Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
O30B0-61Y-2MS![]() | O30B0-61Y-2MS |
| Leadtime 2-3 weeks | EOCL-TZL3-ME4 | SOLDER WATER SOL .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
732998 | 732998 |
| Leadtime 2-3 weeks | D1ZOI-8GR-UT3 | 97SC C511 2% .064DIA 16SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
SMD4300SNL10![]() | SMD4300SNL10 |
| Leadtime 2-3 weeks | YKW2-H62-5PY | SOLDER PASTE WATER SOL LF 10CC | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
2V-E7VG-MY![]() | 2V-E7VG-MY |
| 9 | 9T-LH-GW | 99C C511 3C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
9KS20-WTCD-K4![]() | 9KS20-WTCD-K4 |
| Leadtime 2-3 weeks | BW7-VV-OR | SN62 C502 5C 1.02MM 0.5KG .040 | C502 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
VFH-DVI3-ZV![]() | VFH-DVI3-ZV |
| Leadtime 2-3 weeks | A0-WT-0O | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
FEF0N-UQ-UUP | FEF0N-UQ-UUP |
| 441 | 441L9-H73E-8L | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
64S-DK-WE![]() | 64S-DK-WE | Leadtime 2-3 weeks | PC0N-GFUD-BH2 | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
0O-6W-M4Z![]() | 0O-6W-M4Z |
| 5 | 5N-H9-MVW | SOLDER PASTE NO CLEAN 10CC SYR | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
VN7DR-Z82N-BDM![]() | VN7DR-Z82N-BDM |
| Leadtime 2-3 weeks | PSC9Y-525-Y4 | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
VMZ-KQ36-NYH![]() | VMZ-KQ36-NYH |
| Leadtime 2-3 weeks | ZNI-XYH-P9U | SOLDER LF SN96 21GAUGE 0.6OZ | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Tube, 18g 0.6 oz | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
SMD291SNL250T5![]() | SMD291SNL250T5 |
| Leadtime 2-3 weeks | VDCBF-1HM-TW | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
4888-454G | 4888-454G |
| Leadtime 2-3 weeks | Y2L1-92-40D | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
BB-AA88-UH![]() | BB-AA88-UH | Leadtime 2 3 weeks | O4-6V3-HY | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
OO-01S-8H![]() | OO-01S-8H |
| Leadtime 2-3 weeks | Y6JH-YZVE-4OP | SOLDER PASTE TWO PART MIX | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 15g 0.5 oz | 423 ~ 428°F 217 ~ 220°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
WGWUT-2ULQ-P7![]() | WGWUT-2ULQ-P7 |
| Leadtime 2-3 weeks | BQU0Q-9P-WC | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
M49T1-P3-ACB![]() | M49T1-P3-ACB |
| Leadtime 2-3 weeks | S6-WT-XXA | SOLDER PASTE 63 37 T5 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
SY-AP-FM![]() | SY-AP-FM |
| Leadtime 2-3 weeks | NCZ9E-R2-DM | SOLDER RA 63 37 .032 1 2 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
KNX-Y4-1IF | KNX-Y4-1IF |
| Leadtime 2-3 weeks | CY-BO-N1X | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
PPE-ZAWJ-TUO![]() | PPE-ZAWJ-TUO |
| Leadtime 2-3 weeks | QCHQ-ED-NM | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
24-6337-0039 | 24-6337-0039 |
| Leadtime 2-3 weeks | D36K-T8HF-JW5 | SOLDER RA 19AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
S200![]() | S200 |
| Leadtime 2-3 weeks | TQ-18-ZN | POCKET SOLDER LEAD-FREE SAC 305 | SMD2 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
RW-1PZ-4N2![]() | RW-1PZ-4N2 |
| Leadtime 2 3 weeks | P2HYV-BK65-4Q | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 | |||||||||||||||||||||
X5-MS1-SN![]() | X5-MS1-SN | Leadtime 2-3 weeks | I7-5V-3O | SOLDER WATER SOLUBLE .031 X 20 | - | Obsolete | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
389283![]() | 389283 |
| Leadtime 2-3 weeks | QL5-I3-U55 | 63 37 HX 3C 0.38MM 0.25KG .015 | * | Active | - | - | - | - | - | - | - | - | - | - |