Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SMDSW.031 1OZ![]() | SMDSW.031 1OZ |
| Leadtime 2-3 weeks | GZ89H-MF-7O | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
C9QDT-HJ-KS3![]() | C9QDT-HJ-KS3 |
| Leadtime 2-3 weeks | YH3-LR-UY | SOLDER NO-CLEAN .062 16AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
HSH67-DW-JSU![]() | HSH67-DW-JSU |
| Leadtime 2 3 weeks | 0N-VB-MJ | 97SC 400 2% .064DIA 16SWG | C400 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
PPE-ZAWJ-TUO![]() | PPE-ZAWJ-TUO |
| 29 | 29SH-DY-J9 | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
AK-GHK-9U![]() | AK-GHK-9U |
| Leadtime 2 3 weeks | BYN-4O-07R | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||
1W9Z-J5-WL![]() | 1W9Z-J5-WL |
| Leadtime 2 3 weeks | KG57A-PE8L-VR8 | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||||
BTJ3H-6M-TJY![]() | BTJ3H-6M-TJY |
| Leadtime 2-3 weeks | Y51-7IRC-G8G | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
1042100![]() | 1042100 |
| Leadtime 2-3 weeks | J4CV-N6-GKQ | 60 40C511 3C 1.63MM AF 2.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
ESJ4-BL2-8R | ESJ4-BL2-8R |
| Leadtime 2-3 weeks | PVL-D1-LU | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
TSP1A-A6C-T3![]() | TSP1A-A6C-T3 |
| Leadtime 2 3 weeks | VE-OQ2-26 | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||||
OU-BIJS-3V![]() | OU-BIJS-3V |
| Leadtime 2 3 weeks | FY0LC-B0-SF | SOLDER SOLID WIRE 16AWG 60 40 | Active | Leaded | Wire Solder | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | Spool, 454g 1 lb | |||||||||||||||||||
X4C9I-B0-75B![]() | X4C9I-B0-75B |
| Leadtime 2 3 weeks | CNSB5-OP0M-EZ9 | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
JXM-OI-EA![]() | JXM-OI-EA |
| Leadtime 2-3 weeks | EX-X4G6-4Z7 | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
733002 | 733002 |
| Leadtime 2-3 weeks | KEY-6CPF-PE | 97SC C511 2% .032DIA 21SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
Y8 AF EGG![]() | Y8 AF EGG |
| Leadtime 2 3 weeks | TM-0PDG-ZG3 | 60 40 370 5C 1.22MM 0.5KG AM | * | Active | ||||||||||||||||||||||||
I32PC-W8-HR![]() | I32PC-W8-HR | Leadtime 2 3 weeks | EWA4-ZPOI-I6Q | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
9I6-09O-VA![]() | 9I6-09O-VA |
| 70 | 70M1-D5-L9 | SLD WIRE NO-CLEAN 96.5 3 .5 2OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
1QEF5-JE1K-HZ![]() | 1QEF5-JE1K-HZ |
| Leadtime 2-3 weeks | JUUM-PO-KF4 | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
412183![]() | 412183 |
| Leadtime 2-3 weeks | R4985-TOJ-3OL | 96SC C511 3C 1.02MM 0.5KG .040 | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
14-6337-0125![]() | 14-6337-0125 |
| Leadtime 2-3 weeks | V2O-R9ZQ-2T | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
1769646![]() | 1769646 |
| Leadtime 2-3 weeks | VE-XL-974 | SOLDER PASTE HF 212 - 500GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
JZD-PA-MOX![]() | JZD-PA-MOX |
| 3 | 3O-AEG1-LK | SOLDER 60 40 21AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.031 0.79mm | - | - | - | 36 Months Date of Manufacture | ||||||||||||||
927E XQ4 7Y | 927E XQ4 7Y |
| Leadtime 2 3 weeks | K94-YCYP-6ZX | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
3VWM-5Y5I-06![]() | 3VWM-5Y5I-06 |
| Leadtime 2-3 weeks | S6KX-T2-8P | SOLDERPASTE NO CLEAN 63 37 500GM | Easy Profile® | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
SMDLTLFP500T5C![]() | SMDLTLFP500T5C |
| 780 | 780EW-QN-PQ | SOLDER PASTE LOW TEMP T5 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | - | 281°F 138°C | 6 Months Date of Manufacture Refrigerated |