Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SMD291AX10T5![]() | SMD291AX10T5 |
| Leadtime 2-3 weeks | GKT-CGY-4Z | SOLDER PASTE NO CLEAN T5 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
42-3F-OF0![]() | 42-3F-OF0 |
| Leadtime 2 3 weeks | FOR-5WEV-GU | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
DQ YYX W0W![]() | DQ YYX W0W | 2 | 2V52K-MMDU-V1Y | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
9OR VY 7J![]() | 9OR VY 7J |
| 666 | 666-TVC-HO | SLD WIRE NO CLEAN 96.5 3 .5 1OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 28g 1 oz | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
SMD291AX10![]() | SMD291AX10 |
| Leadtime 2-3 weeks | IGH-PWB-8UC | SOLDER PASTE NO-CLEAN 63 37 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
SMDSW.031 2OZ![]() | SMDSW.031 2OZ |
| Leadtime 2-3 weeks | LM-ZH68-9IK | SOLDER WIRE NO-CLEAN 63 37 2OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 361°F 183°C | - | ||||||||||||||
24-6337-0010 | 24-6337-0010 |
| Leadtime 2-3 weeks | LHTY-EX-NT4 | SOLDER RA 25AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
24-7068-7601![]() | 24-7068-7601 |
| Leadtime 2-3 weeks | VP16-OU5I-MB | SOLDER NO-CLEAN .031 21 AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
VQ5Q-LT-LPE![]() | VQ5Q-LT-LPE |
| Leadtime 2-3 weeks | OWG2A-2X-8FX | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
9I6-09O-VA![]() | 9I6-09O-VA |
| 919 | 919V8-AAMH-KR | SLD WIRE NO-CLEAN 96.5 3 .5 2OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
4T1EP-F6A-NK![]() | 4T1EP-F6A-NK |
| Leadtime 2-3 weeks | QC8-U676-XO | SLDR PST NO-CLEAN 63 37 T4 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
4888-454G | 4888-454G |
| 9 | 9TF-0B6A-1ZA | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
7T2B-YKWT-L5 | 7T2B-YKWT-L5 |
| Leadtime 2-3 weeks | MV-II-FD | SOLDER PASTE SN63 PB37 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
JAX-AN-M9K![]() | JAX-AN-M9K |
| Leadtime 2 3 weeks | HOJ3-WA-YW | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
P1-V6-HCD![]() | P1-V6-HCD |
| 13 | 13T5J-HYI-HU | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
24-9574-1404![]() | 24-9574-1404 |
| 6 | 6YXBJ-8Y-XK | SOLDER 66 .050 18AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
F1R TOU 514![]() | F1R TOU 514 |
| Leadtime 2 3 weeks | BKS2-58MY-SSN | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 | |||||||||||||||||||||
PUFQ JC W6![]() | PUFQ JC W6 |
| Leadtime 2 3 weeks | D4-D6C-FDN | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
23-6337-8806![]() | 23-6337-8806 | Leadtime 2-3 weeks | QW3-JC-LL | SOLDER NO-CLEAN 28AWG 63 37 .5LB | 245 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.011 | Spool, 227g 1 2 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||
KEW1-0B0V-FR![]() | KEW1-0B0V-FR |
| Leadtime 2 3 weeks | QU-0J-2P | SOLDER NO CLEAN .062 16AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
2DV0-T50C-H1 | 2DV0-T50C-H1 |
| 1 | 1CVA-Y7-67V | SOLDER WATER SOL .062 16AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
1051209![]() | 1051209 |
| 5 | 5A-US50-T9B | 63S4 MP218 ACP89V PASTE | MP218 | Active | Leaded | Solder Paste | No-Clean | - | - | - | - | - | - | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
NHD-QX1X-7N![]() | NHD-QX1X-7N |
| Leadtime 2-3 weeks | RKV8-78V-F8 | 63 37 CRYSL 502 2% .022DIA 24SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
SS-S020![]() | SS-S020 | Leadtime 2-3 weeks | U0-8NH-RY | SOLDER WATER SOL .020 X 25 | - | Obsolete | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
R9FMI A70F RE | R9FMI A70F RE |
| Leadtime 2 3 weeks | EUJR-4Q-RCY | SOLDER PASTE SN42 BI57.6 AG0.4 L | Active | Lead Free | Solder Paste | No Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated |