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| Manufacturer | Chip Quik Inc. |
| Series | |
| Part Status | Active |
| Process | Lead Free |
| Type | Wire Solder |
| Flux Type | No Clean |
| Composition | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 |
| Wire Gauge | 24 AWG, 25 SWG |
| Diameter | 0.02 0.51mm |
| Core Size | 0.022 |
| Form | Spool, 57g 2 oz |
| Melting Point | 423 ~ 428°F 217 ~ 220°C |
| Shelf Life | |
| Standard Package | 1 |
SOLDER PASTE SAC305 T5 500G
SOLDER WATER SOL 23AWG 63 37 1LB
SOLDER RA 60 40 .025 1 2 LB
SOLDER WIRE NO-CLEAN 63 37 1OZ.
SLD WIRE NO-CLEAN 96.5 3 .5 4OZ.
SOLDER PASTE HF 212 600GRAM JA
96S ARAX 4C 1.6MM 0.5KG AM
63 37 381 5C 0.56MM 0.25KG AM
96SC C511 5C 0.56MM 0.25KG
SOLDER RMA FLUX 21AWG 63 37 1LB
SOLDER NO-CLEAN ANTISTAT .020
SOLDER SPHERES 63 37 .030 DIAM
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