Supplier Part Number | Manufacturer Part Number | Price | Stock | Manufacturer | Description | Series | Part Status | Process | Type | Flux Type | Composition | Wire Gauge | Diameter | Core Size | Form | Melting Point | Shelf Life | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
6HT3S-KAGN-E1J | 6HT3S-KAGN-E1J |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER LF SN100E NO CLEAN | * | Active | - | - | - | - | - | - | - | - | - | - | ||||||||||||||
9OR VY 7J![]() | 9OR VY 7J |
| Leadtime 2 3 weeks | Chip Quik Inc. | SLD WIRE NO CLEAN 96.5 3 .5 1OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 28g 1 oz | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
GER 2JY PP4![]() | GER 2JY PP4 |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER PASTE TWO PART MIX | Active | Lead Free | Solder Paste | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | Jar, 15g 0.5 oz | 423 ~ 428°F 217 ~ 220°C | 24 Months Date of Manufacture Unmixed | ||||||||||||||||||
ZT5O5-58T-UF | ZT5O5-58T-UF |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 63 37 1 LB | 4880 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.022 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
58-T4-DP![]() | 58-T4-DP |
| Leadtime 2-3 weeks | Chip Quik Inc. | SOLDER PASTE SN63 PB37 250G | - | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | - | - | - | Jar, 250g 9 oz | 361°F 183°C | 12 Months Date of Manufacture Refrigerated | ||||||||||||||
32U2K E43C 844![]() | 32U2K E43C 844 |
| Leadtime 2 3 weeks | Chip Quik Inc. | SOLDER WIRE NO CLEAN 63 37 1OZ. | Active | Leaded | Wire Solder | No Clean, Water Soluble | Sn63Pb37 63 37 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 28g 1 oz | 361°F 183°C | ||||||||||||||||
YS 6R LF![]() | YS 6R LF |
| Leadtime 2 3 weeks | Multicore | 63 37 CRYSL 502 3% .064DIA 16SWG | C502 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 14 AWG, 16 SWG | 0.064 1.63mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | No Shelf Life | ||||||||||||||
GM NJ F7X![]() | GM NJ F7X |
| Leadtime 2 3 weeks | Kester Solder | SOLDERPASTE WATER SOL SYR 35GM | R500 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||
OTN IB S7![]() | OTN IB S7 |
| Leadtime 2 3 weeks | Kester Solder | SOLDERPASTE WATER SOL SYR 35GM | R500 | Active | Leaded | Solder Paste | Water Soluble | Sn63Pb37 63 37 | Syringe, 10cc, 35g 1.2 oz | 361°F 183°C | 6 Months Date of Manufacture Refrigerated | |||||||||||||||||
ZUMS P5E QJ![]() | ZUMS P5E QJ |
| Leadtime 2 3 weeks | Multicore | 97SC C511 2% .015DIA 28SWG | C511™ | Active | Lead Free | Wire Solder | Rosin Mildly Activated RMA | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 26 AWG, 27 SWG | 0.015 0.39mm | 0.022 | 423 ~ 428°F 217 ~ 220°C | No Shelf Life | |||||||||||||||
E2D NZ6 99W![]() | E2D NZ6 99W |
| Leadtime 2 3 weeks | Multicore | 63 37 370 5C 0.38MM 0.25KG.015 | * | Active | ||||||||||||||||||||||||
26-U2X-AUC![]() | 26-U2X-AUC |
| Leadtime 2-3 weeks | MG Chemicals | SOLDER RA 60 40 .032 1 2 LB | 4890 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn60Pb40 60 40 | 22 AWG, 23 SWG | 0.032 0.81mm | 0.022 | Spool, 227g 1 2 lb | 361 ~ 374°F 183 ~ 190°C | No Shelf Life | ||||||||||||||
IUAP V5UE GGG![]() | IUAP V5UE GGG |
| Leadtime 2 3 weeks | Multicore | 63 37 381 5C 0.56MM 0.25KG AM | * | Active | ||||||||||||||||||||||||
VQ5Q-LT-LPE![]() | VQ5Q-LT-LPE |
| Leadtime 2-3 weeks | Kester Solder | SOLDER WATER SOL .031 21AWG 1LB | 331 | Active | Lead Free | Wire Solder | Water Soluble | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
I07-59D-LC![]() | I07-59D-LC |
| Leadtime 2-3 weeks | Multicore | SOLDER PASTE HF 212 - 500GRAM JA | HF212 | Active | - | - | - | - | - | - | - | - | - | No Shelf Life | ||||||||||||||
TR56 ZD6 KNP![]() | TR56 ZD6 KNP |
| Leadtime 2 3 weeks | Kester Solder | SOLDER RA FLUX 23AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
87Z EO4S HA | 87Z EO4S HA |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN 18AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
RUUL-DM4T-9R | RUUL-DM4T-9R |
| Leadtime 2-3 weeks | Kester Solder | SOLDER NO-CLEAN 19AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No-Clean | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
EZ P9UB XZ | EZ P9UB XZ |
| Leadtime 2 3 weeks | Chip Quik Inc. | SLD WIRE NO CLEAN 96.5 3 .5 2OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 24 AWG, 25 SWG | 0.02 0.51mm | 0.022 | Spool, 57g 2 oz | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
PZ1W-BF-QU | PZ1W-BF-QU |
| Leadtime 2-3 weeks | Kester Solder | SOLDER RA 19AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 18 AWG, 19 SWG | 0.04 1.02mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
ZBN EOT SAU![]() | ZBN EOT SAU |
| Leadtime 2 3 weeks | Kester Solder | SOLDER 66 .031 22AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn99.3Cu0.7 99.3 0.7 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.033 | Spool, 454g 1 lb | 440°F 227°C | 36 Months Date of Manufacture | ||||||||||||||
GBYU PFR 22![]() | GBYU PFR 22 |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN .050 18AWG 1LB | 275 | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 16 AWG, 18 SWG | 0.05 1.27mm | 0.022 | Spool, 454g 1 lb | 423 ~ 428°F 217 ~ 220°C | 36 Months Date of Manufacture | ||||||||||||||
SD4G U1N OF![]() | SD4G U1N OF |
| Leadtime 2 3 weeks | Kester Solder | SOLDER NO CLEAN 23AWG 63 37 1LB | 245 | Active | Leaded | Wire Solder | No Clean | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.011 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture | ||||||||||||||
MW SO U7U | MW SO U7U |
| Leadtime 2 3 weeks | Chip Quik Inc. | SLD WIRE NO CLEAN 96.5 3 .5 4OZ. | Active | Lead Free | Wire Solder | No Clean | Sn96.5Ag3.0Cu0.5 96.5 3 0.5 | 20 AWG, 21 SWG | 0.031 0.79mm | 0.022 | Spool, 113g 1 4 lb | 423 ~ 428°F 217 ~ 220°C | ||||||||||||||||
X4 VVV 2NV![]() | X4 VVV 2NV |
| Leadtime 2 3 weeks | Kester Solder | SOLDER RA FLUX 23AWG 63 37 1LB | 44 | Active | Leaded | Wire Solder | Rosin Activated RA | Sn63Pb37 63 37 | 22 AWG, 23 SWG | 0.025 0.64mm | 0.033 | Spool, 454g 1 lb | 361°F 183°C | 36 Months Date of Manufacture |