Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SMD291SNL500T4C![]() | SMD291SNL500T4C |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SAC305 T4 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | - | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291AX500T5C![]() | SMD291AX500T5C |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE 63/37 T5 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | - | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291AX500T4C![]() | SMD291AX500T4C |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE 63/37 T4 500G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | - | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
SMDLTLFP500T3C | SMDLTLFP500T3C |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LOW TEMP T3 500G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | - | - | - | 281°F (138°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291SNL500T3C | SMD291SNL500T3C |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN SAC305 T3 | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | - | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291AX500T3C | SMD291AX500T3C |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE NO-CLEAN 63/37 T3 5 | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | - | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
2023628![]() | 2023628 |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 10 SAC305T3 885 52U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 500g (17 oz) | 423 ~ 428°F (217 ~ 220°C) | 12 Months (Date of Manufacture) | ||||||
2023641![]() | 2023641 |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 10 SAC305T3 885 53U | LOCTITE® GC 10 | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Cartridge, 600g (21 oz) | 423 ~ 428°F (217 ~ 220°C) | 12 Months (Date of Manufacture) | ||||||
2041005![]() | 2041005 |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 3W SAC305T3 895V 52U | LOCTITE® GC 3W | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 500g (17 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) | ||||||
2041006![]() | 2041006 |
| Leadtime 2-3 weeks | LOCTITE | LOCTITE GC 3W SAC305T3 895V 53U | LOCTITE® GC 3W | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Cartridge, 600g (21 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) | ||||||
SMDLTLFP15T4![]() | SMDLTLFP15T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | TWO PART MIX SOLDER PASTE | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | - | - | Jar, 15g (0.5 oz) | 281°F (138°C) | 24 Months (Date of Manufacture) (Unmixed) | ||||||
SMD291SNL15T4![]() | SMD291SNL15T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE TWO PART MIX | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 15g (0.5 oz) | 423 ~ 428°F (217 ~ 220°C) | 24 Months (Date of Manufacture) (Unmixed) | ||||||
SMD291SNL60T4 | SMD291SNL60T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SN96.5/AG3.0/CU0.5 2-PRT MIX 60G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 15g (0.5 oz) | 423 ~ 428°F (217 ~ 220°C) | 24 Months (Date of Manufacture) (Unmixed) | ||||||
SMDLTLFP60T4 | SMDLTLFP60T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SN42/BI57.6/AG0.4 2-PART MIX 60G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | - | - | - | 281°F (138°C) | 24 Months (Date of Manufacture) (Unmixed) | ||||||
SMDLTLFP250T4![]() | SMDLTLFP250T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LOW TEMP T4 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | - | - | Jar, 250g (9 oz) | 281°F (138°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMDLTLFP10T4![]() | SMDLTLFP10T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE LOW TEMP T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | - | - | Syringe, 15g (0.5 oz) | 281°F (138°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD4300SNL250T4![]() | SMD4300SNL250T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST WATR SOL SAC305 T4 250G | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 250g (9 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD4300SNL10T4![]() | SMD4300SNL10T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST WATR SOL SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | Water Soluble | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Syringe, 10cc, 35g (1.2 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD4300AX250T4![]() | SMD4300AX250T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST WATR SOL 63/37 T4 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 (63/37) | - | - | - | Jar, 250g (9 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD4300AX10T4![]() | SMD4300AX10T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST WATR SOL 63/37 T4 10CC | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 (63/37) | - | - | - | Syringe, 10cc, 35g (1.2 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291SNL250T4![]() | SMD291SNL250T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST NO-CLEAN SAC305 T4 250G | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Jar, 250g (9 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291SNL10T4![]() | SMD291SNL10T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST NO-CLEAN SAC305 T4 10CC | - | Active | Lead Free | Solder Paste | No-Clean | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | - | - | - | Syringe, 10cc, 35g (1.2 oz) | 423 ~ 428°F (217 ~ 220°C) | 6 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291AX250T4![]() | SMD291AX250T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST NO-CLEAN 63/37 T4 250G | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Jar, 250g (9 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
SMD291AX10T4![]() | SMD291AX10T4 |
| Leadtime 2-3 weeks | Chip Quik Inc. | SLDR PST NO-CLEAN 63/37 T4 10CC | - | Active | Leaded | Solder Paste | No-Clean | Sn63Pb37 (63/37) | - | - | - | Syringe, 10cc, 35g (1.2 oz) | 361°F (183°C) | 12 Months (Date of Manufacture) (Refrigerated) | ||||||
17552LF![]() | 17552LF |
| Leadtime 2-3 weeks | Aven Tools | SOLDER IN TUBE 1.2MM LEAD FREE | - | Active | Lead Free | Wire Solder | Rosin Activated (RA) | Sn99.3Cu0.7 (99.3/0.7) | 18 AWG, 19 SWG | 0.047" (1.19mm) | - | Tube, 20g (0.7 oz) | 360°F (180°C) | 5 Years (Date of Manufacture) |