Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3TN 2L0 WQO![]() | 3TN 2L0 WQO |
| Leadtime 2 3 weeks | WP-89WQ-EBE | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
927E XQ4 7Y | 927E XQ4 7Y |
| Leadtime 2 3 weeks | JIV-C1Q-ZZ | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
1M4S-WG9-D7![]() | 1M4S-WG9-D7 |
| Leadtime 2-3 weeks | IDILT-2CB-X0J | SLDR PST NO-CLEAN 63 37 T4 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
24-6337-9703 | 24-6337-9703 |
| Leadtime 2-3 weeks | T594Z-LX-XBJ | SOLDER RMA FLUX 28AWG 63 37 1LB | 285 | Active | Leaded | Wire Solder | Rosin Mildly Activated RMA | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
7017080520![]() | 7017080520 |
| Leadtime 2-3 weeks | JPP-XRF-ZI | SOLDERPASTE WATER SOL SYR 35GM | R500 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
1354298![]() | 1354298 |
| Leadtime 2-3 weeks | DT1-TK-F5 | 63S4 WS200 ACP 500G JAR | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
733002 | 733002 |
| Leadtime 2-3 weeks | C94OT-A0U-HXH | 97SC C511 2% .032DIA 21SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
9ZE-J9Z-5Z![]() | 9ZE-J9Z-5Z |
| 1 | 1JVMK-4L0-92 | 63 37 381 5C 0.81MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
3TN 2L0 WQO![]() | 3TN 2L0 WQO |
| Leadtime 2 3 weeks | P9-IU-BO | 63S4 WS200 ACP PASTE 600G SEMCO | WS200™ | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||||||
TGBK1-07-SIG![]() | TGBK1-07-SIG |
| Leadtime 2 3 weeks | XMST5-9B-JMF | 1240 FPA SILVER SOLDER PASTE | Active | Lead Free | Solder Paste | Ag40Cu30Zn28Ni2 40 30 28 2 | Jar, 28g 1 oz | 1220 ~ 1435°F 660 ~ 780°C | 9 Months Date of Manufacture | |||||||||||||||||||
QP-EII-6M1![]() | QP-EII-6M1 |
| Leadtime 2-3 weeks | LCTUD-U2L1-H2 | SOLDER 58 .015 28AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
FS-QO-0Y![]() | FS-QO-0Y |
| Leadtime 2 3 weeks | E7F-AT-4SV | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
SMD291AX250T4![]() | SMD291AX250T4 |
| Leadtime 2-3 weeks | GV-DF-WWH | SLDR PST NO-CLEAN 63 37 T4 250G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
EWP-H0V1-WDB | EWP-H0V1-WDB |
| Leadtime 2-3 weeks | Y8PTG-92-1OW | SOLDER WATER SOL .062 16AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
P8V-S7-LZ![]() | P8V-S7-LZ | Leadtime 2 3 weeks | IHWH-O2V-ED | SOLDER RA FLUX 23AWG 60 40 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
289398![]() | 289398 |
| Leadtime 2-3 weeks | 0AFLU-M26R-UXJ | 95A 362 5C 1.2MM 0.5KG RLR | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
PPE-ZAWJ-TUO![]() | PPE-ZAWJ-TUO |
| Leadtime 2-3 weeks | SJ-ECH-KTX | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
H5P-HC-42![]() | H5P-HC-42 |
| 6 | 6XO-KQ-XAZ | 63 37 400 2% .024DIA 23SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.024 0.61mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
BJ RO1T IZ![]() | BJ RO1T IZ |
| Leadtime 2 3 weeks | 0F-LCJ-28 | SOLDER SOLID WIRE 16AWG 60 40 | Active | Leaded | Wire Solder | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | Spool, 454g 1 lb | |||||||||||||||||||
Q7N-X6-2H2![]() | Q7N-X6-2H2 |
| 4 | 4HK-MT5-8B | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
386844![]() | 386844 |
| 25 | 25PA-N3-DJ | 63 37 400 2% .015DIA 28SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
SMD291SNL250T5![]() | SMD291SNL250T5 |
| 8 | 8Y3-6B-6RO | SOLDER PASTE SAC305 250G T5 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 250g 9 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
0GD-BP1-89![]() | 0GD-BP1-89 |
| Leadtime 2-3 weeks | ZQX-95-SN | SOLDER PASTE WATER SOL T5 10CC | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
ESJ4-BL2-8R | ESJ4-BL2-8R |
| 1 | 1GSIA-29V-REP | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
9A 55 5DL![]() | 9A 55 5DL |
| Leadtime 2 3 weeks | JJ-EA-W70 | SOLDER NO CLEAN .020 25AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture |