Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
395451![]() | 395451 |
| Leadtime 2-3 weeks | HQ8-PQ-750 | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
36-A8-8D![]() | 36-A8-8D |
| Leadtime 2-3 weeks | CV-8O-0U4 | 97SC 400 2% .022DIA 24SWG | C400 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
FO6P-MQ-U3![]() | FO6P-MQ-U3 |
| Leadtime 2-3 weeks | N7S-RSKB-XJ | SOLDER 66 .031 22AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
6O-IRPP-9OQ![]() | 6O-IRPP-9OQ | Leadtime 2 3 weeks | T3708-MQK-JKG | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
97H4-JCX-J2![]() | 97H4-JCX-J2 |
| Leadtime 2-3 weeks | MJ-C8KF-XU | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
E0-3YV1-12![]() | E0-3YV1-12 | Leadtime 2 3 weeks | JYD-1GU4-EAK | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
412183![]() | 412183 |
| Leadtime 2-3 weeks | CE-W8C-6G | 96SC C511 3C 1.02MM 0.5KG .040 | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
AK-GHK-9U![]() | AK-GHK-9U |
| Leadtime 2 3 weeks | K7U-CZP-OV4 | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||
4860-18G![]() | 4860-18G |
| Leadtime 2-3 weeks | XD-1A3-24 | SOLDER NO-CLEAN 63 37 POCKET PK | 4860 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Tube, 18g 0.6 oz | 361°F 183°C | No Shelf Life | ||||||||||||||
R01KG-KM49-6H![]() | R01KG-KM49-6H |
| Leadtime 2-3 weeks | DG-BDJ-VJX | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
6FPAS-D6Y-63![]() | 6FPAS-D6Y-63 |
| Leadtime 2-3 weeks | I4-265-CO | SOLDER PASTE LOW TEMP 5CC W TIP | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Syringe, 15g 0.5 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
VFH-DVI3-ZV![]() | VFH-DVI3-ZV |
| Leadtime 2-3 weeks | Z68D-F4W-2Q2 | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
SMD291AX500T4C![]() | SMD291AX500T4C |
| 37 | 37K3-RA-W3G | SOLDER PASTE 63 37 T4 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
9Q-ZO8-55![]() | 9Q-ZO8-55 |
| Leadtime 2-3 weeks | G5XU-6S3-I3 | SOLDER SPHERES SAC305 .025 DIAM | SMD2 | Active | Lead Free | Solder Sphere | - | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | - | - | - | ||||||||||||||
5PD3T-ESQ-VVJ | 5PD3T-ESQ-VVJ |
| Leadtime 2-3 weeks | W6-JLWO-EA8 | SOLDER RA 63 37 .025 1 LBS | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
16-6040-0031![]() | 16-6040-0031 |
| Leadtime 2-3 weeks | QZ-J5-1U7 | SOLDER 60 40 21AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.031 0.79mm | - | - | - | 36 Months Date of Manufacture | ||||||||||||||
MW SO U7U | MW SO U7U |
| Leadtime 2 3 weeks | JC6X-EC-XL | SLD WIRE NO CLEAN 96.5 3 .5 4OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
I5-12-UY1 | I5-12-UY1 |
| 772 | 772Z-MF5-3H | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
CO2N-G58T-TQ![]() | CO2N-G58T-TQ |
| 1 | 1J0-SD2T-RH | SOLDER 58 .015 28AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
G9M1F 3VW 61![]() | G9M1F 3VW 61 |
| Leadtime 2 3 weeks | GJIM-HGU-DV9 | SOLDERPAST NO CLEAN 63 37 1000GM | Easy Profile® | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Cartridge, 1000g 35 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||
3VWM-5Y5I-06![]() | 3VWM-5Y5I-06 |
| 1 | 1R-OKEP-SD | SOLDERPASTE NO CLEAN 63 37 500GM | Easy Profile® | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
KEW1-0B0V-FR![]() | KEW1-0B0V-FR |
| Leadtime 2 3 weeks | H2W2Q-5A-Y05 | SOLDER NO CLEAN .062 16AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
NRD BB5 NRX | NRD BB5 NRX |
| 2 | 2RDO-O6-6TY | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
SMD4300AX500T3C![]() | SMD4300AX500T3C |
| 54 | 54KS-YA5Q-NNS | SOLDER PASTE 63 37 T3 500G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
0L-APTR-RY![]() | 0L-APTR-RY |
| Leadtime 2-3 weeks | MGBH-HN2O-33J | 97SC C511 2% .022DIA 23AWG 24SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life |