Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NWX9U-OK-LAK | NWX9U-OK-LAK |
| Leadtime 2 3 weeks | ZZ95-881A-X66 | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
ZUMS P5E QJ![]() | ZUMS P5E QJ |
| 696 | 696B-D3-1F | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
04-7012-0000![]() | 04-7012-0000 | 424 | 424IX-FP7V-00 | SOLDER BAR 1.66LB SN99.3CU0.7 | E-Bar | Obsolete | Lead Free | Bar Solder | - | Sn99.3Cu0.7 99.3 0.7 | - | - | - | Bar, 750g 1 2 3 lbs | 440°F 227°C | No Shelf Life | |||||||||||||||
DT7-SUA-JK![]() | DT7-SUA-JK |
| Leadtime 2-3 weeks | Q1-DFY-H5Z | SOLDER NO-CLEAN 63 37 POCKET PK | 4860 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Tube, 18g 0.6 oz | 361°F 183°C | No Shelf Life | ||||||||||||||
22GLZ-YLMI-A0X![]() | 22GLZ-YLMI-A0X |
| Leadtime 2-3 weeks | SBGL3-DVZ-73 | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
KI42-PDO-4L![]() | KI42-PDO-4L |
| 6 | 6F-Z24-VR | SOLDER RA 60 40 .032 POCKET PK | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Tube, 18g 0.6 oz | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
SMD2200![]() | SMD2200 |
| Leadtime 2-3 weeks | B4-KYEM-B7 | SOLDER SPHERES 63 37 .024 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
12A-IJLZ-AEI | 12A-IJLZ-AEI |
| Leadtime 2 3 weeks | FUOI-JJSQ-SSL | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
SMD291AX500T5C![]() | SMD291AX500T5C |
| Leadtime 2-3 weeks | FX-OT0-TL | SOLDER PASTE 63 37 T5 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
23-6337-8806![]() | 23-6337-8806 | 8 | 8EZ2O-IHM-VN | SOLDER NO-CLEAN 28AWG 63 37 .5LB | 245 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.011 | Spool, 227g 1 2 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||
HT-HNK1-XV![]() | HT-HNK1-XV |
| Leadtime 2-3 weeks | OQZC8-924-V1 | SOLDER RA 60 40 14AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
SMD4300SNL10T4![]() | SMD4300SNL10T4 |
| Leadtime 2-3 weeks | ACHTA-D2TK-I9 | SLDR PST WATR SOL SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
H8-B5KW-WM | H8-B5KW-WM |
| Leadtime 2-3 weeks | HMWU-TUX-BD5 | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
XKKVW-EA2-M2![]() | XKKVW-EA2-M2 |
| Leadtime 2-3 weeks | 0KQ47-OO-7H3 | 60 40 370 5C 1.22MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
M2V-2T-TOQ | M2V-2T-TOQ |
| Leadtime 2-3 weeks | X1GZG-AJW-MJ | SLD WIRE NO-CLEAN 96.5 3 .5 4OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
X8AS-ZJ80-HM![]() | X8AS-ZJ80-HM |
| Leadtime 2-3 weeks | HLHE-TFG-J9C | SOLDER IN TUBE 1MM 60 40 | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Tube, 20g 0.7 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
CC8N7-BV-JPV![]() | CC8N7-BV-JPV |
| 3 | 3GX-NP-1SU | SOLDER SPHERES 63 37 .025 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
ICL8-B5U-EFG![]() | ICL8-B5U-EFG |
| 4 | 4S-BON-3G1 | SOLDER RA FLUX 23AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
S4TD1-H8N5-CN![]() | S4TD1-H8N5-CN |
| Leadtime 2-3 weeks | D48M-RUWW-2Y | SOLDER 63 37 21AWG 1LB | 275 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
F0CDT-65-12![]() | F0CDT-65-12 |
| Leadtime 2-3 weeks | ETF-LG-17R | SOLDER PASTE HF 212 - 600GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
673831 | 673831 |
| 53 | 53U-T7-VA | 97SC 400 2% .048DIA 18SWG | C400 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 16 AWG, 18 SWG | 0.048 1.22mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
KKZJ NA0Z BP![]() | KKZJ NA0Z BP |
| 5 | 5J7B-9LK-85 | SOLDER, COIL, LEAD FREE 6 PACK | Active | Lead Free | Solder Coil | |||||||||||||||||||||||
26I 8F A1T![]() | 26I 8F A1T |
| Leadtime 2 3 weeks | B6342-J6T-1EE | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||||
SMDSW.031 2OZ![]() | SMDSW.031 2OZ |
| 20 | 20-ZMK9-XDY | SOLDER WIRE NO-CLEAN 63 37 2OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 361°F 183°C | - | ||||||||||||||
1354296![]() | 1354296 |
| Leadtime 2-3 weeks | GF4B0-KMPQ-F7 | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated |