Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
MMF006630![]() | MMF006630 |
| Leadtime 2-3 weeks | GT5J-VP-DI | 1240-FPA SILVER SOLDER PASTE -- | - | Active | Lead Free | Solder Paste | - | Ag40Cu30Zn28Ni2 40 30 28 2 | - | - | - | Jar, 28g 1 oz | 1220 ~ 1435°F 660 ~ 780°C | 9 Months Date of Manufacture | ||||||||||||||
72PA-DHK-52 | 72PA-DHK-52 |
| Leadtime 2 3 weeks | B8QIQ-FC9-IUX | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
SMDLTLFP500T3C | SMDLTLFP500T3C |
| 4 | 4K0Z-YZWG-DR | SOLDER PASTE LOW TEMP T3 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | - | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
24-6337-7618![]() | 24-6337-7618 |
| 5 | 5I5-Q32M-1O | SOLDER 63 37 21AWG 1LB | 275 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
FS-QO-0Y![]() | FS-QO-0Y |
| 63 | 63-VZ-CLX | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
SMDSW.031 1OZ![]() | SMDSW.031 1OZ |
| Leadtime 2-3 weeks | ERBF8-FD-BYL | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
P2T2-39F-KI![]() | P2T2-39F-KI |
| 99 | 99DX2-4AA-35R | SOLDER RA 60 40 .032 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
E2-1PJ5-I1![]() | E2-1PJ5-I1 |
| Leadtime 2-3 weeks | C02-HB-NHG | SOLDERPASTE WATER SOLUABLE 500GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
NQ-V7-RNI | NQ-V7-RNI |
| Leadtime 2 3 weeks | Q5-WC-TAN | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
S332-OWG-8LV | S332-OWG-8LV |
| 7 | 7Q-92O-424 | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
I4SL-RZ-IW![]() | I4SL-RZ-IW |
| Leadtime 2-3 weeks | B81KL-SM7-RVJ | 60 40 370 3% .064DIA. 16SWG | 370 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
24-6040-0018 | 24-6040-0018 |
| 4 | 4HZX-3EW2-62I | SOLDER RA FLUX 23AWG 60 40 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
4915-454G | 4915-454G |
| Leadtime 2-3 weeks | RF-DR-9GL | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
QE1-6L5R-RG![]() | QE1-6L5R-RG |
| Leadtime 2 3 weeks | GX4-EUIU-7Y | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
8260U-22-W20![]() | 8260U-22-W20 |
| Leadtime 2-3 weeks | LS29-BQD-2I | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
4865-454G![]() | 4865-454G |
| Leadtime 2-3 weeks | GSD-E63-EJ | SOLDER NO-CLEAN 63 37 1 LB | 4860 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
SMD2040![]() | SMD2040 |
| Leadtime 2-3 weeks | Y19-CJ-WE | SOLDER SPHERES SAC305 .020 DIAM | SMD2 | Active | Lead Free | Solder Sphere | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | - | - | - | ||||||||||||||
PJ-E3-Q0![]() | PJ-E3-Q0 |
| 9 | 9G4-S9H6-0QR | 63 37 400 1% .032DIA 21SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
V8-9IUE-J1 | V8-9IUE-J1 |
| 6 | 6V26-QXE-WGE | SOLDER NO-CLEAN 19AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
MMF006630![]() | MMF006630 |
| 53 | 53-9I31-RC | 1240-FPA SILVER SOLDER PASTE -- | - | Active | Lead Free | Solder Paste | - | Ag40Cu30Zn28Ni2 40 30 28 2 | - | - | - | Jar, 28g 1 oz | 1220 ~ 1435°F 660 ~ 780°C | 9 Months Date of Manufacture | ||||||||||||||
SMD291AX500T3C | SMD291AX500T3C |
| 1 | 1HX-E8E-L0 | SOLDER PASTE NO-CLEAN 63 37 T3 5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
2023641![]() | 2023641 |
| Leadtime 2-3 weeks | O09UB-7P-5G | LOCTITE GC 10 SAC305T3 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Cartridge, 600g 21 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
4898-227G![]() | 4898-227G |
| Leadtime 2-3 weeks | S01-AAI-EGV | SOLDER RA 60 40 .062 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
WL-XL1-UL![]() | WL-XL1-UL |
| Leadtime 2-3 weeks | G7OND-7K-9Y | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
Z20 UC BTW![]() | Z20 UC BTW |
| 9 | 9CU-EIZ-JA6 | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life |