Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
KF-30O-IA![]() | KF-30O-IA |
| Leadtime 2-3 weeks | EML-ENX-18O | 63S4 MP218 ACP89V PASTE | MP218 | Active | Leaded | Solder Paste | No-Clean | - | - | - | - | - | - | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
17553LF![]() | 17553LF |
| Leadtime 2-3 weeks | CX-MVMN-T0E | SOLDER 100G 1.2MM LEAD FREE | - | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 16 AWG, 18 SWG | 0.047 1.19mm | - | Spool, 100g 3.5 oz | 440°F 227°C | 5 Years Date of Manufacture | ||||||||||||||
IEP-HX5-CH![]() | IEP-HX5-CH |
| Leadtime 2-3 weeks | AST-1M-P6 | SOLDER RA 63 37 .062 1 2 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
BF-9V-3C![]() | BF-9V-3C |
| Leadtime 2-3 weeks | G58-9S-AG | 1240-FPA SILVER SOLDER PASTE -- | - | Active | Lead Free | Solder Paste | - | Ag40Cu30Zn28Ni2 40 30 28 2 | - | - | - | Jar, 28g 1 oz | 1220 ~ 1435°F 660 ~ 780°C | 9 Months Date of Manufacture | ||||||||||||||
PJ-E3-Q0![]() | PJ-E3-Q0 |
| Leadtime 2-3 weeks | JZMS-AYQ2-7M | 63 37 400 1% .032DIA 21SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
K3M2Y-3I00-V7I![]() | K3M2Y-3I00-V7I |
| Leadtime 2-3 weeks | O0-BG-8T9 | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
TSP1A-A6C-T3![]() | TSP1A-A6C-T3 |
| Leadtime 2 3 weeks | GL-0IQ-5LR | SOLDER 63 37 11AWG 1LB | Solid Core Wire | Active | Leaded | Wire Solder | Sn63Pb37 63 37 | 0.125 3.18mm | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||||
893357![]() | 893357 |
| Leadtime 2-3 weeks | JHP-X0PN-2Q | 97SC HYDRO-X 3C0.38MM 0.25KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
LCR-IS2R-F6K![]() | LCR-IS2R-F6K | Leadtime 2 3 weeks | XAKLU-X3IY-7OW | SOLDER 63 37 NOCLEAN .04DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
0E7W6-USB-HC![]() | 0E7W6-USB-HC |
| 9 | 9FJ-QWC3-FUC | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD4300SNL250T4![]() | SMD4300SNL250T4 |
| 9 | 9L1-OQ9-UL | SLDR PST WATR SOL SAC305 T4 250G | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
DDA-BAV-5BS![]() | DDA-BAV-5BS |
| 23 | 23S-E3Y-OJB | SOLDER PASTE SN63 PB37 250G T5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
OI RUJ V4![]() | OI RUJ V4 | 4 | 4C7-T7P-CE | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
UR-LQ-HR![]() | UR-LQ-HR |
| Leadtime 2-3 weeks | LKNO-OC-PO | LOCTITE GC 10 SAC305T3 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
Q5VA-K0X-O3N![]() | Q5VA-K0X-O3N |
| 6 | 6O1-OGCB-KC | LOCTITE GC 10 SAC305T3 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Cartridge, 600g 21 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
2P-7X-GWS![]() | 2P-7X-GWS |
| Leadtime 2 3 weeks | CF-OOA-1C | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
T5N WOS2 6I![]() | T5N WOS2 6I |
| 92 | 92B18-4P-OS | HMP 366 3% .050DIA. 18SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
SMD2205-25000![]() | SMD2205-25000 | 216 | 216-JJ1-NN | SOLDER SPHERES SN63 PB37 .025 D | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
IP-40W3-O6R![]() | IP-40W3-O6R |
| Leadtime 2 3 weeks | ZL4-NMCC-WS | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
61-R7-568 | 61-R7-568 |
| Leadtime 2 3 weeks | W5NE-DGS-Q3 | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
SMD291AX10T5![]() | SMD291AX10T5 |
| Leadtime 2-3 weeks | COMJ-369-AID | SOLDER PASTE NO CLEAN T5 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
42-3F-OF0![]() | 42-3F-OF0 |
| Leadtime 2 3 weeks | IFQ38-0AB0-L13 | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
49500-454G | 49500-454G |
| Leadtime 2-3 weeks | LSR-0J-EQ | SOLDER WIRE NO CLEAN 0.032 DIA | 49500 | Active | Lead Free | Wire Solder | No-Clean | Sn99.5Cu0.5 99.5 0.5 | 21 AWG, 22 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 442°F 228°C | No Shelf Life | ||||||||||||||
RB-JR87-2DU![]() | RB-JR87-2DU |
| Leadtime 2-3 weeks | 0Q-YCL-8R | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
7W ALTS BK![]() | 7W ALTS BK |
| Leadtime 2 3 weeks | PR-R37-I1 | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | No Shelf Life |