Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
9ZE-J9Z-5Z![]() | 9ZE-J9Z-5Z |
| Leadtime 2-3 weeks | MY1C-RHBF-X64 | 63 37 381 5C 0.81MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
0L-APTR-RY![]() | 0L-APTR-RY |
| 5 | 5C4-I3-Z7R | 97SC C511 2% .022DIA 23AWG 24SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
7021020510![]() | 7021020510 |
| Leadtime 2-3 weeks | NHL-5NF3-7O | R562 SOLDERPASTE WATER SOL 500G | R562 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
NBM4J-LUI-D4V![]() | NBM4J-LUI-D4V |
| Leadtime 2-3 weeks | G55-F8D-1Q5 | SOLDER NO-CLEAN 60 40 1 LB | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
397952![]() | 397952 |
| 2 | 2PYH-M0YN-67Y | HMP 366 3% .022DIA. 24SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.033 | Spool, 227g 1 2 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
17553![]() | 17553 |
| 7 | 7B3PB-DEBX-93 | SOLDER 1.2MM 100G | - | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 16 AWG, 18 SWG | 0.047 1.19mm | - | Spool, 100g 3.5 oz | 360°F 180°C | 5 Years Date of Manufacture | ||||||||||||||
UAT-3Y2Y-4S7![]() | UAT-3Y2Y-4S7 |
| Leadtime 2-3 weeks | S72F-J0-A6 | LOCTITE GC 10 SAC305T4 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
PZ1W-BF-QU | PZ1W-BF-QU |
| Leadtime 2-3 weeks | HJ-X60T-CF3 | SOLDER RA 19AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
EIR-33C-1K![]() | EIR-33C-1K |
| Leadtime 2 3 weeks | TZQW-W7A-ZQO | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
4944-112G![]() | 4944-112G |
| Leadtime 2-3 weeks | MF-C5-N1 | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
SMD291AX500T5C![]() | SMD291AX500T5C |
| Leadtime 2-3 weeks | TG64-VVFL-WH | SOLDER PASTE 63 37 T5 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
1QEF5-JE1K-HZ![]() | 1QEF5-JE1K-HZ |
| 7 | 7Y-3M-0P | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
UW7-DE9Z-U7![]() | UW7-DE9Z-U7 |
| Leadtime 2-3 weeks | PFGW-QX9Q-3AW | SLDR PST NO-CLEAN SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
W4-FG-YA5![]() | W4-FG-YA5 |
| Leadtime 2-3 weeks | W84G-QJA-PR | 63 37 400 2% .015DIA 28SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
0QPC-SK-4M![]() | 0QPC-SK-4M |
| Leadtime 2-3 weeks | H1-TJ73-35W | 96SC C400 3C 0.56MM 0.25KG.022 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
24-6337-8814 | 24-6337-8814 |
| Leadtime 2-3 weeks | HC-OS-B0 | SOLDER NO-CLEAN 18AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
SMDSW.031 1OZ![]() | SMDSW.031 1OZ |
| 31 | 31LSA-JCN-QK | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
568759![]() | 568759 |
| 7 | 7F7NG-7RRB-E0B | SAV1 366 5C 1.22MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
4944-454G | 4944-454G |
| Leadtime 2-3 weeks | TQ2-KE-3QS | SOLDER LF SN100E RA FLUX | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
HC 87C I4![]() | HC 87C I4 |
| Leadtime 2 3 weeks | X6S-XSH-PPQ | OR 421 FLUX CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
7LF-Q6-35![]() | 7LF-Q6-35 |
| Leadtime 2-3 weeks | HBWR-NCG-OI | SOLDER PASTE SN63 PB37 250G T5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD4300AX250T4![]() | SMD4300AX250T4 |
| Leadtime 2-3 weeks | UVX9X-51R-TC | SLDR PST WATR SOL 63 37 T4 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
24-6040-0018 | 24-6040-0018 |
| Leadtime 2-3 weeks | KZDB3-9M-PR | SOLDER RA FLUX 23AWG 60 40 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
SMDSW.031 1OZ![]() | SMDSW.031 1OZ |
| 48 | 48ATK-NZ-05 | SOLDER WIRE NO-CLEAN 63 37 1OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | - | ||||||||||||||
SMD291AX250T4![]() | SMD291AX250T4 |
| Leadtime 2-3 weeks | XK8G6-65X-2N | SLDR PST NO-CLEAN 63 37 T4 250G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated |