Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ARR-JXDQ-HW![]() | ARR-JXDQ-HW |
| Leadtime 2-3 weeks | PF-OBNY-71 | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
26-U2X-AUC![]() | 26-U2X-AUC |
| 98 | 98M3-87Z1-6N0 | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
54-J58C-K1J![]() | 54-J58C-K1J |
| Leadtime 2-3 weeks | VS0VI-YE-VTN | SOLDER LF SN96 21GAUGE 1LB | 4900 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
S0T1C-UW-9G | S0T1C-UW-9G |
| 54 | 54TC-MQ-27P | SOLDER NO CLEAN 18AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
VFH-DVI3-ZV![]() | VFH-DVI3-ZV |
| Leadtime 2-3 weeks | VN-FXTE-YTO | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
XF0Q-3Q-UF![]() | XF0Q-3Q-UF | Leadtime 2 3 weeks | TFF-XP3A-QS | SOLDER NO CLEAN ANTISTAT .031 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
T5N WOS2 6I![]() | T5N WOS2 6I |
| 50000 | 5E4M-F0-4S | HMP 366 3% .050DIA. 18SWG | 366 | Active | Leaded | Wire Solder | Rosin Activated RA | Pb93.5Sn5Ag1.5 93.5 5 1.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.033 | Spool, 454g 1 lb | 565 ~ 574°F 296 ~ 301°C | No Shelf Life | ||||||||||||||
Y7-2O-3NN![]() | Y7-2O-3NN |
| Leadtime 2-3 weeks | NI3-UU-AWZ | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
412183![]() | 412183 |
| Leadtime 2-3 weeks | XOJ6-M3WI-CC | 96SC C511 3C 1.02MM 0.5KG .040 | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
24-9574-6417![]() | 24-9574-6417 |
| Leadtime 2-3 weeks | F2F-9FG-VB | SOLDER 66 .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
UP0W-TI7-EQI![]() | UP0W-TI7-EQI |
| 8 | 8W8FU-A6-ICS | 97SC 400 2% .022DIA 24SWG | C400 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
3TN 2L0 WQO![]() | 3TN 2L0 WQO |
| Leadtime 2 3 weeks | GV-3C-823 | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
8E7EL-AQ3-RIA![]() | 8E7EL-AQ3-RIA |
| 871 | 871W-02-8Z4 | 96SC C511 5C 0.81MM 0.5KG AM | C511™ | Active | No Shelf Life | |||||||||||||||||||||||
395451![]() | 395451 |
| Leadtime 2-3 weeks | P7-6TA9-TVB | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
4ME-Q93-ALQ | 4ME-Q93-ALQ |
| 6 | 6UX-72GR-LGQ | SOLDER NO-CLEAN 18AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
SEZI-46E-CF0![]() | SEZI-46E-CF0 |
| 5 | 5I-DXC-0OX | SOLDER 66 .025 23AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
THFU-EJZG-1KI![]() | THFU-EJZG-1KI |
| Leadtime 2-3 weeks | V6PT-9FJ-ML | 96S C400 5C 0.56MM 0.5KG AM | C400 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
01SF9 HT GV![]() | 01SF9 HT GV |
| Leadtime 2 3 weeks | C3Z-XOS-4I | LOCTITE GC 10 SAC305T4 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Cartridge, 600g 21 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | |||||||||||||||||
71 24OC ZDB![]() | 71 24OC ZDB |
| 3 | 3N-XJ9-PH | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
C1IP-MNKZ-GRC![]() | C1IP-MNKZ-GRC |
| Leadtime 2-3 weeks | P0S-4XE-MZ8 | SOLDER 66 .020 24AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
24-9574-6417![]() | 24-9574-6417 |
| Leadtime 2-3 weeks | QH69X-KO4-OCF | SOLDER 66 .025 23AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
IF-LY8Z-BJ![]() | IF-LY8Z-BJ | Leadtime 2-3 weeks | RF-LNK3-AV | SOLDER SPHERES SAC305 DIAMETER 2 | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
XZJQ-N0S-MKT | XZJQ-N0S-MKT |
| Leadtime 2 3 weeks | G019-RDT-XU | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
E0-3YV1-12![]() | E0-3YV1-12 | Leadtime 2 3 weeks | HSQSF-M0I-HB | SOLDER NO CLEAN .031 X 20 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | 361°F 183°C | No Shelf Life | |||||||||||||||||
THFU-EJZG-1KI![]() | THFU-EJZG-1KI |
| Leadtime 2-3 weeks | AQ50L-1ST-KT9 | 96S C400 5C 0.56MM 0.5KG AM | C400 | Active | - | Wire Solder | No-Clean | - | - | - | - | - | - | No Shelf Life |