Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Q2E3V-PGZW-L4R![]() | Q2E3V-PGZW-L4R |
| 1 | 1NOF3-WQU-QA | SOLDERPASTE WATER SOLUABL 1000GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Cartridge, 1000g 35 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
OLN-IOJ-65K![]() | OLN-IOJ-65K |
| Leadtime 2-3 weeks | G51MN-8A-8RY | 63 37 400 3% .032DIA 21SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
X5-MS1-SN![]() | X5-MS1-SN | Leadtime 2-3 weeks | N8E-FY-9YV | SOLDER WATER SOLUBLE .031 X 20 | - | Obsolete | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
LSNF8-J2-ZGD![]() | LSNF8-J2-ZGD |
| Leadtime 2-3 weeks | ZG5P-PQ-EY | SOLDER 63 37 11AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | - | 0.125 3.18mm | - | - | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
17553LF![]() | 17553LF |
| Leadtime 2-3 weeks | SZVNI-56-9LN | SOLDER 100G 1.2MM LEAD FREE | - | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 16 AWG, 18 SWG | 0.047 1.19mm | - | Spool, 100g 3.5 oz | 440°F 227°C | 5 Years Date of Manufacture | ||||||||||||||
ARR-JXDQ-HW![]() | ARR-JXDQ-HW |
| 17 | 17P9-90-C8K | 99C C511 3C 1.63MM 1KG AM | C511™ | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
TNP-JG-QWY![]() | TNP-JG-QWY |
| Leadtime 2 3 weeks | MA5-5DE-IPR | SOLDER PASTE SN63 PB37 250G | Active | Leaded | Solder Paste | No Clean | Sn63Pb37 63 37 | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||||||
W5MHM-YPL8-W4B![]() | W5MHM-YPL8-W4B |
| Leadtime 2-3 weeks | T4-NMKF-UIC | SOLDER PASTE SAC305 T5 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | - | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
64S-DK-WE![]() | 64S-DK-WE | 5 | 5BY3-E5-WJ | SOLDER 63 37 NOCLEAN .05DIA .5LB | 4860 | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.05 1.27mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | |||||||||||||||
SMD2215-25000![]() | SMD2215-25000 | Leadtime 2-3 weeks | GL-XN-T0X | SOLDER SPHERES SN63 PB37 .030 D | * | Active | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | - | |||||||||||||||
4894-454G![]() | 4894-454G |
| Leadtime 2-3 weeks | ESX-XTI-RAA | SOLDER RA 60 40 .025 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
4875-454G![]() | 4875-454G |
| Leadtime 2-3 weeks | L4VUE-YY-2X | SOLDER NO-CLEAN 60 40 1 LB | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
16-6040-0050![]() | 16-6040-0050 |
| Leadtime 2-3 weeks | XROB-B2-3P | SOLDER 60 40 18AWG 5LB | Solid Core Wire | Active | Leaded | Wire Solder | - | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | - | - | - | 36 Months Date of Manufacture | ||||||||||||||
7020020510![]() | 7020020510 |
| 83 | 83Y1-VG6-WY | SOLDERPASTE WATER SOLUABLE 500GM | R560 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 500g 17 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
24-9574-6401![]() | 24-9574-6401 |
| Leadtime 2-3 weeks | AQOE-EZ9-D5 | SOLDER 66 .020 25AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
ESJ4-BL2-8R | ESJ4-BL2-8R |
| Leadtime 2-3 weeks | FS0FS-2T1-FM | SOLDER LF SAC305 NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
24-6337-8814 | 24-6337-8814 |
| 5 | 5SPLP-DVAU-DSA | SOLDER NO-CLEAN 18AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
1769647![]() | 1769647 |
| Leadtime 2-3 weeks | L2G-LM-V4 | SOLDER PASTE HF 212 - 600GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
23-6337-0027![]() | 23-6337-0027 | 4 | 4Y-JM-CZZ | SOLDER RA FLUX 21AWG 63 37 .5LB | 44 | Obsolete | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 227g 1 2 lb | 212°F 100°C | 36 Months Date of Manufacture | |||||||||||||||
OS-S031![]() | OS-S031 | Leadtime 2-3 weeks | M9O-HW7S-EG | SOLDER NO-CLEAN .031 X 20 | - | Obsolete | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | - | 361°F 183°C | No Shelf Life | |||||||||||||||
JWE-ZE-D1![]() | JWE-ZE-D1 |
| Leadtime 2-3 weeks | XL2-QK-10 | SOLDER 66 .020 24AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn99.3Cu0.7 99.3 0.7 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
7TA-BW-EI8![]() | 7TA-BW-EI8 |
| 8 | 8OW-H9FO-TD | SOLDER RA 60 40 .062 1 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 14 AWG, 16 SWG | 0.062 1.57mm | 0.022 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
4876-227G![]() | 4876-227G |
| Leadtime 2-3 weeks | APBLY-59-FB | SOLDER 60 40 NOCLEAN .04DIA .5LB | 4870 | Active | Leaded | Wire Solder | No-Clean | Sn60Pb40 60 40 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
UR-LQ-HR![]() | UR-LQ-HR |
| 7 | 7XDO-59-05J | LOCTITE GC 10 SAC305T3 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 12 Months Date of Manufacture | ||||||||||||||
24-9574-1406![]() | 24-9574-1406 |
| 1 | 1A3-SD-HTB | SOLDER 66 .025 23AWG 1LB | 48 | Active | Lead Free | Wire Solder | Rosin Activated RA | Sn99.3Cu0.7 99.3 0.7 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture |