Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
8YN7X-IR-94F![]() | 8YN7X-IR-94F |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||||
71-W5-KMT![]() | 71-W5-KMT |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE 63 37 T5 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
F0LI-E4-ZT![]() | F0LI-E4-ZT |
| Leadtime 2-3 weeks | Multicore | 96S ARAX 4C 1.6MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
SN-9MZZ-1PD![]() | SN-9MZZ-1PD |
| Leadtime 2-3 weeks | Multicore | 63 37 400 2% .048DIA 18SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.048 1.22mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
CLRJ-BS-VNT![]() | CLRJ-BS-VNT |
| Leadtime 2 3 weeks | Multicore | 99C BAR SOLDER 2LB | Obsolete | Lead Free | Bar Solder | Sn99.3Cu0.7 99.3 0.7 | Bar, 907g 2 lb | 440°F 227°C | No Shelf Life | |||||||||||||||||||
I9-IH-KL7![]() | I9-IH-KL7 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
AYBFS-SMQZ-GHF![]() | AYBFS-SMQZ-GHF |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 28AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
A5CH-BU4-TWA![]() | A5CH-BU4-TWA |
| Leadtime 2-3 weeks | Multicore | 60 40 370 5C 1.22MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
WCD55-QU8-NK2![]() | WCD55-QU8-NK2 |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER NO-CLEAN 60 40 POCKET PK | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Tube, 18g 0.6 oz | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
JMO8-7T-RS![]() | JMO8-7T-RS |
| Leadtime 2-3 weeks | Multicore | 97SC C511 2% .022DIA 23AWG 24SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
SHQPY-H9-XF![]() | SHQPY-H9-XF |
| Leadtime 2-3 weeks | Multicore | 96S C400 5C 0.56MM 0.5KG AM | C400 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
WGLJ-FZX2-2LM![]() | WGLJ-FZX2-2LM |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
8A-2K4-UG![]() | 8A-2K4-UG |
| Leadtime 2-3 weeks | Multicore | 97SC C511 2% .022DIA 23AWG 24SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
UV0-2ITF-LWR![]() | UV0-2ITF-LWR |
| Leadtime 2 3 weeks | Multicore | 60 40C511 3C 1.63MM AF 2.5KG AM | * | Active | ||||||||||||||||||||||||
3VWM-5Y5I-06![]() | 3VWM-5Y5I-06 |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE NO CLEAN 63 37 500GM | Easy Profile® | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
MJGQT-FW2J-ZHA![]() | MJGQT-FW2J-ZHA | Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 23AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
E0-3YV1-12![]() | E0-3YV1-12 | Leadtime 2 3 weeks | Easy Braid Co. | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
ER-CF38-VNQ![]() | ER-CF38-VNQ |
| Leadtime 2-3 weeks | Kester Solder | SOLDER NO-CLEAN .020 25AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
7P-MSO-1GE![]() | 7P-MSO-1GE |
| Leadtime 2-3 weeks | Multicore | 60 40 370 3% .015DIA. 28SWG | 370 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.033 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
NKMPZ-0M3-FSL![]() | NKMPZ-0M3-FSL | Leadtime 2 3 weeks | Kester Solder | SOLDER RA FLUX 23AWG 60 40 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
J239-B8-2D1 | J239-B8-2D1 |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
JXM-OI-EA![]() | JXM-OI-EA |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
OZ-LAGT-VR![]() | OZ-LAGT-VR | Leadtime 2 3 weeks | Kester Solder | SOLDER RA FLUX 21AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
W199-RFH2-1F![]() | W199-RFH2-1F |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER NO-CLEAN 60 40 POCKET PK | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Tube, 18g 0.6 oz | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
VQ-MOPO-JL![]() | VQ-MOPO-JL |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE TWO PART MIX | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 15g 0.5 oz | 423 ~ 428°F 217 ~ 220°C | 24 Months Date of Manufacture Unmixed |