Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
4898-227G![]() | 4898-227G |
| Leadtime 2-3 weeks | ATB-CS-HHT | SOLDER RA 60 40 .062 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
727190![]() | 727190 |
| Leadtime 2-3 weeks | IWN-CY-KN4 | 99C C511 3C 0.56MM 0.5KG | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
CE-PE-M06![]() | CE-PE-M06 | Leadtime 2-3 weeks | YD-6F-T3Q | SOLDER 500G JAR,SN96.5 AG3.0 | - | Obsolete | Lead Free | Solder Paste | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | - | - | |||||||||||||||
8A-2K4-UG![]() | 8A-2K4-UG |
| Leadtime 2-3 weeks | ZUD-O16K-W4 | 97SC C511 2% .022DIA 23AWG 24SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
XUYS-YW-0V![]() | XUYS-YW-0V |
| Leadtime 2 3 weeks | LN2XL-ZDEF-KES | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
6IAZ-L4SS-ZNU![]() | 6IAZ-L4SS-ZNU |
| 77 | 77RSB-XCF-JQH | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
F2-P429-C0T | F2-P429-C0T |
| Leadtime 2 3 weeks | V8-I9H-CX | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
5GUU-F4X-P7![]() | 5GUU-F4X-P7 |
| Leadtime 2-3 weeks | S1-10CY-O5L | SOLDER PASTE TWO PART MIX | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 15g 0.5 oz | 423 ~ 428°F 217 ~ 220°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
SMDLTLFP10T5![]() | SMDLTLFP10T5 |
| Leadtime 2-3 weeks | TKUK8-RE-7R | SOLDER PASTE LOW TEMP LF T5 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Syringe, 15g 0.5 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
24-7068-1404![]() | 24-7068-1404 |
| 56 | 56-U3A-3U | SOLDER RA .050 18AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
C19D-042-CM![]() | C19D-042-CM |
| Leadtime 2-3 weeks | DA-QAEQ-68 | SOLDER SOLID WIRE 16AWG 60 40 | - | Active | Leaded | Wire Solder | - | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | - | Spool, 454g 1 lb | - | - | ||||||||||||||
4900-112G![]() | 4900-112G |
| Leadtime 2-3 weeks | G6PTY-54-7LQ | SOLDER LF SN96 21GAUGE .25LBS | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
N5R F1 QZ3![]() | N5R F1 QZ3 |
| Leadtime 2 3 weeks | GS-XAEJ-K22 | SOLDER RA 60 40 .025 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
MP8-CU1W-86U![]() | MP8-CU1W-86U |
| Leadtime 2-3 weeks | F9S-67-ZVO | 63 37 HYDRO-X 2% .032DIA 21SWG | Hydro-X | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
317RZ-NUI5-WNK![]() | 317RZ-NUI5-WNK |
| Leadtime 2 3 weeks | X2XA-QDF-D6X | SOLDER WIRE NO CLEAN 63 37 1OZ. | Active | Leaded | Wire Solder | No Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | ||||||||||||||||
389261![]() | 389261 |
| 2 | 2K3T-FC-09 | 60 40 370 3% .015DIA. 28SWG | 370 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.033 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
4867-227G![]() | 4867-227G | Leadtime 2-3 weeks | JKD62-3CC7-DZ | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
A7VCY-L6-IG3![]() | A7VCY-L6-IG3 |
| Leadtime 2 3 weeks | I9OJS-7ZT-9P | 63 37 381 5C 0.56MM 0.25KG AM | * | Active | ||||||||||||||||||||||||
YY0-E1C7-I1D![]() | YY0-E1C7-I1D |
| Leadtime 2 3 weeks | HI11H-SV-U9 | SOLDER PASTE SAC305 250G T5 | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
JXM-OI-EA![]() | JXM-OI-EA |
| Leadtime 2-3 weeks | JP-DO-Z7I | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
24-9574-6417![]() | 24-9574-6417 |
| Leadtime 2-3 weeks | SX06B-65-IU | SOLDER 66 .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
24-6337-6401![]() | 24-6337-6401 |
| Leadtime 2-3 weeks | Q2-JI-1W3 | SOLDER WATER SOLUABLE 25AWG 1LB | 331 | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
421562![]() | 421562 |
| Leadtime 2-3 weeks | F1T-MJ-IB | SN62 C502 5C 1.02MM 0.5KG .040 | C502 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
NK-WMKT-2P![]() | NK-WMKT-2P |
| Leadtime 2-3 weeks | U2DSL-UW-0L | SLD WIRE NO-CLEAN 96.5 3 .5 1OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
EHGO-A4-X7![]() | EHGO-A4-X7 |
| Leadtime 2 3 weeks | Q9TT-FMSX-R94 | SOLDER WIRE NO CLEAN 63 37 2OZ. | Active | Leaded | Wire Solder | No Clean, Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 57g 2 oz | 361°F 183°C |