Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
KEW1-0B0V-FR![]() | KEW1-0B0V-FR |
| 3 | 3VQT-SZ1J-UT | SOLDER NO CLEAN .062 16AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
K2S-69HO-RT1![]() | K2S-69HO-RT1 |
| Leadtime 2 3 weeks | Q77YE-3C3R-2D | 96SC C502 5C 0.38MM 0.25KG.015 | C502 | Active | Wire Solder | No Clean | No Shelf Life | |||||||||||||||||||||
8A-BO9F-0AO![]() | 8A-BO9F-0AO |
| Leadtime 2-3 weeks | G2-8OA-JXM | SOLDER 66 .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
Z20 UC BTW![]() | Z20 UC BTW |
| 19 | 19-TIS-NL | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
4Q-DU-UA![]() | 4Q-DU-UA |
| Leadtime 2-3 weeks | XFA9K-ZI-NC2 | 96SC C511 3C 1.02MM 0.5KG .040 | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
ZUMS P5E QJ![]() | ZUMS P5E QJ |
| Leadtime 2 3 weeks | OIUC-JGEK-ND | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
397952![]() | 397952 |
| Leadtime 2-3 weeks | IW1-VS-96 | HMP 366 3% .022DIA. 24SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.033 | Spool, 227g 1 2 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
Y7-2O-3NN![]() | Y7-2O-3NN |
| 5 | 5V-M0-RKA | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
SMD291AX500T4C![]() | SMD291AX500T4C |
| Leadtime 2-3 weeks | AD7H-7A-OS | SOLDER PASTE 63 37 T4 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
2023641![]() | 2023641 |
| Leadtime 2-3 weeks | MXW05-DLY-GO | LOCTITE GC 10 SAC305T3 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Cartridge, 600g 21 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
Z9-7VU-0AI![]() | Z9-7VU-0AI |
| Leadtime 2-3 weeks | P8G-KS-DWD | HMP 366 3% .028DIA. 22SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 21 AWG, 22 SWG | 0.028 0.71mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
24-6337-7600![]() | 24-6337-7600 |
| Leadtime 2-3 weeks | OIS9-GOJS-ZO | SOLDER 63 37 21AWG 1LB | 275 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
4935-454G | 4935-454G |
| Leadtime 2-3 weeks | GEF0-1JO-LU | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
7021020510![]() | 7021020510 |
| Leadtime 2-3 weeks | W5A-DA9V-77 | R562 SOLDERPASTE WATER SOL 500G | R562 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
QN2A-MSN3-17O | QN2A-MSN3-17O |
| Leadtime 2-3 weeks | D3Q-BI-9AC | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
F1R TOU 514![]() | F1R TOU 514 |
| Leadtime 2 3 weeks | CB-O2F-PJB | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 | |||||||||||||||||||||
AMLW-ZADH-E0![]() | AMLW-ZADH-E0 | 1 | 1AI2H-86-7I | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
16-6040-0031![]() | 16-6040-0031 |
| Leadtime 2-3 weeks | L3S-AUF6-T1 | SOLDER 60 40 21AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.031 0.79mm | - | - | - | 36 Months Date of Manufacture | ||||||||||||||
I0-O5X-E6D![]() | I0-O5X-E6D |
| Leadtime 2 3 weeks | KN5-4UO-ABF | SOLDER RA 60 40 .032 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
6N5IT-DN-JK | 6N5IT-DN-JK |
| 259 | 259C-UI-6K | SOLDER RA .031 21AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
395467![]() | 395467 |
| Leadtime 2-3 weeks | DCTE-T7-NST | 60 40 370 5C 1.22MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
L54-3HYW-HXD![]() | L54-3HYW-HXD |
| Leadtime 2-3 weeks | RA-TOJ-HY | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
6R1-MYE-B7![]() | 6R1-MYE-B7 | 9 | 9AUQB-9UW-53 | SOLDER NO-CLEAN ANTISTAT .020 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
FS-QO-0Y![]() | FS-QO-0Y |
| Leadtime 2 3 weeks | MKJ-GREO-SY | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
6IAZ-L4SS-ZNU![]() | 6IAZ-L4SS-ZNU |
| 9 | 9WV-RA98-BK | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated |