LF SN96 21GAUGE 1LB4900ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 20 AWG, 21 SWG0.032 0.81mm -Spool, 454g 1 lb 423 ~ 428°F 217 ~ 220°C No Shelf Life
AQWTA-0V-DMZ
AQWTA-0V-DMZ
1+44.3725
5+42.5275
10+35.1314
25+31.4333
50+29.5843
Increments of 1
Leadtime
2-3 weeks		MG ChemicalsSOLDER RA 63 37 1 LB4880ActiveLeadedWire SolderRosin Activated RA Sn63Pb37 63 37 18 AWG, 19 SWG0.04 1.02mm 0.022Spool, 454g 1 lb 361°F 183°C No Shelf Life
I4SL-RZ-IW
I4SL-RZ-IW
1+31.4118
5+30.7745
10+28.2108
25+23.0816
50+21.7992
Increments of 1
Leadtime
2-3 weeks		Multicore60 40 370 3% .064DIA. 16SWG370ActiveLeadedWire SolderRosin Activated RA Sn60Pb40 60 40 14 AWG, 16 SWG0.064 1.63mm 0.033Spool, 454g 1 lb 361 ~ 374°F 183 ~ 190°C No Shelf Life
VXZ-VT-ZFU
VXZ-VT-ZFU
20+41.2397
Increments of 20
Leadtime
2 3 weeks		Multicore96SC C502 5C 0.38MM 0.25KG.015 C502Active Wire SolderNo Clean No Shelf Life
SV-YW4-4D4
SV-YW4-4D4
1+125
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE SAC305 T4 500G-ActiveLead FreeSolder PasteNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 ----423 ~ 428°F 217 ~ 220°C 6 Months Date of Manufacture Refrigerated
H2TIW-TH-9BN
H2TIW-TH-9BN
1+77.402
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER SPHERES 63 37 .030 DIAMSMD2ActiveLeadedSolder Sphere-Sn63Pb37 63 37 ------
ZPBY-LW2-TMO
ZPBY-LW2-TMO
20+28.0583
Increments of 20
Leadtime
2-3 weeks		Multicore60 40 370 5C 1.22MM 0.5KG AM*Active----------
Y4E-6A-DEG
Y4E-6A-DEG
1+115.706
5+101.931
10+88.1569
25+82.6471
50+77.1373
Increments of 1
Leadtime
2-3 weeks		Kester SolderSOLDER WATER SOL .050 18AWG 1LB331ActiveLead FreeWire SolderWater SolubleSn96.5Ag3.0Cu0.5 96.5 3 0.5 16 AWG, 18 SWG0.05 1.27mm 0.033Spool, 454g 1 lb 423 ~ 428°F 217 ~ 220°C 36 Months Date of Manufacture
XML-38Q-746
XML-38Q-746
25+50.4314
Increments of 25
Leadtime
2-3 weeks		Kester SolderSOLDER 63 37 28AWG 1LB275ActiveLeadedWire SolderNo-CleanSn63Pb37 63 37 28 AWG, 30 SWG0.015 0.39mm 0.011Spool, 454g 1 lb 361°F 183°C 36 Months Date of Manufacture
ESEA7-DR-SV
ESEA7-DR-SV
1+40.2059
5+38.5353
10+31.8324
25+28.482
50+26.8067
Increments of 1
Leadtime
2-3 weeks		Multicore97SC C511 2% .022DIA 23AWG 24SWGC511™ActiveLead FreeWire SolderNo-CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 23 AWG, 24 SWG0.022 0.56mm 0.022Spool, 227g 1 2 lb 423 ~ 428°F 217 ~ 220°C No Shelf Life
S8P-K1S0-3O
S8P-K1S0-3O
1+35.1275
5+34.4118
10+31.5441
25+25.8086
50+24.3747
Increments of 1
Leadtime
2 3 weeks		Multicore63 37 CRYSL 502 3% .032DIA 21SWGC502ActiveLeadedWire SolderNo CleanSn63Pb37 63 37 20 AWG, 21 SWG0.032 0.81mm 0.033Spool, 454g 1 lb 361°F 183°C No Shelf Life
OZ-GF9-9PI
OZ-GF9-9PI
100+50.0029
Increments of 100
Leadtime
2-3 weeks		Multicore96S ARAX 4C 1.6MM 0.5KG AM*Active----------
DDA-BAV-5BS
DDA-BAV-5BS
1+89.1667
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE SN63 PB37 250G T5-ActiveLeadedSolder PasteNo-CleanSn63Pb37 63 37 ---Jar, 250g 9 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
AK-GHK-9U
AK-GHK-9U
50+45.5441
Increments of 50
Leadtime
2 3 weeks		Kester SolderSOLDERPASTE NO CLEAN 63 37 100GMR276ActiveLeadedSolder PasteNo CleanSn63Pb37 63 37 Syringe, 100g 3.5 oz 361°F 183°C 6 Months Date of Manufacture Refrigerated
PMP-LWT1-CO
PMP-LWT1-CO
1+29.3627
Increments of 1
Leadtime
2-3 weeks		Chip Quik Inc.SOLDER PASTE NO CLEAN T5 10CC-ActiveLeadedSolder PasteNo-CleanSn63Pb37 63 37 ---Syringe, 10cc, 35g 1.2 oz 361°F 183°C 12 Months Date of Manufacture Refrigerated
C9X-3VP-D90
C9X-3VP-D90
1+125
Increments of 1
Leadtime
2 3 weeks		Chip Quik Inc.SOLDER PASTE SAC305 T4 500G ActiveLead FreeSolder PasteNo CleanSn96.5Ag3.0Cu0.5 96.5 3 0.5 423 ~ 428°F 217 ~ 220°C 6 Months Date of Manufacture Refrigerated
BF-9V-3C
BF-9V-3C
1+178.5
Increments of 1
Leadtime
2-3 weeks		Micro-Measurements Division of Vishay Precision Group 1240-FPA SILVER SOLDER PASTE ---ActiveLead FreeSolder Paste-Ag40Cu30Zn28Ni2 40 30 28 2 ---Jar, 28g 1 oz 1220 ~ 1435°F 660 ~ 780°C 9 Months Date of Manufacture
P1-V6-HCD
P1-V6-HCD
15+77.0124
Increments of 15
Leadtime
2-3 weeks		Multicore63S4 WS200 ACP PASTE 600G SEMCOWS200™ActiveLeadedSolder PasteWater SolubleSn63Pb37 63 37 ----361°F 183°C 6 Months Date of Manufacture Refrigerated
8TGSS-U0AX-4I
8TGSS-U0AX-4I
2+44.3774
Increments of 2
Leadtime
2 3 weeks		MG ChemicalsSOLDER WIRE4880ActiveLeadedWire SolderWater SolubleSn63Pb37 63 37 22 AWG, 23 SWG0.032 0.81mm 0.033Spool, 454g 1 lb 361°F 183°C No Shelf Life
Z0DP-O6P-OXJ
Z0DP-O6P-OXJ
1+6.37255
Increments of 1
Leadtime
2-3 weeks		Aven ToolsSOLDER 1MM 100G-ActiveLeadedWire SolderRosin Activated RA Sn60Pb40 60 40 18 AWG, 19 SWG0.039 0.99mm -Spool, 100g 3.5 oz 360°F 180°C 5 Years Date of Manufacture