Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
4884-454G | 4884-454G |
| Leadtime 2-3 weeks | HSC-D7UB-M9H | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
24-6337-9710![]() | 24-6337-9710 |
| Leadtime 2-3 weeks | GOP-7UO-PB | SOLDER 63 37 21AWG 1LB | 285 | Active | Leaded | Wire Solder | Rosin Mildly Activated RMA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
386857![]() | 386857 |
| Leadtime 2-3 weeks | XERWV-7XU-HH | 63 37 400 3% .032DIA 21SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
386863![]() | 386863 |
| 664 | 664-N7RH-GLT | 96S C400 5C 0.56MM 0.5KG AM | C400 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
I9-IH-KL7![]() | I9-IH-KL7 |
| Leadtime 2-3 weeks | GMA2F-KNDZ-A2 | SOLDER 66 .031 22AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
AX-MA-7R![]() | AX-MA-7R |
| 3 | 3WU-O4YG-KV | 63S4 MP218 ACP89V PASTE | MP218 | Active | Leaded | Solder Paste | No-Clean | - | - | - | - | - | - | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD2205-25000![]() | SMD2205-25000 | Leadtime 2-3 weeks | HF-X3A-4LP | SOLDER SPHERES SN63 PB37 .025 D | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
F4U Q02 54![]() | F4U Q02 54 |
| Leadtime 2 3 weeks | ME-WRC-TKJ | SOLDER PASTE SN63 PB37 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
2P-7X-GWS![]() | 2P-7X-GWS |
| 2 | 2BUDG-DM-00R | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
C6TP8-3AL-SJ![]() | C6TP8-3AL-SJ |
| Leadtime 2-3 weeks | O39Y-WVB-NR | SOLDER PASTE NO CLEAN T5 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
36-A8-8D![]() | 36-A8-8D |
| Leadtime 2-3 weeks | KW-ZZD-C0C | 97SC 400 2% .022DIA 24SWG | C400 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
B8Z2-ET-RS![]() | B8Z2-ET-RS |
| Leadtime 2-3 weeks | XIRFI-JVB-DZ | SLDR PST NO-CLEAN SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
8260U-22-W20![]() | 8260U-22-W20 |
| Leadtime 2-3 weeks | MDVP-EPI-BN | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD2055-25000![]() | SMD2055-25000 | 5 | 5DXL-O18-GF3 | SOLDER SPHERES SAC305 DIAMETER 2 | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
HK2-7RA-CE![]() | HK2-7RA-CE |
| Leadtime 2-3 weeks | Z5VM-ML-UHZ | SOLDERPASTE NO CLEAN 63 37 600GM | Easy Profile® | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Cartridge, 600g 21 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
12 PB0 76![]() | 12 PB0 76 |
| 9 | 9G86-8B-4Z | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
THFU-EJZG-1KI![]() | THFU-EJZG-1KI |
| 8 | 8V5S-DAH-QE | 96S C400 5C 0.56MM 0.5KG AM | C400 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
I6QK-YOUR-FF![]() | I6QK-YOUR-FF |
| Leadtime 2-3 weeks | Z6UVO-W6C-1QZ | SOLDER NO-CLEAN 60 40 1 2 LB | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
SMD2165![]() | SMD2165 |
| Leadtime 2-3 weeks | IU-FWLI-IW | SOLDER SPHERES 63 37 .012 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
QU-RG-D6![]() | QU-RG-D6 |
| 1 | 1GXQ-ECOH-FKR | LOCTITE GC 10 SAC305T4 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
Y17-P2E-07N![]() | Y17-P2E-07N |
| 2 | 2U37W-QH0-WI | SOLDER RA .020 25AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
KKZJ NA0Z BP![]() | KKZJ NA0Z BP |
| Leadtime 2 3 weeks | MT3-R4U-Y4J | SOLDER, COIL, LEAD FREE 6 PACK | Active | Lead Free | Solder Coil | |||||||||||||||||||||||
PH-CY-3J | PH-CY-3J |
| Leadtime 2-3 weeks | KUAE-I5-DPE | SOLDER BAR 1.66LB SN96.5AG3CU0.5 | ULTRAPURE® | Active | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Bar, 750g 1 2 3 lbs | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
HT-EJT3-ICS![]() | HT-EJT3-ICS |
| 1 | 1B2U9-YXA6-3B | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
UW7-DE9Z-U7![]() | UW7-DE9Z-U7 |
| Leadtime 2-3 weeks | QP-KF3X-LW | SLDR PST NO-CLEAN SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated |