Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
6XPO-30GP-8B![]() | 6XPO-30GP-8B |
| 5 | 5S18-U8JT-37U | 99C C511 3C 0.81MM 0.5KG AM | C511™ | Active | - | - | - | - | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
1PZNK-IM5S-KA![]() | 1PZNK-IM5S-KA |
| Leadtime 2-3 weeks | CEX4-5Z-2NQ | SOLDER PASTE NO-CLEAN 63 37 5CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 5cc, 15g 0.5 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
ZHE-W6Z2-CO | ZHE-W6Z2-CO |
| Leadtime 2-3 weeks | U1TZP-CW1-D73 | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
57-3201-4815![]() | 57-3201-4815 |
| Leadtime 2-3 weeks | P8VN-OYHH-H3 | SOLDERPAST NO CLEAN 63 37 1000GM | Easy Profile® | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Cartridge, 1000g 35 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
0O-6W-M4Z![]() | 0O-6W-M4Z |
| 7 | 7HH-797-BD | SOLDER PASTE NO CLEAN 10CC SYR | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
43IG-0NL-9XC![]() | 43IG-0NL-9XC |
| Leadtime 2-3 weeks | BKT3Z-WDY-5PP | 96S ARAX 4C 1.6MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
MMF006630![]() | MMF006630 |
| 5 | 5AOQO-38LE-5XP | 1240-FPA SILVER SOLDER PASTE -- | - | Active | Lead Free | Solder Paste | - | Ag40Cu30Zn28Ni2 40 30 28 2 | - | - | - | Jar, 28g 1 oz | 1220 ~ 1435°F 660 ~ 780°C | 9 Months Date of Manufacture | ||||||||||||||
9HR50-TN-4G | 9HR50-TN-4G |
| 1 | 1RFRT-CZQ-T9H | SOLDER RA 19AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
OK-TL8A-EE![]() | OK-TL8A-EE |
| Leadtime 2-3 weeks | DACI-BNJ-VOD | SAC0307 HF212AGS88.5 | - | Active | Lead Free | Bar Solder | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Bar, 1.1kg 2.5lbs | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
PI-IOO-PS![]() | PI-IOO-PS |
| 2 | 2YL7C-UIQ-VTW | SOLDER 1MM 100G | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 18 AWG, 19 SWG | 0.039 0.99mm | - | Spool, 100g 3.5 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
4B-HCL-7G![]() | 4B-HCL-7G |
| 5 | 5AZ5-895U-CDK | SOLDER NO-CLEAN 25AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
STW-FVF-JVQ![]() | STW-FVF-JVQ |
| Leadtime 2 3 weeks | TO6-5D4-QKE | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
TMA-8VC-EG | TMA-8VC-EG |
| 848 | 848N-8JKE-DT5 | SOLDER WATER SOL .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
M3WE-XZP-EB![]() | M3WE-XZP-EB |
| Leadtime 2 3 weeks | RS-GHY-VA1 | 63 37 370 5C 0.38MM 0.25KG.015 | * | Active | ||||||||||||||||||||||||
6Y0I-HMZ-V7![]() | 6Y0I-HMZ-V7 |
| 5 | 5S-G1Z-QIG | SOLDER SOLID WIRE 16AWG 63 37 | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | - | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
IZZV-MD2Z-K3I![]() | IZZV-MD2Z-K3I |
| Leadtime 2-3 weeks | BGR-3JGO-VT | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
AK-GHK-9U![]() | AK-GHK-9U |
| Leadtime 2 3 weeks | PJ-H9B6-PK4 | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||
1E-KNJ-Y9![]() | 1E-KNJ-Y9 |
| Leadtime 2 3 weeks | F57-Z8-9K | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 | |||||||||||||||||||||
BAH4E-AI-6L1![]() | BAH4E-AI-6L1 |
| Leadtime 2-3 weeks | GDFE-QDDL-SJM | 63 37 HX 3C 0.38MM 0.25KG .015 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
EWP-H0V1-WDB | EWP-H0V1-WDB |
| 40 | 40-PHZ-ROE | SOLDER WATER SOL .062 16AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
I5-12-UY1 | I5-12-UY1 |
| Leadtime 2 3 weeks | U8FX-NV-QTU | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
D3-7NF-W72![]() | D3-7NF-W72 |
| 50 | 50PJ-RZQX-BZ | SOLDER RA FLUX 16AWG 60 40 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
9O9K-49H1-24T![]() | 9O9K-49H1-24T |
| Leadtime 2-3 weeks | YB-0E-M9 | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
0E7W6-USB-HC![]() | 0E7W6-USB-HC |
| Leadtime 2-3 weeks | DJ-R3-9YI | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
24-9574-1404![]() | 24-9574-1404 |
| 24 | 24EN-FS-BL | SOLDER 66 .050 18AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture |