Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
0XO-35K-X76![]() | 0XO-35K-X76 |
| Leadtime 2 3 weeks | Z0-JG-IX | SOLDER 66 .025 23AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
K7S0O-DRYS-NK![]() | K7S0O-DRYS-NK |
| Leadtime 2 3 weeks | OZ-KE-E0J | SOLDER NO CLEAN 21AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
8I-HF-TMJ | 8I-HF-TMJ |
| Leadtime 2-3 weeks | QD-F11-LCJ | SLD WIRE NO-CLEAN 96.5 3 .5 4OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
FU3-QPKL-MY![]() | FU3-QPKL-MY | Leadtime 2 3 weeks | NNYT8-XO4-VV | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
VYG1X-ZF-YJH![]() | VYG1X-ZF-YJH |
| Leadtime 2-3 weeks | VVBSZ-YJ-BG9 | 60 40 370 5C 1.22MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
N5R F1 QZ3![]() | N5R F1 QZ3 |
| 3 | 3ZQMI-TTT-X70 | SOLDER RA 60 40 .025 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
TNP-JG-QWY![]() | TNP-JG-QWY |
| Leadtime 2 3 weeks | BK-CJ3I-8R | SOLDER PASTE SN63 PB37 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
PPE-ZAWJ-TUO![]() | PPE-ZAWJ-TUO |
| Leadtime 2-3 weeks | YVO-245-YB | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
PUP-OD10-TXW![]() | PUP-OD10-TXW |
| 3 | 3J1T-JZ-LQ | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
4QR C7QR 7E![]() | 4QR C7QR 7E |
| 32 | 32-4T-BTX | SOLDER RA 60 40 .032 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
4865-454G![]() | 4865-454G |
| Leadtime 2-3 weeks | JQ-MRRI-H35 | SOLDER NO-CLEAN 63 37 1 LB | 4860 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
RW-1PZ-4N2![]() | RW-1PZ-4N2 |
| Leadtime 2 3 weeks | UQ-BH-09Y | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 | |||||||||||||||||||||
W5MHM-YPL8-W4B![]() | W5MHM-YPL8-W4B |
| Leadtime 2-3 weeks | 0F1-FNQ2-ZX | SOLDER PASTE SAC305 T5 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
22GLZ-YLMI-A0X![]() | 22GLZ-YLMI-A0X |
| Leadtime 2-3 weeks | XA-O06H-W06 | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
U75R-2VU-8P | U75R-2VU-8P |
| Leadtime 2-3 weeks | RR9-ID-DV | SOLDER SOLID WIRE 21AWG 63 37 | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | - | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
4884-454G | 4884-454G |
| Leadtime 2-3 weeks | ZHAOM-V987-UGP | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
7W ALTS BK![]() | 7W ALTS BK |
| Leadtime 2 3 weeks | 0K-R91-RGK | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
QGL-LZ-63![]() | QGL-LZ-63 |
| Leadtime 2-3 weeks | FOZ-7B4-9Y | LOCTITE GC 10 SAC305T3 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Cartridge, 600g 21 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
4875-227G![]() | 4875-227G |
| Leadtime 2-3 weeks | TLA5Q-G0-KL | SOLDER NO-CLEAN 60 40 1 2 LB | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
EKMP-NB-EP![]() | EKMP-NB-EP |
| 76 | 76G-OW-MAK | SOLDER WATER SOLUABLE 25AWG 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
9I6-09O-VA![]() | 9I6-09O-VA |
| 14 | 14ZGT-PZ8-I9 | SLD WIRE NO-CLEAN 96.5 3 .5 2OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
LJ10-DBF-SW![]() | LJ10-DBF-SW |
| Leadtime 2-3 weeks | CD-4V-FP7 | 63 37 400 1% .032DIA 21SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
XPUG2 BV R3R![]() | XPUG2 BV R3R |
| Leadtime 2 3 weeks | PSWP-IMZ-IN | 63 37 400 1% .064DIA 16SWG | C400 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
QGL-LZ-63![]() | QGL-LZ-63 |
| Leadtime 2-3 weeks | C7HO-ER9D-X5 | LOCTITE GC 10 SAC305T3 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Cartridge, 600g 21 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
Y5YX-D0-7C9![]() | Y5YX-D0-7C9 |
| Leadtime 2-3 weeks | J3BE-QGJ-B1Z | 63 37 400 2% .015DIA 28SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life |