Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
1179441![]() | 1179441 |
| Leadtime 2-3 weeks | Multicore | 63/37 381 5C 0.81MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||
1042100![]() | 1042100 |
| Leadtime 2-3 weeks | Multicore | 60/40C511 3C 1.63MM AF 2.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||
1042097![]() | 1042097 |
| Leadtime 2-3 weeks | Multicore | 96S ARAX 4C 1.6MM 0.5KG AM | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||
1993881![]() | 1993881 |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 10 SAC305T4 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 500g (17 oz) | 423 ~ 428°F (217 ~ 220°C) | 12 Months (Date of Manufacture) | ||||||
SMDSWLTLFP32![]() | SMDSWLTLFP32 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER WIRE LOW TEMP 42/57/1 32' | - | Active | Lead Free | Wire Solder | - | Sn42Bi57Ag1 (42/57/1) | - | 0.03" (0.76mm) | - | - | 281°F (138°C) | No Shelf Life | ||||||
SMDLTLFP10![]() | SMDLTLFP10 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LOW TEMP 10CC W/TIP | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | - | - | Syringe, 15g (0.5 oz) | 281°F (138°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMDLTLFP50T3![]() | SMDLTLFP50T3 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PASTE NO-CLN SN42/BI58 50G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | - | - | Jar, 50g (1.8 oz) | 281°F (138°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291SNL50T3![]() | SMD291SNL50T3 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PASTE NO-CLN SAC305 50G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 50g (1.8 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291AX50T3![]() | SMD291AX50T3 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PASTE NO-CLN SN63/PB37 50G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Jar, 50g (1.8 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
4860P-35G![]() | 4860P-35G |
| Leadtime 2-3 weeks | MG Chemicals | LEADED NO CLEAN SOLDER PASTE | 4860 | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Syringe, 35g (1.18 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
4900P-25G![]() | 4900P-25G |
| Leadtime 2-3 weeks | MG Chemicals | LEAD FREE NO CLEAN SOLDER PASTE | 4900 | Active | Lead Free | Solder Paste | No-Clean | Sn96.3Ag3.0Cu0.7 (96.3/3/0.7) | - | - | - | Syringe, 25g (0.9 oz) | 423 ~ 428°F (217 ~ 220°C) | No Shelf Life | ||||||
2470120655![]() | 2470120655 |
| Leadtime 2-3 weeks | Kester Solder | OR-421 FLUX-CORED WIRESN99.3CU.7 | OR421 | Active | Lead Free | Wire Solder | Water Soluble | Sn99.3Cu0.7 (99.3/0.7) | 14 AWG, 16 SWG | 0.062" (1.57mm) | 0.022 | Spool, 454g (1 lb) | 440°F (227°C) | 36 Months (Date of Manufacture) | ||||||
1769647![]() | 1769647 |
| Leadtime 2-3 weeks | Multicore | SOLDER PASTE HF 212 - 600GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||
1769646![]() | 1769646 |
| Leadtime 2-3 weeks | Multicore | SOLDER PASTE HF 212 - 500GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||
SMD2060![]() | SMD2060 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 .030 DIAM | SMD2 | Active | Lead Free | Solder Sphere | - | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | - | - | - | ||||||
SMD2055![]() | SMD2055 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 .025 DIAM | SMD2 | Active | Lead Free | Solder Sphere | - | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | - | - | - | ||||||
SMD2050![]() | SMD2050 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 .024 DIAM | SMD2 | Active | Lead Free | Solder Sphere | - | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | - | - | - | ||||||
SMD2040![]() | SMD2040 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES SAC305 .020 DIAM | SMD2 | Active | Lead Free | Solder Sphere | - | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | - | - | - | ||||||
SMD2215![]() | SMD2215 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63/37 .030 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 (63/37) | - | - | - | - | - | - | ||||||
SMD2205![]() | SMD2205 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63/37 .025 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 (63/37) | - | - | - | - | - | - | ||||||
SMD2200![]() | SMD2200 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63/37 .024 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 (63/37) | - | - | - | - | - | - | ||||||
SMD2190![]() | SMD2190 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63/37 .020 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 (63/37) | - | - | - | - | - | - | ||||||
SMD2165![]() | SMD2165 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER SPHERES 63/37 .012 DIAM | SMD2 | Active | Leaded | Solder Sphere | - | Sn63Pb37 (63/37) | - | - | - | - | - | - | ||||||
SMD291AX10T5![]() | SMD291AX10T5 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO CLEAN T5 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Syringe, 10cc, 35g (1.2 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291SNL10T5![]() | SMD291SNL10T5 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LF T5 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Syringe, 10cc, 35g (1.2 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) |