Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
7019030810![]() | 7019030810 |
| 4 | 4O0SG-BUJI-DR | SOLDER 500G JAR,SN96.5 AG3.0 | R520A | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 500g 17 oz | 423 ~ 428°F 217 ~ 220°C | 4 Months Date of Manufacture Refrigerated | ||||||||||||||
733024![]() | 733024 |
| 49 | 49VKK-6LU-27 | 96SC C400 3C 0.56MM 0.25KG.022 | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
T3T4 GC 96![]() | T3T4 GC 96 |
| Leadtime 2 3 weeks | KIDP8-U9-1HG | SOLDER WIRE NO CLEAN 63 37 2OZ. | Active | Leaded | Wire Solder | No Clean, Water Soluble | Sn63Pb37 63 37 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 57g 2 oz | 361°F 183°C | ||||||||||||||||
ER-CF38-VNQ![]() | ER-CF38-VNQ |
| Leadtime 2-3 weeks | A8-CM2-AP | SOLDER NO-CLEAN .020 25AWG 1LB | 275 | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
ZVS5W-9Q6D-GE![]() | ZVS5W-9Q6D-GE |
| 9 | 9T-MS1G-OK | 1240-FPA SILVER SOLDER PASTE -- | - | Active | Lead Free | Solder Paste | - | Ag40Cu30Zn28Ni2 40 30 28 2 | - | - | - | Jar, 28g 1 oz | 1220 ~ 1435°F 660 ~ 780°C | 9 Months Date of Manufacture | ||||||||||||||
386820![]() | 386820 |
| Leadtime 2-3 weeks | 0SL-PW-1C | 63 37 HYDRO-X 2% .022DIA 24SWG | Hydro-X | Active | Leaded | Wire Solder | Water Soluble | Sn63Pb37 63 37 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
XZJQ-N0S-MKT | XZJQ-N0S-MKT |
| Leadtime 2 3 weeks | JO4PL-F3F-6ON | SOLDER PASTE NO CLEAN SAC305 T3 | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||||
SMDSW.031 2OZ![]() | SMDSW.031 2OZ |
| Leadtime 2-3 weeks | B2BGZ-HP-Y6 | SOLDER WIRE NO-CLEAN 63 37 2OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 361°F 183°C | - | ||||||||||||||
IZ7-6W-2C6![]() | IZ7-6W-2C6 |
| Leadtime 2-3 weeks | GS64-36-6AU | SOLDERPASTE NO CLEAN 63 37 35GM | R276 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
TQD-5P9-2SW | TQD-5P9-2SW |
| Leadtime 2-3 weeks | HF-KJ0-WI | SOLDER PASTE NO-CLEAN 63 37 T3 5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | - | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
XLQVG-42-8R4![]() | XLQVG-42-8R4 | 360 | 360-17E6-W1P | SOLDER SOLID WIRE 25AWG 60 40 | - | Obsolete | Leaded | Wire Solder | - | Sn60Pb40 60 40 | 24 AWG, 25 SWG | 0.02 0.51mm | - | Spool, 454g 1 lb | - | - | |||||||||||||||
SMD291AX50T3![]() | SMD291AX50T3 |
| Leadtime 2-3 weeks | LD0JJ-GM-W2 | SLDR PASTE NO-CLN SN63 PB37 50G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Jar, 50g 1.8 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
SMDSW.031 2OZ![]() | SMDSW.031 2OZ |
| Leadtime 2-3 weeks | XN5SH-Q9GQ-44 | SOLDER WIRE NO-CLEAN 63 37 2OZ. | - | Active | Leaded | Wire Solder | No-Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 57g 2 oz | 361°F 183°C | - | ||||||||||||||
24-6337-9710![]() | 24-6337-9710 |
| 71 | 71W37-FV6-XP | SOLDER 63 37 21AWG 1LB | 285 | Active | Leaded | Wire Solder | Rosin Mildly Activated RMA | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
B6-8P-JKV![]() | B6-8P-JKV |
| Leadtime 2-3 weeks | UQYQK-4NDG-0H | SOLDER RA 60 40 25AWG 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.033 | Spool, 454g 1 lb | 361 ~ 374°F 183 ~ 190°C | 36 Months Date of Manufacture | ||||||||||||||
XML-38Q-746![]() | XML-38Q-746 |
| Leadtime 2-3 weeks | COOO-JR-Y0 | SOLDER 63 37 28AWG 1LB | 275 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 28 AWG, 30 SWG | 0.015 0.39mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
49500-454G | 49500-454G |
| Leadtime 2-3 weeks | DTW-HW-XW6 | SOLDER WIRE NO CLEAN 0.032 DIA | 49500 | Active | Lead Free | Wire Solder | No-Clean | Sn99.5Cu0.5 99.5 0.5 | 21 AWG, 22 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 442°F 228°C | No Shelf Life | ||||||||||||||
N5E8T-4GC-M3![]() | N5E8T-4GC-M3 |
| 4 | 4YEIU-G4VT-C4 | SOLDER PASTE NO-CLEAN 63 37 5CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 5cc, 15g 0.5 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
GST-EM-XD![]() | GST-EM-XD |
| Leadtime 2-3 weeks | IG-MMGI-CD | 97SC C511 2% .022DIA 23AWG 24SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | ||||||||||||||
Z20 UC BTW![]() | Z20 UC BTW |
| Leadtime 2 3 weeks | IY0ZC-G0E1-HNO | 63 37 CRYSL 502 3% .032DIA 21SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
386857![]() | 386857 |
| 7 | 7G-HVUQ-LJF | 63 37 400 3% .032DIA 21SWG | C400 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.032 0.81mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
1M4S-WG9-D7![]() | 1M4S-WG9-D7 |
| Leadtime 2-3 weeks | HWHK-4MY-VRY | SLDR PST NO-CLEAN 63 37 T4 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 63 37 | - | - | - | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
395465![]() | 395465 |
| Leadtime 2-3 weeks | BFX9U-TOBY-CHE | 63 37 CRYSL 502 3% .064DIA 16SWG | C502 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
SMD291SNL50T3![]() | SMD291SNL50T3 |
| 3 | 3JL3I-9TF-EI | SLDR PASTE NO-CLN SAC305 50G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | - | - | - | Jar, 50g 1.8 oz | 423 ~ 428°F 217 ~ 220°C | 6 Months Date of Manufacture Refrigerated | ||||||||||||||
9N8-RC-U0![]() | 9N8-RC-U0 |
| Leadtime 2-3 weeks | LTK5V-IU-1I | 97SC C511 2% .022DIA 23AWG 24SWG | C511™ | Active | Lead Free | Wire Solder | No-Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 23 AWG, 24 SWG | 0.022 0.56mm | 0.022 | Spool, 227g 1 2 lb | 423 ~ 428°F 217 ~ 220°C | No Shelf Life |