Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
XUYS-YW-0V![]() | XUYS-YW-0V |
| 7 | 7HU-PZDJ-FL | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
24-9574-1406![]() | 24-9574-1406 |
| Leadtime 2-3 weeks | YCY-UJ-GP | SOLDER 66 .025 23AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
1PZNK-IM5S-KA![]() | 1PZNK-IM5S-KA |
| 2 | 2X-B1Z-7T3 | SOLDER PASTE NO-CLEAN 63 37 5CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 5cc, 15g 0.5 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
6O-IRPP-9OQ![]() | 6O-IRPP-9OQ | Leadtime 2 3 weeks | PR-P86-UH | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
SMDSWLF.031 2OZ![]() | SMDSWLF.031 2OZ |
| 50 | 50-6IK-M6 | SLD WIRE NO-CLEAN 96.5 3 .5 2OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
24-6337-8834![]() | 24-6337-8834 |
| Leadtime 2-3 weeks | MCL8G-03G-6U5 | SOLDER NO-CLEAN 25AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
OG1-WL-9H | OG1-WL-9H |
| Leadtime 2-3 weeks | LS-LF-GO | SOLDER WATER SOL .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
MMF006630![]() | MMF006630 |
| Leadtime 2-3 weeks | G2A-E2-Y3 | 1240-FPA SILVER SOLDER PASTE -- | - | Active | Lead Free | Solder Paste | - | Ag40Cu30Zn28Ni2 40 30 28 2 | - | - | - | Jar, 28g 1 oz | 1220 ~ 1435°F 660 ~ 780°C | 9 Months Date of Manufacture | ||||||||||||||
BU-ZQ-BO![]() | BU-ZQ-BO |
| Leadtime 2-3 weeks | U0R7N-L4V2-ZD3 | SOLDER RA 60 40 19AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
CE-FOPD-8YD![]() | CE-FOPD-8YD |
| Leadtime 2 3 weeks | ODQ5J-UM-Z1M | SOLDER PASTE SAC305 T4 500G | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
386844![]() | 386844 |
| Leadtime 2-3 weeks | GJ-BF-4Y | 63 37 400 2% .015DIA 28SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
1PZNK-IM5S-KA![]() | 1PZNK-IM5S-KA |
| Leadtime 2-3 weeks | WYT-UBD-FF | SOLDER PASTE NO-CLEAN 63 37 5CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 5cc, 15g 0.5 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
9YC-37HA-YAX![]() | 9YC-37HA-YAX |
| Leadtime 2-3 weeks | LEV-7AQ-O5 | 99C C511 3C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
SMD291AX500T3C | SMD291AX500T3C |
| Leadtime 2-3 weeks | Q942-144V-ARJ | SOLDER PASTE NO-CLEAN 63 37 T3 5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD2200-25000![]() | SMD2200-25000 | Leadtime 2-3 weeks | FAWDE-9T-QW | SOLDER SPHERES SN63 PB37 .024 D | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
T2E-YZQ0-WS7 | T2E-YZQ0-WS7 |
| 5 | 5V-8VM7-VEU | SN42 BI57.6 AG0.4 2-PART MIX 60G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | - | 281°F 138°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
550014![]() | 550014 | 4 | 4I3-ZC-BPW | 63 37 WS200 SOLDER PASTE 75GM | WS200™ | Obsolete | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Syringe, 75g 2.6 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||
1354298![]() | 1354298 |
| Leadtime 2-3 weeks | ZY082-2F5X-FV | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
1051209![]() | 1051209 |
| Leadtime 2-3 weeks | HBC-QF-R31 | 63S4 MP218 ACP89V PASTE | MP218 | Active | Leaded | Solder Paste | No-Clean | - | - | - | - | - | - | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
ZFRM-KG-QU![]() | ZFRM-KG-QU | Leadtime 2-3 weeks | UE0V-AXBN-N1H | SOLDER NO-CLEAN ANTISTAT .031 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
95Z0A-HV-I4![]() | 95Z0A-HV-I4 |
| Leadtime 2 3 weeks | N3-WY-93 | SOLDER NO CLEAN .062 16AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
5F-U8Q-855![]() | 5F-U8Q-855 | Leadtime 2-3 weeks | BCTN-U3T-3M | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
EZ P9UB XZ | EZ P9UB XZ |
| Leadtime 2 3 weeks | LB-2A2-MC | SLD WIRE NO CLEAN 96.5 3 .5 2OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
0B-N6-B6![]() | 0B-N6-B6 |
| 1 | 1SNK-10W-B5 | SOLDER RA 16AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
CCDYK-FUY-XYF![]() | CCDYK-FUY-XYF |
| Leadtime 2-3 weeks | OO1-B6-FB | SLDR PST WATR SOL SAC305 T4 250G | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated |