Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
24-6337-8809![]() | 24-6337-8809 |
| Leadtime 2-3 weeks | J0-Q0-ZY | SOLDER NO-CLEAN 23AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
FE-XN0Z-A7![]() | FE-XN0Z-A7 |
| 26 | 26-SR-71 | SOLDER RA 60 40 21AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
NK-WMKT-2P![]() | NK-WMKT-2P |
| Leadtime 2-3 weeks | AK-313-JY | SLD WIRE NO-CLEAN 96.5 3 .5 1OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
SMDSW.020 1OZ![]() | SMDSW.020 1OZ |
| 907 | 907-49-6YD | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
BB-AA88-UH![]() | BB-AA88-UH | Leadtime 2 3 weeks | WOI8-QL-E0R | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
SL7ES-FBO2-7TI![]() | SL7ES-FBO2-7TI |
| 3 | 3QP1-89-FNC | SOLDER 66 .015 28AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
VFZT-WDA4-CSB![]() | VFZT-WDA4-CSB |
| 9 | 9ESN-RZZI-RT3 | SLD PASTE LF WATER SOL T5 10CC | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
71 24OC ZDB![]() | 71 24OC ZDB |
| Leadtime 2 3 weeks | LH8H9-J49-ZA | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
6HT3S-KAGN-E1J | 6HT3S-KAGN-E1J |
| Leadtime 2-3 weeks | ZCB-TRA0-9N2 | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
386818![]() | 386818 |
| 73 | 73UU-W369-0F | 63 37 HYDRO-X 2% .032DIA 21SWG | Hydro-X | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
GUSP4-LGCN-02M![]() | GUSP4-LGCN-02M |
| Leadtime 2-3 weeks | YE-PX-0V | SOLDER 63 37 18AWG 1LB | 275 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
4935-454G | 4935-454G |
| 77 | 77-W2RH-JG | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
JZD-PA-MOX![]() | JZD-PA-MOX |
| Leadtime 2-3 weeks | X74-Q39-B2 | SOLDER 60 40 21AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.031 0.79mm | - | - | - | 36 Months Date of Manufacture | ||||||||||||||
17552LF![]() | 17552LF |
| 3 | 3KFRZ-EYZR-BJY | SOLDER IN TUBE 1.2MM LEAD FREE | - | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 18 AWG, 19 SWG | 0.047 1.19mm | - | Tube, 20g 0.7 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
SMDLTLFP500T5C![]() | SMDLTLFP500T5C |
| Leadtime 2-3 weeks | JYKM-TQ-6MP | SOLDER PASTE LOW TEMP T5 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | - | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
4888-454G | 4888-454G |
| Leadtime 2-3 weeks | ZBDK-RGY-9T | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
2K0ZB QX5 GTX![]() | 2K0ZB QX5 GTX | Leadtime 2 3 weeks | LC-UPFU-PE9 | SOLDER RA FLUX 23AWG 60 40 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
421562![]() | 421562 |
| Leadtime 2-3 weeks | MSVB-5V-B9 | SN62 C502 5C 1.02MM 0.5KG .040 | C502 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
727190![]() | 727190 |
| Leadtime 2-3 weeks | U0KOX-3QK-EW | 99C C511 3C 0.56MM 0.5KG | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
SMD4300AX250T4![]() | SMD4300AX250T4 |
| Leadtime 2-3 weeks | JR7-1A4-0DK | SLDR PST WATR SOL 63 37 T4 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
6O-IRPP-9OQ![]() | 6O-IRPP-9OQ | Leadtime 2 3 weeks | XN-L8-9PJ | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
395439![]() | 395439 |
| Leadtime 2-3 weeks | RY0S-HPLT-ZET | HMP 366 3% .050DIA. 18SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
LK-EOXK-JS | LK-EOXK-JS |
| Leadtime 2-3 weeks | KNHN-U9-T94 | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
SE-JLHV-I8![]() | SE-JLHV-I8 |
| 8 | 8WUCY-L61-UBO | 96SC C502 5C 0.38MM 0.25KG.015 | C502 | Active | Wire Solder | No Clean | No Shelf Life | |||||||||||||||||||||
BAO3I-0LS-NDX![]() | BAO3I-0LS-NDX |
| Leadtime 2-3 weeks | KXY-6X-VI2 | SOLDER 66 .020 24AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture |