Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1QEF5-JE1K-HZ![]() | 1QEF5-JE1K-HZ |
| Leadtime 2-3 weeks | 7E-9VNU-ULQ | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
24-6337-8809![]() | 24-6337-8809 |
| Leadtime 2-3 weeks | LX9-NXK-WPI | SOLDER NO-CLEAN 23AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
XY-W5C-CJ![]() | XY-W5C-CJ |
| 1 | 1WXB-XF05-ARH | 96S C400 5C 0.56MM 0.5KG AM | C400 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
24-7068-7617 | 24-7068-7617 |
| 7 | 7H3-SR-K5 | SOLDER NO-CLEAN .025 23AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
24-9574-1406![]() | 24-9574-1406 |
| Leadtime 2-3 weeks | G5PU-24-OH | SOLDER 66 .025 23AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
6IAZ-L4SS-ZNU![]() | 6IAZ-L4SS-ZNU |
| 4 | 4GY-EH-ALM | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD4300SNL250T4![]() | SMD4300SNL250T4 |
| Leadtime 2-3 weeks | MFCG-II-TN | SLDR PST WATR SOL SAC305 T4 250G | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
MOJ9 3X TCR![]() | MOJ9 3X TCR |
| 4 | 4H1Y-PCJE-OS | SLD PASTE LF WATER SOL T5 10CC | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
XF0Q-3Q-UF![]() | XF0Q-3Q-UF | Leadtime 2 3 weeks | SO-WS9F-JXY | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
5PD3T-ESQ-VVJ | 5PD3T-ESQ-VVJ |
| Leadtime 2-3 weeks | 0C-G94-EY | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
6K1LH-SJL-SI6![]() | 6K1LH-SJL-SI6 | Leadtime 2-3 weeks | YY56L-5KG-4RK | SOLDER SPHERES SAC305 .024 DIAM | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
87-EB-L2![]() | 87-EB-L2 |
| Leadtime 2-3 weeks | TRP6P-6G-233 | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
64S-DK-WE![]() | 64S-DK-WE | 3 | 3P-E08-M6D | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
XKKVW-EA2-M2![]() | XKKVW-EA2-M2 |
| Leadtime 2-3 weeks | BY2X-JBG6-ZY9 | 60 40 370 5C 1.22MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
HSH67-DW-JSU![]() | HSH67-DW-JSU |
| Leadtime 2 3 weeks | OL-TLJ-U2 | 97SC 400 2% .064DIA 16SWG | C400 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
ZA-QUP1-M0![]() | ZA-QUP1-M0 |
| 1 | 1MRKM-8KF-2F | SOLDER 1MM 100G | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Spool, 100g 3.5 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
58-T4-DP![]() | 58-T4-DP |
| 39 | 39-MD-OGL | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
W4-FG-YA5![]() | W4-FG-YA5 |
| Leadtime 2-3 weeks | G775-Z4R9-3SW | 63 37 400 2% .015DIA 28SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
Y3ENS-AU-SEX![]() | Y3ENS-AU-SEX |
| 3 | 3Q-YVR-CM2 | SOLDER RA 60 40 .040 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
I9-IH-KL7![]() | I9-IH-KL7 |
| Leadtime 2-3 weeks | F0W48-IP-AXU | SOLDER 66 .031 22AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
D5P-KHR-AV![]() | D5P-KHR-AV | 3 | 3J-E2T-K0R | SOLDER NO-CLEAN ANTISTAT .031 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
733010![]() | 733010 | Leadtime 2-3 weeks | S8-5QKY-80 | 96SC C511 3C 0.81MM 0.5KG .032 | * | Obsolete | - | - | No-Clean | - | - | - | - | - | - | No Shelf Life | |||||||||||||||
NK-WMKT-2P![]() | NK-WMKT-2P |
| Leadtime 2-3 weeks | SEU-XU-DK | SLD WIRE NO-CLEAN 96.5 3 .5 1OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
M3GVT-S1-PXO![]() | M3GVT-S1-PXO |
| Leadtime 2-3 weeks | WW2GW-ZFG-P2F | SOLDER 66 .020 24AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
0E7W6-USB-HC![]() | 0E7W6-USB-HC |
| Leadtime 2-3 weeks | WL-L3LV-D5 | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated |