Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TGBK1-07-SIG![]() | TGBK1-07-SIG |
| Leadtime 2 3 weeks | WLG-22Z-Z3 | 1240 FPA SILVER SOLDER PASTE | Active | Lead Free | Solder Paste | Ag40Cu30Zn28Ni2 40 30 28 2 | Jar, 28g 1 oz | 1220 ~ 1435°F 660 ~ 780°C | 9 Months Date of Manufacture | |||||||||||||||||||
P8-DN-2UW![]() | P8-DN-2UW | Leadtime 2 3 weeks | 0Y8GK-M8S-NE | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
24-6337-8806![]() | 24-6337-8806 |
| Leadtime 2-3 weeks | JDM0X-RFV-X5R | SOLDER NO-CLEAN 28AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
317RZ-NUI5-WNK![]() | 317RZ-NUI5-WNK |
| Leadtime 2 3 weeks | NRK-S3-AHN | SOLDER WIRE NO CLEAN 63 37 1OZ. | Active | Leaded | Wire Solder | No Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | ||||||||||||||||
0E7W6-USB-HC![]() | 0E7W6-USB-HC |
| Leadtime 2-3 weeks | 0AT-R9H-OBL | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
18WD3-JSX-VQP![]() | 18WD3-JSX-VQP |
| Leadtime 2-3 weeks | H1-HXF-55 | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
733002 | 733002 |
| Leadtime 2-3 weeks | TT6YG-MAI-HB | 97SC C511 2% .032DIA 21SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
SS-S020AS![]() | SS-S020AS | Leadtime 2-3 weeks | C6T-JKP-V48 | SOLDER WATER SOL ANTIST .020X25 | - | Obsolete | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
1638D HRC Y3A![]() | 1638D HRC Y3A |
| Leadtime 2 3 weeks | A780W-NHD-Z0 | SLD WIRE NO CLEAN 96.5 3 .5 1OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 28g 1 oz | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
KO-NU67-9TU![]() | KO-NU67-9TU |
| Leadtime 2-3 weeks | IMZX-2W-WN9 | SOLDER PASTE HF 212 - 600GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
389289![]() | 389289 |
| Leadtime 2-3 weeks | OF-LNH-GB | 63 37 370 5C 0.38MM 0.25KG.015 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
55I6Y-CQ3R-AP![]() | 55I6Y-CQ3R-AP |
| Leadtime 2-3 weeks | G5-5N7M-O0 | 96SC C400 3C 0.56MM 0.25KG.022 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
386827![]() | 386827 |
| Leadtime 2-3 weeks | LCW-F8ZG-P5 | 60 40 370 3% .032DIA. 21SWG | 370 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
23-6337-8806![]() | 23-6337-8806 | Leadtime 2-3 weeks | VB-7VGX-YR0 | SOLDER NO-CLEAN 28AWG 63 37 .5LB | 245 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.011 | Spool, 227g 1 2 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||
SMD2190-25000![]() | SMD2190-25000 | Leadtime 2-3 weeks | U9KN-9F-LBX | SOLDER SPHERES SN63 PB37 .020 D | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
87Z EO4S HA | 87Z EO4S HA |
| 4 | 4KT71-1T-8ZT | SOLDER NO CLEAN 18AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
44D-MA-IN![]() | 44D-MA-IN |
| Leadtime 2-3 weeks | MESS3-FWB8-8HR | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
K3M2Y-3I00-V7I![]() | K3M2Y-3I00-V7I |
| Leadtime 2-3 weeks | KA-M1E2-M4 | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
65FO7-54-NIR![]() | 65FO7-54-NIR | Leadtime 2 3 weeks | MR-L5N-7IP | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
39E-306F-T0![]() | 39E-306F-T0 |
| Leadtime 2-3 weeks | F89-H3D-JOW | SOLDERPAST NO CLEAN 63 37 1000GM | Easy Profile® | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Cartridge, 1000g 35 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
E2-1PJ5-I1![]() | E2-1PJ5-I1 |
| Leadtime 2-3 weeks | NIX-7W6Z-CX | SOLDERPASTE WATER SOLUABLE 500GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
8E7EL-AQ3-RIA![]() | 8E7EL-AQ3-RIA |
| 31 | 31-UP-AR | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
EHGO-A4-X7![]() | EHGO-A4-X7 |
| Leadtime 2 3 weeks | M7G-I7U-VZV | SOLDER WIRE NO CLEAN 63 37 2OZ. | Active | Leaded | Wire Solder | No Clean, Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 57g 2 oz | 361°F 183°C | ||||||||||||||||
24-9574-1404![]() | 24-9574-1404 |
| 399 | 399-TP-7EP | SOLDER 66 .050 18AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
SMD2165![]() | SMD2165 |
| 642 | 642ST-56A-OHF | SOLDER SPHERES 63 37 .012 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - |