Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1W9Z-J5-WL![]() | 1W9Z-J5-WL |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||||
CD1M-NB4B-4B![]() | CD1M-NB4B-4B | Leadtime 2-3 weeks | Kester Solder | SOLDER RMA FLUX 16AWG 63 37 1LB | 285 | Obsolete | Leaded | Wire Solder | Rosin Mildly Activated RMA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||
WGWUT-2ULQ-P7![]() | WGWUT-2ULQ-P7 |
| Leadtime 2-3 weeks | Multicore | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
MR0ZF-XW0F-34![]() | MR0ZF-XW0F-34 |
| Leadtime 2 3 weeks | Multicore | 63 37 381 5C 0.56MM 0.25KG AM | * | Active | ||||||||||||||||||||||||
MC8K2-2S-VTN![]() | MC8K2-2S-VTN |
| Leadtime 2 3 weeks | Micro Measurements Division of Vishay Precision Group | 450 20R SOLDER TIN ANTIMONY, 1 P | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn95Sb5 95 5 | 24 AWG, 25 SWG | 0.02 0.51mm | Spool, 454g 1 lb | 450 ~ 460°F 232 ~ 238°C | |||||||||||||||||
I32PC-W8-HR![]() | I32PC-W8-HR | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
W5RR-DP-HI8![]() | W5RR-DP-HI8 |
| Leadtime 2-3 weeks | Multicore | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
K7S0O-DRYS-NK![]() | K7S0O-DRYS-NK |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN 21AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
RSEY-KH-64![]() | RSEY-KH-64 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST WATR SOL SAC305 T4 250G | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
ON0OU-VI-VHM![]() | ON0OU-VI-VHM |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .015 28AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
UH-1OF-NI4![]() | UH-1OF-NI4 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER SOLID WIRE 16AWG 60 40 | Active | Leaded | Wire Solder | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | Spool, 454g 1 lb | |||||||||||||||||||
ZA-QUP1-M0![]() | ZA-QUP1-M0 |
| Leadtime 2-3 weeks | Aven Tools | SOLDER 1MM 100G | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Spool, 100g 3.5 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
8Z6S-7MLN-N9![]() | 8Z6S-7MLN-N9 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .025 23AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
XKKVW-EA2-M2![]() | XKKVW-EA2-M2 |
| Leadtime 2-3 weeks | Multicore | 60 40 370 5C 1.22MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
AB-B9-MHR | AB-B9-MHR |
| Leadtime 2-3 weeks | Kester Solder | SOLDER NO-CLEAN 19AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
NRQ-LGCH-ZL![]() | NRQ-LGCH-ZL |
| Leadtime 2-3 weeks | Multicore | 60 40 370 3% .064DIA. 16SWG | 370 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
QS3Y0-TB-I5O![]() | QS3Y0-TB-I5O |
| Leadtime 2-3 weeks | Multicore | 63 37 400 1% .032DIA 21SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
MKV3-HTX-52L | MKV3-HTX-52L |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
F24AI-KQU-XGR![]() | F24AI-KQU-XGR |
| Leadtime 2 3 weeks | Chip Quik Inc. | SLD PASTE LF WATER SOL T5 10CC | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
P2T2-39F-KI![]() | P2T2-39F-KI |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 60 40 .032 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
EKMP-NB-EP![]() | EKMP-NB-EP |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOLUABLE 25AWG 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
B036-UTD-HN8![]() | B036-UTD-HN8 |
| Leadtime 2-3 weeks | Multicore | 97SC HYDROX3C 0.81MM 0.5KG.032 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
1NW-WP-T0![]() | 1NW-WP-T0 |
| Leadtime 2-3 weeks | Multicore | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
3D-6A-6G![]() | 3D-6A-6G |
| Leadtime 2 3 weeks | Multicore | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
98RK-CYF-YN![]() | 98RK-CYF-YN |
| Leadtime 2 3 weeks | Kester Solder | SOLDER SOLID WIRE 16AWG 60 40 | Active | Leaded | Wire Solder | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | Spool, 454g 1 lb |