Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
F1R TOU 514![]() | F1R TOU 514 |
| 3 | 3Z-8DYS-LB | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 | |||||||||||||||||||||
24-9574-7619![]() | 24-9574-7619 |
| 2 | 2F3SX-Q5-PZ7 | SOLDER 66 .025 23AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
QBJZ-1ZI-6TU![]() | QBJZ-1ZI-6TU |
| Leadtime 2-3 weeks | RNJU-4D-WT | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
24-9574-7613![]() | 24-9574-7613 |
| Leadtime 2-3 weeks | PY-GB3S-6E2 | SOLDER 66 .050 18AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
JVT-4Z7-HF4![]() | JVT-4Z7-HF4 |
| 8 | 8SFD-L0-IYX | SOLDER LF SN96 21GAUGE 0.6OZ | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Tube, 18g 0.6 oz | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
YL8E-N2C9-GF2 | YL8E-N2C9-GF2 |
| Leadtime 2-3 weeks | L6-CLX-LK | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
CO2N-G58T-TQ![]() | CO2N-G58T-TQ |
| Leadtime 2-3 weeks | MWO6O-2OQC-CL | SOLDER 58 .015 28AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
528-GV-O6G | 528-GV-O6G |
| Leadtime 2-3 weeks | P1N-L9V-B7 | SOLDER PASTE SAC305 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
I07-59D-LC![]() | I07-59D-LC |
| Leadtime 2-3 weeks | AJ-0U0-ERG | SOLDER PASTE HF 212 - 500GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
4895-227G![]() | 4895-227G |
| Leadtime 2-3 weeks | FK4A-AQSJ-2V1 | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
42-3F-OF0![]() | 42-3F-OF0 |
| Leadtime 2 3 weeks | AJHW-YJ-QL | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
QC-1M-MR![]() | QC-1M-MR |
| 20 | 20-9YE-LYB | SOLDER RA 60 40 .040 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
FEOH-DI3-LK![]() | FEOH-DI3-LK |
| 4 | 4R2E-ZJV5-F3 | SOLDER RA FLUX 16AWG 60 40 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
E2-1PJ5-I1![]() | E2-1PJ5-I1 |
| Leadtime 2-3 weeks | MJR-C9-LJH | SOLDERPASTE WATER SOLUABLE 500GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
YJ23 ZJI C51![]() | YJ23 ZJI C51 |
| 576 | 576NK-2L75-P3 | SOLDER PASTE SAC305 250G T5 | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
9HR50-TN-4G | 9HR50-TN-4G |
| Leadtime 2-3 weeks | GR9BN-JA-BW | SOLDER RA 19AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
S00R-W1-IM![]() | S00R-W1-IM |
| 94 | 94-JX4-HHF | 97SC LF620 DAP89V | LF620M | Active | Lead Free | Solder Paste | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
ON0OU-VI-VHM![]() | ON0OU-VI-VHM |
| 9 | 9NBRM-T08-DSD | SOLDER 66 .015 28AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
ED-THVD-4Z | ED-THVD-4Z |
| Leadtime 2-3 weeks | JEH-YC-VV | SOLDER BAR 1.66LB SN96.5AG3CU0.5 | ULTRAPURE® | Active | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Bar, 750g 1 2 3 lbs | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
U9PZ3-3D08-OW2![]() | U9PZ3-3D08-OW2 |
| Leadtime 2-3 weeks | NQ5K-MFPL-UG | SOLDER SPHERES 63 37 .020 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 63 37 | - | - | - | - | - | - | ||||||||||||||
OI RUJ V4![]() | OI RUJ V4 | Leadtime 2 3 weeks | U5WJ-DSI-Y92 | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
SMDLTLFP15T4![]() | SMDLTLFP15T4 |
| Leadtime 2-3 weeks | VVYU-V4-X4R | TWO PART MIX SOLDER PASTE | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 15g 0.5 oz | 281°F 138°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
04-7012-0000![]() | 04-7012-0000 | 67 | 67-JPEO-X4 | SOLDER BAR 1.66LB SN99.3CU0.7 | E-Bar | Obsolete | Lead Free | Bar Solder | - | Sn99.3Cu0.7 99.3 0.7 | - | - | - | Bar, 750g 1 2 3 lbs | 440°F 227°C | No Shelf Life | |||||||||||||||
TNP-JG-QWY![]() | TNP-JG-QWY |
| 9 | 9L2Z3-RCB-0G0 | SOLDER PASTE SN63 PB37 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
1354296![]() | 1354296 |
| Leadtime 2-3 weeks | N6QJ-3XR-Z9 | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated |