Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
9O9K-49H1-24T![]() | 9O9K-49H1-24T |
| Leadtime 2-3 weeks | BA-KD-T2A | SOLDER PASTE SN42 BI58 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
GTGQT-DM1E-SL![]() | GTGQT-DM1E-SL |
| Leadtime 2 3 weeks | YQ7Z-TZPK-RW | 96SC C502 5C 0.38MM 0.25KG.015 | C502 | Active | Wire Solder | No Clean | No Shelf Life | |||||||||||||||||||||
4901-227G | 4901-227G |
| Leadtime 2-3 weeks | OJ-VLCA-S1 | SOLDER LF SN99 21GAUGE.5LBS | 4901 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.032 0.81mm | - | Spool, 227g 1 2 lb | 440°F 227°C | No Shelf Life | ||||||||||||||
BD3Q-07-AR![]() | BD3Q-07-AR |
| Leadtime 2 3 weeks | URI3C-JEX-3P | SOLDER PASTE HF 212 600GRAM JA | HF212 | Active | No Shelf Life | |||||||||||||||||||||||
SMDLTLFP250T5 | SMDLTLFP250T5 |
| Leadtime 2-3 weeks | FPO-QG-4M | SOLDER PASTE SN42 BI57.6 AG0.4 L | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 42 57.6 0.4 | - | - | - | Jar, 250g 9 oz | 281°F 138°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
Y7-2O-3NN![]() | Y7-2O-3NN |
| Leadtime 2-3 weeks | QNS-MTK8-IE | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
9LON QP 26 | 9LON QP 26 |
| 6 | 6YQ-I8-5G3 | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
2VPMY SR PCO![]() | 2VPMY SR PCO |
| Leadtime 2 3 weeks | L9Y7-XB8-1RU | SOLDER PASTE WATER SOL 10CC | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
DYAE-R1-BR![]() | DYAE-R1-BR |
| Leadtime 2-3 weeks | H7-LH-Y2 | SOLDER 58 .015 28AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
IZZV-MD2Z-K3I![]() | IZZV-MD2Z-K3I |
| Leadtime 2-3 weeks | DD-DY-GGL | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | - | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
M1A1-4P13-4H![]() | M1A1-4P13-4H | Leadtime 2-3 weeks | BN7C-7Y6-TOK | SOLDER NO-CLEAN ANTISTAT .031 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
MOJ9 3X TCR![]() | MOJ9 3X TCR |
| 4 | 4H2-1K15-1C | SLD PASTE LF WATER SOL T5 10CC | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Syringe, 10cc, 35g 1.2 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
ZUMS P5E QJ![]() | ZUMS P5E QJ |
| Leadtime 2 3 weeks | ZMKMU-RAO-Z1K | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
W1LQK-6NG4-YF7 | W1LQK-6NG4-YF7 |
| 94 | 94QZ-9B-N2 | SOLDER LF SAC305 RA FLUX | * | Active | ||||||||||||||||||||||||
JAX-AN-M9K![]() | JAX-AN-M9K |
| 5 | 5G53O-RG3-LOJ | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
H8-B5KW-WM | H8-B5KW-WM |
| 5 | 5IC3-PMC-NN9 | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
UAT-3Y2Y-4S7![]() | UAT-3Y2Y-4S7 |
| Leadtime 2-3 weeks | OS-65LN-JJ8 | LOCTITE GC 10 SAC305T4 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
76 FO A6J![]() | 76 FO A6J | Leadtime 2 3 weeks | XU2B-BG8-Y9 | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
PP3VP EUJS MF![]() | PP3VP EUJS MF |
| Leadtime 2 3 weeks | ISXW0-LB-XWD | SLDR PST NO CLEAN 63 37 T4 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
HN9D KPA S1![]() | HN9D KPA S1 |
| Leadtime 2 3 weeks | KU-11Q-JGC | SOLDER PASTE SAC305 T4 500G | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
R01KG-KM49-6H![]() | R01KG-KM49-6H |
| Leadtime 2-3 weeks | CKS-2HH-SA | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
4897-227G![]() | 4897-227G |
| Leadtime 2-3 weeks | PSB2-3EG-O2 | SOLDER RA 60 40 .050 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
OMR-RUY-BY![]() | OMR-RUY-BY |
| Leadtime 2-3 weeks | WBBS-RKCG-9J | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
44D-MA-IN![]() | 44D-MA-IN |
| 26 | 26A-6OI-9H | SOLDERPASTE NO CLEAN 63 37 100GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 100g 3.5 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
RW-1PZ-4N2![]() | RW-1PZ-4N2 |
| Leadtime 2 3 weeks | KOLW4-G9S-NR | SOLDER SPHERES 63 37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | Sn63Pb37 63 37 |