Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
8L-55S1-5IO![]() | 8L-55S1-5IO |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOL 16AWG 63 37 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
OV-7WT-2D![]() | OV-7WT-2D |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN 21AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
00OS-47PB-G6K | 00OS-47PB-G6K |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
ZFRM-KG-QU![]() | ZFRM-KG-QU | Leadtime 2-3 weeks | Easy Braid Co. | SOLDER NO-CLEAN ANTISTAT .031 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
Y7-2O-3NN![]() | Y7-2O-3NN |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
HT-EJT3-ICS![]() | HT-EJT3-ICS |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
IWLE-OK-FG![]() | IWLE-OK-FG |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 58 .015 28AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
BKZMW-SRE-SIU![]() | BKZMW-SRE-SIU |
| Leadtime 2-3 weeks | Multicore | SAC0307 HF212AGS88.5 | - | Active | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Bar, 1.1kg 2.5lbs | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
N0YL7-2MA6-UR![]() | N0YL7-2MA6-UR |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST NO-CLEAN SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
NSW-GM9U-7I![]() | NSW-GM9U-7I | Leadtime 2 3 weeks | Kester Solder | SOLDER 500G JAR,SN96.5 AG3.0 | Obsolete | Lead Free | Solder Paste | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 500g 17 oz | ||||||||||||||||||||||
KJ-47-VT | KJ-47-VT |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOLUABLE 21AWG 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
GQ-D6-ZRF![]() | GQ-D6-ZRF |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 60 40 .025 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
9RVJ-XW6-5BL![]() | 9RVJ-XW6-5BL |
| Leadtime 2-3 weeks | Multicore | 97SC LF620 DAP89V | LF620M | Active | Lead Free | Solder Paste | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
3X-0OWB-15B![]() | 3X-0OWB-15B | Leadtime 2 3 weeks | Kester Solder | SOLDER 500G JAR,SN96.5 AG3.0 | Obsolete | Lead Free | Solder Paste | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 500g 17 oz | ||||||||||||||||||||||
XLKV-EN-JV![]() | XLKV-EN-JV |
| Leadtime 2-3 weeks | Multicore | 99C BAR SOLDER 2LB | - | Obsolete | Lead Free | Bar Solder | - | Sn99.3Cu0.7 99.3 0.7 | - | - | - | Bar, 907g 2 lb | 440°F 227°C | No Shelf Life | ||||||||||||||
HQJ-M6V6-C6![]() | HQJ-M6V6-C6 | Leadtime 2-3 weeks | Kester Solder | SOLDER RA FLUX 21AWG 60 40 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
JWUX-2WF-PIW![]() | JWUX-2WF-PIW |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
FP-B95-3J![]() | FP-B95-3J |
| Leadtime 2-3 weeks | Multicore | 63 37 400 2% .015DIA 28SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
S5-OV5-YDM![]() | S5-OV5-YDM |
| Leadtime 2 3 weeks | MG Chemicals | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
8A-BO9F-0AO![]() | 8A-BO9F-0AO |
| Leadtime 2-3 weeks | Kester Solder | SOLDER 66 .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
1QT8-6EQQ-22![]() | 1QT8-6EQQ-22 |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOLUABLE 25AWG 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
HZ-IW-1K![]() | HZ-IW-1K |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
TF2U5-UJ-2Z![]() | TF2U5-UJ-2Z |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LOW TEMP 5CC W TIP | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Syringe, 15g 0.5 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
HBZA-798S-5CO![]() | HBZA-798S-5CO |
| Leadtime 2 3 weeks | Multicore | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
E2-1PJ5-I1![]() | E2-1PJ5-I1 |
| Leadtime 2-3 weeks | Kester Solder | SOLDERPASTE WATER SOLUABLE 500GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated |