Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
733002 | 733002 |
| Leadtime 2-3 weeks | CDHF-WJG-HW6 | 97SC C511 2% .032DIA 21SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
0XO-35K-X76![]() | 0XO-35K-X76 |
| Leadtime 2 3 weeks | OJ5-3BTN-93Z | SOLDER 66 .025 23AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
FA-WA65-5E5![]() | FA-WA65-5E5 |
| Leadtime 2 3 weeks | WZ-F0H4-3C | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
LZ 4R 73M![]() | LZ 4R 73M | Leadtime 2 3 weeks | LLFF3-0ET-7E | SOLDER RA FLUX 21AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
SE-JLHV-I8![]() | SE-JLHV-I8 |
| Leadtime 2 3 weeks | ORL9-L8-8I7 | 96SC C502 5C 0.38MM 0.25KG.015 | C502 | Active | Wire Solder | No Clean | No Shelf Life | |||||||||||||||||||||
2CZMT-9AAK-9MC![]() | 2CZMT-9AAK-9MC |
| Leadtime 2-3 weeks | H1UBD-SL2P-TJA | SOLDER RA 63 37 .032 PKT PACK | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Tube, 18g 0.6 oz | 361°F 183°C | No Shelf Life | ||||||||||||||
RW-1PZ-4N2![]() | RW-1PZ-4N2 |
| Leadtime 2 3 weeks | J1YH-BER-EG | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 | |||||||||||||||||||||
KZB5-I3Z-RK![]() | KZB5-I3Z-RK | Leadtime 2 3 weeks | CZG98-ZSUO-5H2 | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
DQ YYX W0W![]() | DQ YYX W0W | Leadtime 2 3 weeks | YKC-6R1P-4J1 | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
412188![]() | 412188 |
| 8 | 8GRKW-YASB-3Y | 96SC C502 5C 0.38MM 0.25KG.015 | C502 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
DAJSK-FX8-JF0![]() | DAJSK-FX8-JF0 |
| Leadtime 2-3 weeks | KE5KZ-U0-SZM | SOLDER PASTE NO-CLEAN 10CC SYR | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
1V-KXT-TSG | 1V-KXT-TSG |
| Leadtime 2-3 weeks | D4D-AM-VMX | SOLDER BAR 1.66LB SN96.5AG3CU0.5 | ULTRAPURE® | Active | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Bar, 750g 1 2 3 lbs | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
71 24OC ZDB![]() | 71 24OC ZDB |
| Leadtime 2 3 weeks | NYQ-48UV-FX | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
4933-454G | 4933-454G |
| 70 | 70TLZ-3YG6-KZ0 | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
SMD291AX![]() | SMD291AX |
| Leadtime 2-3 weeks | G96H-R6L3-X61 | SOLDER PASTE NO-CLEAN 63 37 5CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 5cc, 15g 0.5 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
673828![]() | 673828 |
| Leadtime 2-3 weeks | YH4-4T-PO | 97SC 400 2% .022DIA 24SWG | C400 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
23-6337-0007![]() | 23-6337-0007 | 31 | 31T-03-Q6 | SOLDER RA FLUX 28AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
ZRKT2-TG-RS![]() | ZRKT2-TG-RS |
| Leadtime 2-3 weeks | RKH-PL-NBU | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
5J7X4-JZ4-0YD![]() | 5J7X4-JZ4-0YD |
| Leadtime 2-3 weeks | CM-MP-LV | SOLDER PASTE LOW TEMP T4 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
7021020510![]() | 7021020510 |
| Leadtime 2-3 weeks | R6HY-0D-33 | R562 SOLDERPASTE WATER SOL 500G | R562 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
83-C4V-C2![]() | 83-C4V-C2 |
| 56 | 56-4A55-YP7 | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
4894-454G![]() | 4894-454G |
| Leadtime 2-3 weeks | SP-AKV0-7Z | SOLDER RA 60 40 .025 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
7W ALTS BK![]() | 7W ALTS BK |
| Leadtime 2 3 weeks | TLK-2YS8-SE | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
0E7W6-USB-HC![]() | 0E7W6-USB-HC |
| Leadtime 2-3 weeks | HBP4Y-JY-F2 | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
4925-454G | 4925-454G |
| Leadtime 2-3 weeks | Z7-1A-HV5 | SOLDER LF SAC305 RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - |