ManufacturerPackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
Supplier Part Number
Manufacturer Part Number
PriceStock
Manufacturer
Description
Packaging
Series
Part Status
Type
Number of Positions ...
Pitch - Mating
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - ...
Contact Finish Thickness ...
Contact Material ...
Housing Material
Operating Temperature ...
ZZ-MQ-8K
ZZ-MQ-8K
8+13.8431
Increments of 8
Leadtime
2-3 weeks		UWV5-98SP-0JCONN SOCKET SIP 30POS TINBulk700 Elevator Strip-Line™ActiveSIP30 1 x 30 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
20-9513-11
20-9513-11
20+5.65098
Increments of 20
Leadtime
2-3 weeks		MY1P-R67-DLICONN IC DIP SOCKET 20POS GOLDBulkLo-PRO®file, 513ActiveDIP, 0.9 22.86mm Row Spacing20 2 x 10 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
APA-314-G-P
APA-314-G-P
1+7.29412
Increments of 1
Leadtime
2-3 weeks		C43HU-UNG-ILADAPTOR PLUG-*Active---------------
U4Z-4IKM-G95
U4Z-4IKM-G95
30+5.53824
Increments of 30
Leadtime
2-3 weeks		R89-JA9-70CONN SOCKET SIP 8POS TINBulk700 Elevator Strip-Line™ActiveSIP8 1 x 8 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough HoleElevatedSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
231-84
231-84
384+1.35981
Increments of 384
Leadtime
2-3 weeks		V6F-CC-HQCONN SOCKET PLCC 84POS GOLDTube-ActivePLCC84 4 x 21 0.050 1.27mm Gold-Phosphor BronzeThrough HoleClosed FrameSolder0.050 1.27mm Gold-Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
116-87-318-41-013101
116-87-318-41-013101
161+3.49397
Increments of 161
Leadtime
2-3 weeks		TW1F6-06RF-SYCONN IC DIP SOCKET 18POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing18 2 x 9 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-83-289-17-000101
510-83-289-17-000101
36+16.613
Increments of 36
9898XY5-DAG-MC3CONN SOCKET PGA 289POS GOLDBulk510ActivePGA289 17 x 17 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
299-43-312-11-001000
299-43-312-11-001000
1+5.41176
10+4.48235
50+3.73529
100+3.36176
250+3.10031
Increments of 1
77L0SU-Y681-347CONN IC DIP SOCKET 12POS GOLDTube299ActiveDIP, 0.3 7.62mm Row Spacing12 2 x 6 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
02-1508-31
02-1508-31
70+1.58824
Increments of 70
Leadtime
2-3 weeks		XHF7-EB-A9HCONN IC DIP SOCKET 2POS GOLDBulk508ActiveDIP, 0.2 5.08mm Row Spacing2 1 x 2 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough Hole-Wire Wrap-Gold10µin 0.25µm BrassPolyamide PA46 , Nylon 4 6-55°C ~ 125°C
12-6621-30
12-6621-30
10+9.1598
Increments of 10
77B83-U3N-61XCONN IC DIP SOCKET 12POS TINBulk6621ActiveDIP, 0.6 15.24mm Row Spacing12 2 x 6 0.100 2.54mm Tin200µin 5.08µm Phosphor BronzeThrough Hole, Bottom Entry; Through BoardClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Phosphor BronzePolyamide PA46 , Nylon 4 6, Glass Filled-55°C ~ 105°C
1825329-1
1825329-1
17280+2.4095
Increments of 17280
Leadtime
2-3 weeks		TV-MJX5-M9510-AG91D20-IES-LF= SPECIAL SIP,-*Active---------------
116-83-304-41-012101
116-83-304-41-012101
1296+0.324382
Increments of 1296
3333C-KWKP-KYCONN IC DIP SOCKET 4POS GOLDTube116ActiveDIP, 0.3 7.62mm Row Spacing4 2 x 2 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
I02-6N-4TS
I02-6N-4TS
780+1.08971
Increments of 780
Leadtime
2-3 weeks		WO4B-4GW-N1CONN TRANSIST TO-5 10POS GOLDBulk917ActiveTransistor, TO-510 Round -GoldFlashBeryllium CopperThrough Hole-Solder-Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-83-181-17-001101
510-83-181-17-001101
48+11.594
Increments of 48
Leadtime
2-3 weeks		HKK6C-9W9X-SN2CONN SOCKET PGA 181POS GOLDBulk510ActivePGA181 17 x 17 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
510-93-175-16-006002
510-93-175-16-006002
50+27.7041
100+18.2446
250+12.625
Increments of 50
Leadtime
2-3 weeks		CY-59-22CONN SOCKET PGA 175POS GOLDBulk510ActivePGA175 16 x 16 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough HoleOpen FrameSolder0.100 2.54mm --Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
A48-LC-TR
A48-LC-TR
99OUJ-AP0M-EVZCONN IC DIP SOCKET 48POS TINTube-ObsoleteDIP, 0.6 15.24mm Row Spacing48 2 x 24 0.100 2.54mm Tin-Phosphor BronzeThrough HoleOpen FrameSolder0.100 2.54mm Tin-Phosphor BronzePolybutylene Terephthalate PBT -55°C ~ 85°C
1109800-26
1109800-26
5+16.7216
Increments of 5
Leadtime
2-3 weeks		XS-FIO-RE4CONN IC DIP SOCKET 26POS GOLDBulkCorrect-A-Chip® 1109800ActiveDIP, 0.3 7.62mm Row Spacing26 2 x 13 0.100 2.54mm Gold10µin 0.25µm Beryllium CopperThrough HoleProgrammableSolder0.100 2.54mm Tin-Lead200µin 5.08µm BrassPolyamide PA46 , Nylon 4 6, Glass Filled-
714-43-130-31-018000
714-43-130-31-018000
1+7.40196
10+6.87157
100+5.99069
500+5.46212
1000+5.02163
Increments of 1
Leadtime
2-3 weeks		V69-QGY-SACONN SOCKET SIP 30POS GOLDBulk714ActiveSIP30 1 x 30 0.100 2.54mm Gold30µin 0.76µm Beryllium CopperThrough Hole-Solder0.100 2.54mm Gold30µin 0.76µm Brass AlloyPolycyclohexylenedimethylene Terephthalate PCT , Polyester-55°C ~ 125°C
2M RD6 DZ
2M RD6 DZ
1+11.451
Increments of 1
Leadtime
2 3 weeks		FTTL-B2-6JADAPTOR PLUG *Active
1-822473-3
1-822473-3
55H-IQ-99CONN SOCKET PLCC 32POS TINTube-ObsoletePLCC32 2 x 7, 2 x 9 0.050 1.27mm Tin80µin 2.03µm Phosphor BronzeThrough HoleClosed FrameSolder0.050 1.27mm Tin80µin 2.03µm Phosphor BronzeThermoplastic-
116-87-632-41-012101
116-87-632-41-012101
208+2.42199
Increments of 208
Leadtime
2-3 weeks		WPM-JL8K-CCCONN IC DIP SOCKET 32POS GOLDTube116ActiveDIP, 0.6 15.24mm Row Spacing32 2 x 16 0.100 2.54mm GoldFlashBeryllium CopperThrough HoleElevated, Open FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
48-3575-10
48-3575-10
6+15.0588
Increments of 6
Leadtime
2-3 weeks		K4-HH-6UCONN IC DIP SOCKET ZIF 48POS TINBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing48 2 x 24 0.100 2.54mm Tin200µin 5.08µm Beryllium CopperThrough HoleClosed FrameSolder0.100 2.54mm Tin200µin 5.08µm Beryllium CopperPolyphenylene Sulfide PPS , Glass Filled-
299-83-630-10-002101
299-83-630-10-002101
70+7.82017
Increments of 70
Leadtime
2-3 weeks		SX-61D9-PIKCONN IC DIP SOCKET 30POS GOLDTube299ActiveDIP, 0.6 15.24mm Row Spacing30 2 x 15 0.100 2.54mm Gold29.5µin 0.75µm Beryllium CopperThrough Hole, Right Angle, HorizontalClosed FrameSolder0.100 2.54mm Tin-BrassPolycyclohexylenedimethylene Terephthalate PCT , Polyester, Glass Filled-55°C ~ 125°C
A-CCS84-Z-SM-R
A-CCS84-Z-SM-R
Leadtime
2-3 weeks		RV-ZT-B1OCONN SOCKET PLCC 84POS TINTube-ObsoletePLCC84 4 x 21 0.050 1.27mm Tin150µin 3.81µm Phosphor BronzeSurface MountClosed FrameSolder0.050 1.27mm Tin150µin 3.81µm Phosphor BronzePolybutylene Terephthalate PBT , Glass Filled-55°C ~ 105°C
44-3572-16
44-3572-16
2+37.5
Increments of 2
Leadtime
2-3 weeks		MH3-YWE-ODCONN IC DIP SOCKET ZIF 44POSBulk57ActiveDIP, ZIF ZIP , 0.3 7.62mm Row Spacing44 2 x 22 0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelThrough HoleClosed FrameSolder0.100 2.54mm Nickel Boron50µin 1.27µm Beryllium NickelPolyphenylene Sulfide PPS , Glass Filled-