Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
QU-RG-D6![]() | QU-RG-D6 |
| Leadtime 2-3 weeks | 0EL6-ZWY-43 | LOCTITE GC 10 SAC305T4 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
CG546-AQE-8O![]() | CG546-AQE-8O |
| 50 | 50-5VC-OY | 99C BAR SOLDER 2LB | Obsolete | Lead Free | Bar Solder | Sn99.3Cu0.7 99.3 0.7 | Bar, 907g 2 lb | 440°F 227°C | No Shelf Life | |||||||||||||||||||
24-7068-7601![]() | 24-7068-7601 |
| 857 | 857-ERV-P7D | SOLDER NO-CLEAN .031 21 AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
RL-9X-OO | RL-9X-OO | Leadtime 2-3 weeks | CTM7K-YWY-QM | SOLDER SOLID WIRE 21AWG 60 40 | - | Obsolete | Leaded | Wire Solder | - | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.031 0.79mm | - | Spool, 454g 1 lb | - | - | |||||||||||||||
SDCN AH TGZ![]() | SDCN AH TGZ | 8 | 8ALH0-APJY-51M | SOLDER NO CLEAN ANTISTAT .020 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
Q5VA-K0X-O3N![]() | Q5VA-K0X-O3N |
| Leadtime 2-3 weeks | TRTS-IFU-ZGH | LOCTITE GC 10 SAC305T3 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Cartridge, 600g 21 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
3NT-F5Q-67 | 3NT-F5Q-67 |
| Leadtime 2-3 weeks | BTFLN-L2-UC7 | SOLDER PASTE NO-CLEAN 63 37 T3 5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD291SNL250T5![]() | SMD291SNL250T5 |
| Leadtime 2-3 weeks | KONH7-MTS-ST0 | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
GER 2JY PP4![]() | GER 2JY PP4 |
| Leadtime 2 3 weeks | ZEL9-ET-K7 | SOLDER PASTE TWO PART MIX | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 15g 0.5 oz | 423 ~ 428°F 217 ~ 220°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||||||
SMDLTLFP60T4 | SMDLTLFP60T4 |
| Leadtime 2-3 weeks | Y1-8IJ-0T | SN42 BI57.6 AG0.4 2-PART MIX 60G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | - | 281°F 138°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||
PMP-LWT1-CO![]() | PMP-LWT1-CO |
| 76 | 76DH-HPWI-5N9 | SOLDER PASTE NO CLEAN T5 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
ICL8-B5U-EFG![]() | ICL8-B5U-EFG |
| Leadtime 2-3 weeks | F9I10-0AQL-9VT | SOLDER RA FLUX 23AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
U75R-2VU-8P | U75R-2VU-8P |
| Leadtime 2-3 weeks | X1-86-YB | SOLDER SOLID WIRE 21AWG 63 37 | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | - | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
58-T4-DP![]() | 58-T4-DP |
| Leadtime 2-3 weeks | IAYC-CS-T5 | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
K0-5U-45![]() | K0-5U-45 | 7 | 7FGW-K190-ZB | SOLDER RMA FLUX 16AWG 63 37 1LB | 285 | Obsolete | Leaded | Wire Solder | Rosin Mildly Activated RMA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | |||||||||||||||
1769646![]() | 1769646 |
| Leadtime 2-3 weeks | F1H-W4V-A56 | SOLDER PASTE HF 212 - 500GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
SMDSW.031 2OZ![]() | SMDSW.031 2OZ |
| Leadtime 2-3 weeks | O1R-JI-EUZ | SOLDER WIRE NO-CLEAN 63 37 2OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 361°F 183°C | - | ||||||||||||||
EQDW-HC1L-MG1![]() | EQDW-HC1L-MG1 |
| 6 | 06-2AP-B44 | SLD WIRE NO-CLEAN 96.5 3 .5 2OZ. | - | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | - | ||||||||||||||
386851![]() | 386851 |
| Leadtime 2-3 weeks | ZL-4W-LJ3 | 63 37 CRYSL 502 2% .022DIA 24SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
V8D-MGSZ-YT![]() | V8D-MGSZ-YT | Leadtime 2-3 weeks | LW-DJ-XUB | SOLDER SPHERES SAC305 DIAMETER 2 | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
OI RUJ V4![]() | OI RUJ V4 | Leadtime 2 3 weeks | Q39R-0P-DD | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
1354298![]() | 1354298 |
| 460 | 460Z-BV-M7 | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
2QMXF-4Q-G0U![]() | 2QMXF-4Q-G0U |
| 8 | 8J-RM-KB | SOLDERPASTE NO CLEAN 63 37 600GM | Easy Profile® | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Cartridge, 600g 21 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
OAK-VN6J-9XT![]() | OAK-VN6J-9XT |
| Leadtime 2-3 weeks | A55-M222-X4N | SLD PASTE LF WATER SOL T5 10CC | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
PY13-BM-D6R![]() | PY13-BM-D6R |
| Leadtime 2-3 weeks | SO3-TPW-2WD | SOLDER RA FLUX 23AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture |