Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
61-R7-568 | 61-R7-568 |
| Leadtime 2 3 weeks | ZR3K-BKR-GEW | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
QU-RG-D6![]() | QU-RG-D6 |
| Leadtime 2-3 weeks | LNNOJ-V8-6S4 | LOCTITE GC 10 SAC305T4 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
0O-6W-M4Z![]() | 0O-6W-M4Z |
| 6 | 6RH3G-8Y-3S | SOLDER PASTE NO CLEAN 10CC SYR | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
SC-K59-J3D | SC-K59-J3D |
| Leadtime 2 3 weeks | HA7B-X2-0M | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
D5P-KHR-AV![]() | D5P-KHR-AV | Leadtime 2-3 weeks | J7-8CR-LA | SOLDER NO-CLEAN ANTISTAT .031 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
SMD291SNL250T5![]() | SMD291SNL250T5 |
| Leadtime 2-3 weeks | CQUCS-NA-JP | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
BG4F-P11I-QP![]() | BG4F-P11I-QP |
| Leadtime 2-3 weeks | IZ-L0B-82 | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
R9FMI A70F RE | R9FMI A70F RE |
| Leadtime 2 3 weeks | ZBO6-ED9-WA | SOLDER PASTE SN42 BI57.6 AG0.4 L | Active | Lead Free | Solder Paste | No Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
9RVJ-XW6-5BL![]() | 9RVJ-XW6-5BL |
| 6 | 6X-2R-1W | 97SC LF620 DAP89V | LF620M | Active | Lead Free | Solder Paste | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
SEZI-46E-CF0![]() | SEZI-46E-CF0 |
| Leadtime 2-3 weeks | B9X-0A-64 | SOLDER 66 .025 23AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
IJIP-ZO-GYF![]() | IJIP-ZO-GYF | 258 | 258-GX1-KB | SOLDER SPHERES SAC305 .024 DIAM | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
BD3Q-07-AR![]() | BD3Q-07-AR |
| 2 | 2K-L9N-0J | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
SMD291SNL500T5 | SMD291SNL500T5 |
| Leadtime 2-3 weeks | PTF-J0-I9S | SOLDER PASTE SAC305 500G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
W5MHM-YPL8-W4B![]() | W5MHM-YPL8-W4B |
| Leadtime 2-3 weeks | W5P-T8-XN | SOLDER PASTE SAC305 T5 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
N2-IR3-YA![]() | N2-IR3-YA |
| 9 | 9AW-P2P-81 | SOLDER NO CLEAN .020 25AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
GBYU PFR 22![]() | GBYU PFR 22 |
| Leadtime 2 3 weeks | U3MH-R292-G28 | SOLDER NO CLEAN .050 18AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
24-7068-1400![]() | 24-7068-1400 |
| Leadtime 2-3 weeks | LZ99-G0IS-4PY | SOLDER RA .062 16AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
W3P-24-CF![]() | W3P-24-CF |
| Leadtime 2-3 weeks | A17KK-44-U8 | SOLDER 66 .031 22AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
BAO3I-0LS-NDX![]() | BAO3I-0LS-NDX |
| 6 | 6T8-6TJ-VI | SOLDER 66 .020 24AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
SMD2200-25000![]() | SMD2200-25000 | Leadtime 2-3 weeks | XQQ8-7UV-ODL | SOLDER SPHERES SN63 PB37 .024 D | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
VQ-MOPO-JL![]() | VQ-MOPO-JL |
| Leadtime 2 3 weeks | E31A-XD-AGB | SOLDER PASTE TWO PART MIX | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 15g 0.5 oz | 423 ~ 428°F 217 ~ 220°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||||||
IEP-HX5-CH![]() | IEP-HX5-CH |
| Leadtime 2-3 weeks | GDS2H-8SG-9ZI | SOLDER RA 63 37 .062 1 2 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
18WD3-JSX-VQP![]() | 18WD3-JSX-VQP |
| 7 | 7C-ITM-KTN | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
386827![]() | 386827 |
| Leadtime 2-3 weeks | KC-U14-V8 | 60 40 370 3% .032DIA. 21SWG | 370 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
TSP1A-A6C-T3![]() | TSP1A-A6C-T3 |
| Leadtime 2 3 weeks | VRYD0-VZ-RUP | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture |